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Class Information
Number: 438/743
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate > Substrate possessing multiple layers > Silicon oxide or glass
Description: Processes wherein the material undergoing etching with the energized gas is a compound of silicon and oxygen or glass.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7393795 |
Methods for post-etch deposition of a dielectric film |
Jul. 1, 2008 |
| 7390750 |
Method of patterning elements within a semiconductor topography |
Jun. 24, 2008 |
| 7381653 |
Plasma processing method |
Jun. 3, 2008 |
| 7375028 |
Method for manufacturing a semiconductor device |
May. 20, 2008 |
| 7365016 |
Anhydrous HF release of process for MEMS devices |
Apr. 29, 2008 |
| 7358196 |
Wet chemical treatment to form a thin oxide for high k gate dielectrics |
Apr. 15, 2008 |
| 7358182 |
Method of forming an interconnect structure |
Apr. 15, 2008 |
| 7351665 |
Plasma etching method, plasma etching apparatus, control program, computer recording medium and recording medium having processing recipe recorded thereon |
Apr. 1, 2008 |
| 7341952 |
Multi-layer hard mask structure for etching deep trench in substrate |
Mar. 11, 2008 |
| 7338850 |
Method for manufacturing device isolation film of semiconductor device |
Mar. 4, 2008 |
| 7338906 |
Method for fabricating semiconductor device |
Mar. 4, 2008 |
| 7335600 |
Method for removing photoresist |
Feb. 26, 2008 |
| 7326358 |
Plasma processing method and apparatus, and storage medium |
Feb. 5, 2008 |
| 7323418 |
Etch-back process for capping a polymer memory device |
Jan. 29, 2008 |
| 7316785 |
Methods and apparatus for the optimization of etch resistance in a plasma processing system |
Jan. 8, 2008 |
| 7311852 |
Method of plasma etching low-k dielectric materials |
Dec. 25, 2007 |
| 7309656 |
Method for forming step channel of semiconductor device |
Dec. 18, 2007 |
| 7306955 |
Method of performing a double-sided process |
Dec. 11, 2007 |
| 7307025 |
Lag control |
Dec. 11, 2007 |
| 7300878 |
Gas switching during an etch process to modulate the characteristics of the etch |
Nov. 27, 2007 |
| 7276445 |
Method for forming pattern using printing method |
Oct. 2, 2007 |
| 7276450 |
Etching processes using C.sub.4F.sub.8 for silicon dioxide and CF.sub.4 for titanium nitride |
Oct. 2, 2007 |
| 7256134 |
Selective etching of carbon-doped low-k dielectrics |
Aug. 14, 2007 |
| 7244644 |
Undercut and residual spacer prevention for dual stressed layers |
Jul. 17, 2007 |
| 7226871 |
Method for forming a silicon oxynitride layer |
Jun. 5, 2007 |
| 7189653 |
Etching method and etching apparatus |
Mar. 13, 2007 |
| 7186661 |
Method to improve profile control and N/P loading in dual doped gate applications |
Mar. 6, 2007 |
| 7172960 |
Multi-layer film stack for extinction of substrate reflections during patterning |
Feb. 6, 2007 |
| 7172971 |
Semiconductor device having a contact window including a lower with a wider to provide a lower contact resistance |
Feb. 6, 2007 |
| 7166232 |
Method for producing a solid body including a microstructure |
Jan. 23, 2007 |
| 7153778 |
Methods of forming openings, and methods of forming container capacitors |
Dec. 26, 2006 |
| 7148158 |
Semiconductor device and method for manufacturing the same |
Dec. 12, 2006 |
| 7119006 |
Via formation for damascene metal conductors in an integrated circuit |
Oct. 10, 2006 |
| 7115500 |
System and method for providing a dry-wet-dry etch procedure to create a sidewall profile of a via |
Oct. 3, 2006 |
| 7109127 |
Manufacturing method of semiconductor device |
Sep. 19, 2006 |
| 7094703 |
Method and apparatus for surface treatment |
Aug. 22, 2006 |
| 7078334 |
In situ hard mask approach for self-aligned contact etch |
Jul. 18, 2006 |
| 7077973 |
Methods for substrate orientation |
Jul. 18, 2006 |
| 7060629 |
Etch of silicon nitride selective to silicon and silicon dioxide useful during the formation of a semiconductor device |
Jun. 13, 2006 |
| 7049244 |
Method for enhancing silicon dioxide to silicon nitride selectivity |
May. 23, 2006 |
| 7045464 |
Via reactive ion etching process |
May. 16, 2006 |
| 7041567 |
Isolation structure for trench capacitors and fabrication method thereof |
May. 9, 2006 |
| 7033946 |
Plasmaless dry contact cleaning method using interhalogen compounds |
Apr. 25, 2006 |
| 7030045 |
Method of fabricating oxides with low defect densities |
Apr. 18, 2006 |
| 7018944 |
Apparatus and method for nanoscale pattern generation |
Mar. 28, 2006 |
| 7005380 |
Simultaneous formation of device and backside contacts on wafers having a buried insulator layer |
Feb. 28, 2006 |
| 6995094 |
Method for deep trench etching through a buried insulator layer |
Feb. 7, 2006 |
| 6979654 |
Method of avoiding dielectric layer deterioation with a low dielectric constant during a stripping process |
Dec. 27, 2005 |
| 6972266 |
Top oxide nitride liner integration scheme for vertical DRAM |
Dec. 6, 2005 |
| 6969470 |
Method for fabricating ESI device using smile and delayed LOCOS techniques |
Nov. 29, 2005 |
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