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Class Information
Number: 438/742
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate > Substrate possessing multiple layers > Electrically conductive material (e.g., metal, conductive oxide, etc.)
Description: Processes wherein the material undergoing etching with the energized gas is an electrically conductive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7384873 |
Manufacturing process of semiconductor device |
Jun. 10, 2008 |
| 7375037 |
Fabrication method for semiconductor integrated circuit device |
May. 20, 2008 |
| 7361606 |
Method of forming a metal line and method of manufacturing display substrate having the same |
Apr. 22, 2008 |
| 7341950 |
Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers |
Mar. 11, 2008 |
| 7341955 |
Method for fabricating semiconductor device |
Mar. 11, 2008 |
| 7338906 |
Method for fabricating semiconductor device |
Mar. 4, 2008 |
| 7276450 |
Etching processes using C.sub.4F.sub.8 for silicon dioxide and CF.sub.4 for titanium nitride |
Oct. 2, 2007 |
| 7270761 |
Fluorine free integrated process for etching aluminum including chamber dry clean |
Sep. 18, 2007 |
| 7265040 |
Cleaning solution and method for selectively removing layer in a silicidation process |
Sep. 4, 2007 |
| 7259100 |
Nanoparticles and method for making the same |
Aug. 21, 2007 |
| 7259101 |
Nanoparticles and method for making the same |
Aug. 21, 2007 |
| 7232766 |
System and method for surface reduction, passivation, corrosion prevention and activation of copper surface |
Jun. 19, 2007 |
| 7229563 |
Plasma etching of Ni-containing materials |
Jun. 12, 2007 |
| 7176084 |
Self-aligned conductive spacer process for sidewall control gate of high-speed random access memory |
Feb. 13, 2007 |
| 7128844 |
Metal/ceramic circuit board and method for producing same |
Oct. 31, 2006 |
| 7105458 |
Method of etching semiconductor devices using a hydrogen peroxide-water mixture |
Sep. 12, 2006 |
| 7077973 |
Methods for substrate orientation |
Jul. 18, 2006 |
| 7078339 |
Method of forming metal line layer in semiconductor device |
Jul. 18, 2006 |
| 7056758 |
Electromechanical memory array using nanotube ribbons and method for making same |
Jun. 6, 2006 |
| 7041566 |
Method for forming inductor in semiconductor device |
May. 9, 2006 |
| 7029936 |
Semiconductor laser, device having reduced contact resistance and manufacturing method thereof |
Apr. 18, 2006 |
| 7018944 |
Apparatus and method for nanoscale pattern generation |
Mar. 28, 2006 |
| 7005375 |
Method to avoid copper contamination of a via or dual damascene structure |
Feb. 28, 2006 |
| 6987067 |
Semiconductor copper line cutting method |
Jan. 17, 2006 |
| 6974778 |
Semiconductor device manufactured with auxillary mask and method for producing the same |
Dec. 13, 2005 |
| 6969568 |
Method for etching a quartz layer in a photoresistless semiconductor mask |
Nov. 29, 2005 |
| 6960529 |
Methods for sidewall protection of metal interconnect for unlanded vias using physical vapor deposition |
Nov. 1, 2005 |
| 6958295 |
Method for using a hard mask for critical dimension growth containment |
Oct. 25, 2005 |
| 6955992 |
One mask PT/PCMO/PT stack etching process for RRAM applications |
Oct. 18, 2005 |
| 6951820 |
Method for using a hard mask for critical dimension growth containment |
Oct. 4, 2005 |
| 6933236 |
Method for forming pattern using argon fluoride photolithography |
Aug. 23, 2005 |
| 6930027 |
Method of manufacturing a semiconductor component |
Aug. 16, 2005 |
| 6890846 |
Method for manufacturing semiconductor integrated circuit device |
May. 10, 2005 |
| 6855639 |
Precise patterning of high-K films |
Feb. 15, 2005 |
| 6844268 |
Method for fabricating a semiconductor storage device having an increased dielectric film area |
Jan. 18, 2005 |
| 6835668 |
Copper post-etch cleaning process |
Dec. 28, 2004 |
| 6828230 |
Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same |
Dec. 7, 2004 |
| 6815364 |
Tungsten hard mask |
Nov. 9, 2004 |
| 6815337 |
Method to improve borderless metal line process window for sub-micron designs |
Nov. 9, 2004 |
| 6794304 |
Method and apparatus for reducing microtrenching for borderless vias created in a dual damascene process |
Sep. 21, 2004 |
| 6753266 |
Method of enhancing gate patterning properties with reflective hard mask |
Jun. 22, 2004 |
| 6740599 |
Method of fabricating contact holes in a semiconductor device |
May. 25, 2004 |
| 6740600 |
Enhanced interface thermoelectric coolers with all-metals tips |
May. 25, 2004 |
| 6723655 |
Methods for fabricating a semiconductor device |
Apr. 20, 2004 |
| 6713397 |
Manufacturing method of semiconductor device |
Mar. 30, 2004 |
| 6696364 |
Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support |
Feb. 24, 2004 |
| 6696222 |
Dual damascene process using metal hard mask |
Feb. 24, 2004 |
| 6689682 |
Multilayer anti-reflective coating for semiconductor lithography |
Feb. 10, 2004 |
| 6664604 |
Metal gate stack with etch stop layer |
Dec. 16, 2003 |
| 6664179 |
Semiconductor device production method and semiconductor device production apparatus |
Dec. 16, 2003 |
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