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Class Information
Number: 438/737
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate > Substrate possessing multiple layers
Description: Processes wherein the semiconductor substrate undergoing etching possesses plural layers.


Sub-classes under this class:

Class Number Class Name Patents
438/742 Electrically conductive material (e.g., metal, conductive oxide, etc.) 253
438/738 Selectively etching substrate possessing multiple layers of differing etch characteristics 600
438/744 Silicon nitride 199
438/743 Silicon oxide or glass 406


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
7351303 Microfluidic systems and components Apr. 1, 2008
7312158 Method of forming pattern Dec. 25, 2007
7297627 Multilayer substrate Nov. 20, 2007
7294908 Method of forming a gate pattern in a semiconductor device Nov. 13, 2007
7282455 Method of producing a diffraction grating Oct. 16, 2007
7282447 Method for an integrated circuit contact Oct. 16, 2007
7265060 Bi-level resist structure and fabrication method for contact holes on semiconductor substrates Sep. 4, 2007
7261825 Method for the production of a micromechanical device, particularly a micromechanical oscillating mirror device Aug. 28, 2007
7259106 Method of making a microelectronic and/or optoelectronic circuitry sheet Aug. 21, 2007
7259063 Method for forming a gate electrode in a non volatile memory device Aug. 21, 2007
7253113 Methods for using a silylation technique to reduce cell pitch in semiconductor devices Aug. 7, 2007
7217631 Semiconductor device and method for fabricating the device May. 15, 2007
7217619 Method for fabricating memory components May. 15, 2007
7195927 Process for making magnetic memory structures having different-sized memory cell layers Mar. 27, 2007
7172960 Multi-layer film stack for extinction of substrate reflections during patterning Feb. 6, 2007
7153710 Etching method, method of manufacturing semiconductor device, and semiconductor device Dec. 26, 2006
7138340 Method for fabricating semiconductor device without damaging hard mask during contact formation process Nov. 21, 2006
7138341 Process for making a memory structure Nov. 21, 2006
7135360 Liquid crystal display device and method of fabricating the same Nov. 14, 2006
7125733 Method for producing an optical emission module having at least two vertically emitting lasers Oct. 24, 2006
7122482 Methods for fabricating patterned features utilizing imprint lithography Oct. 17, 2006
7109126 Method of manufacturing a semiconductor integrated circuit device Sep. 19, 2006
7109127 Manufacturing method of semiconductor device Sep. 19, 2006
7087532 Formation of controlled sublithographic structures Aug. 8, 2006
7078339 Method of forming metal line layer in semiconductor device Jul. 18, 2006
7067390 Method for forming isolation layer of semiconductor device Jun. 27, 2006
7064069 Substrate thinning including planarization Jun. 20, 2006
7041567 Isolation structure for trench capacitors and fabrication method thereof May. 9, 2006
7015516 Led packages having improved light extraction Mar. 21, 2006
7015149 Simplified dual damascene process Mar. 21, 2006
7012291 Monolithic three-dimensional structures Mar. 14, 2006
7011929 Method for forming multiple spacer widths Mar. 14, 2006
6991953 Microelectronic mechanical system and methods Jan. 31, 2006
6982228 Methods of etching a contact opening over a node location on a semiconductor substrate Jan. 3, 2006
6967156 Method to fabricate aligned dual damascene openings Nov. 22, 2005
6956292 Bumping process to increase bump height and to create a more robust bump structure Oct. 18, 2005
6951824 Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method Oct. 4, 2005
6929957 Magnetic random access memory designs with patterned and stabilized magnetic shields Aug. 16, 2005
6913990 Method of forming isolation dummy fill structures Jul. 5, 2005
6887791 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes May. 3, 2005
6884670 Dry etching with reduced damage to MOS device Apr. 26, 2005
6875688 Method for reactive ion etch processing of a dual damascene structure Apr. 5, 2005
6869886 Process for etching a metal layer system Mar. 22, 2005
6869887 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof Mar. 22, 2005
6867116 Fabrication method of sub-resolution pitch for integrated circuits Mar. 15, 2005
6861367 Semiconductor processing method using photoresist and an antireflective coating Mar. 1, 2005
6861347 Method for forming metal wiring layer of semiconductor device Mar. 1, 2005
6858153 Integrated low K dielectrics and etch stops Feb. 22, 2005
6852472 Polysilicon hard mask etch defect particle removal Feb. 8, 2005
6853076 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Feb. 8, 2005

1 2 3 4


 
 
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