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Class Information
Number: 438/745
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching
Description: Processes wherein the chemical etchant is in a liquid state when brought into contact with the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6475399 |
Method for fabricating a stencil mask |
Nov. 5, 2002 |
| 6475966 |
Plasma etching residue removal |
Nov. 5, 2002 |
| 6472331 |
Method and apparatus for measuring and dispensing a wafer etchant |
Oct. 29, 2002 |
| 6472332 |
Surface micromachined structure fabrication methods for a fluid ejection device |
Oct. 29, 2002 |
| 6468902 |
Semiconductor device and its manufacturing method |
Oct. 22, 2002 |
| 6468904 |
RPO process for selective CoSix formation |
Oct. 22, 2002 |
| 6468907 |
Method of manufacturing a copper wiring in a semiconductor device |
Oct. 22, 2002 |
| 6468911 |
Method of chemical/mechanical polishing of the surface of semiconductor device |
Oct. 22, 2002 |
| 6468913 |
Ready-to-use stable chemical-mechanical polishing slurries |
Oct. 22, 2002 |
| 6468914 |
Method of forming gate electrode in semiconductor device |
Oct. 22, 2002 |
| 6468917 |
Method for modifying a C4 semiconductor device |
Oct. 22, 2002 |
| 6468919 |
Method of making a local interconnect in an embedded memory |
Oct. 22, 2002 |
| 6465351 |
Method of forming a capacitor lower electrode using a CMP stopping layer |
Oct. 15, 2002 |
| 6465352 |
Method for removing dry-etching residue in a semiconductor device fabricating process |
Oct. 15, 2002 |
| 6465403 |
Silicate-containing alkaline compositions for cleaning microelectronic substrates |
Oct. 15, 2002 |
| 6461534 |
Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
Oct. 8, 2002 |
| 6461955 |
Yield improvement of dual damascene fabrication through oxide filling |
Oct. 8, 2002 |
| 6461965 |
Method for effecting a finishing operation on a semiconductor workpiece |
Oct. 8, 2002 |
| 6461978 |
Method of manufacturing a substrate for an electronic device by using etchant and electronic device having the substrate |
Oct. 8, 2002 |
| 6458692 |
Method of forming contact plug of semiconductor device |
Oct. 1, 2002 |
| 6458705 |
Method for forming via-first dual damascene interconnect structure |
Oct. 1, 2002 |
| 6458710 |
Process for forming uniform multiple contact holes |
Oct. 1, 2002 |
| 6458711 |
Self-aligned silicide process |
Oct. 1, 2002 |
| 6455433 |
Method for forming square-shouldered sidewall spacers and devices fabricated |
Sep. 24, 2002 |
| 6455479 |
Stripping composition |
Sep. 24, 2002 |
| 6451223 |
Thinner composition and methods and systems for using the thinner composition |
Sep. 17, 2002 |
| 6451451 |
Mask, and method and apparatus for making it |
Sep. 17, 2002 |
| 6451696 |
Method for reclaiming wafer substrate and polishing solution compositions therefor |
Sep. 17, 2002 |
| 6451697 |
Method for abrasive-free metal CMP in passivation domain |
Sep. 17, 2002 |
| 6451704 |
Method for forming PLDD structure with minimized lateral dopant diffusion |
Sep. 17, 2002 |
| 6451707 |
Method of removing reaction product due to plasma ashing of a resist pattern |
Sep. 17, 2002 |
| 6447634 |
Method and apparatus for selective removal of material from wafer alignment marks |
Sep. 10, 2002 |
| 6448186 |
Method and apparatus for use of hydrogen and silanes in plasma |
Sep. 10, 2002 |
| 6444581 |
AB etch endpoint by ABFILL compensation |
Sep. 3, 2002 |
| 6444589 |
Method and apparatus for etching silicon |
Sep. 3, 2002 |
| 6444590 |
Semiconductor processing methods, methods of forming hemispherical grain polysilicon, methods of forming capacitors, and methods of forming wordlines |
Sep. 3, 2002 |
| 6440871 |
Gas assisted method for applying resist stripper and gas-resist stripper combinations |
Aug. 27, 2002 |
| 6440872 |
Method for hybrid DRAM cell utilizing confined strap isolation |
Aug. 27, 2002 |
| 6440873 |
Post metal etch cleaning method |
Aug. 27, 2002 |
| 6436723 |
Etching method and etching apparatus method for manufacturing semiconductor device and semiconductor device |
Aug. 20, 2002 |
| 6436743 |
Method of preventing electrical shorts |
Aug. 20, 2002 |
| 6436809 |
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this method |
Aug. 20, 2002 |
| 6436832 |
Method to reduce polish initiation time in a polish process |
Aug. 20, 2002 |
| 6436833 |
Method for pre-STI-CMP planarization using poly-si thermal oxidation |
Aug. 20, 2002 |
| 6436834 |
Chemical-mechanical abrasive composition and method |
Aug. 20, 2002 |
| 6432618 |
Method for forming high quality multiple thickness oxide layers by reducing descum induced defects |
Aug. 13, 2002 |
| 6432836 |
Cleaning method for semiconductor substrate and cleaning solution |
Aug. 13, 2002 |
| 6428718 |
Selective back side wet etch |
Aug. 6, 2002 |
| 6429132 |
Combination CMP-etch method for forming a thin planar layer over the surface of a device |
Aug. 6, 2002 |
| 6429136 |
Method for forming a shallow trench isolation structure in a semiconductor device |
Aug. 6, 2002 |
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