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Class Information
Number: 438/735
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate
Description: Processes directed to (a) contact only selected surface areas of the substrate with the etchant to remove a constituent part of the substrate at the selected surface areas only or (b) cause the substrate to be treated at different rates in different areas to produce a nonuniform surface.


Sub-classes under this class:

Class Number Class Name Patents
438/737 Substrate possessing multiple layers 186
438/736 Utilizing multilayered mask 257


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
5943582 Method for forming DRAM stacked capacitor Aug. 24, 1999
5939741 Methods of forming integrated circuitry and integrated circuitry structures Aug. 17, 1999
5933728 Process for fabricating bottom electrode of capacitor Aug. 3, 1999
5928965 Method for dry-etching of silicon substrate Jul. 27, 1999
5922623 Hydrogen fluoride vapor phase selective etching method for fabricating semiconductor devices Jul. 13, 1999
5922621 Quantum semiconductor device and a fabrication process thereof Jul. 13, 1999
5916821 Method for producing sublithographic etching masks Jun. 29, 1999
5916822 Method of etching a substrate by means of chemical beams Jun. 29, 1999
5912187 Method of fabricating circuits Jun. 15, 1999
5904570 Method for polymer removal after etching May. 18, 1999
5895273 Silicon sidewall etching Apr. 20, 1999
5879572 Method of protecting silicon wafers during wet chemical etching Mar. 9, 1999
5877071 Masking methods during semiconductor device fabrication Mar. 2, 1999
5873948 Method for removing etch residue material Feb. 23, 1999
5871659 Dry etching process for semiconductor Feb. 16, 1999
5871870 Mask for forming features on a semiconductor substrate and a method for forming the mask Feb. 16, 1999
5869400 Method for dry-etching using gaseous bismuth halide compound Feb. 9, 1999
5853601 Top-via etch technique for forming dielectric membranes Dec. 29, 1998
RE36006 Metal selective polymer removal Dec. 22, 1998
5837616 Dry etching method for aluminum alloy and etching gas therefor Nov. 17, 1998
5827783 Stacked capacitor having improved charge storage capacity Oct. 27, 1998
5811345 Planarization of shallow- trench- isolation without chemical mechanical polishing Sep. 22, 1998
5772905 Nanoimprint lithography Jun. 30, 1998
5753539 Method of making an integrated circuit with windowed fuse element and contact pad May. 19, 1998
5726085 Method of fabricating a dynamic random access memory (DRAM) cell capacitor using hemispherical grain (HSG) polysilicon and selective polysilicon etchback Mar. 10, 1998
5714039 Method for making sub-lithographic images by etching the intersection of two spacers Feb. 3, 1998
5667941 Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process Sep. 16, 1997
5419807 Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for oper May. 30, 1995
5364495 Method of manufacturing sharp waveguide branches in integrated optical components Nov. 15, 1994
5348619 Metal selective polymer removal Sep. 20, 1994
5180689 Tapered opening sidewall with multi-step etching process Jan. 19, 1993
5100508 Method of forming fine patterns Mar. 31, 1992
4980314 Vapor processing of a substrate Dec. 25, 1990
4601778 Maskless etching of polysilicon Jul. 22, 1986
4536252 Laser-induced production of nitrosyl fluoride for etching of semiconductor surfaces Aug. 20, 1985
4438556 Method of forming doped polycrystalline silicon pattern by selective implantation and plasma etching of undoped regions Mar. 27, 1984

1 2 3 4 5


 
 
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