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Class Information
Number: 438/735
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate
Description: Processes directed to (a) contact only selected surface areas of the substrate with the etchant to remove a constituent part of the substrate at the selected surface areas only or (b) cause the substrate to be treated at different rates in different areas to produce a nonuniform surface.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6503838 |
Integrated circuit isolation of functionally distinct RF circuits |
Jan. 7, 2003 |
| 6498089 |
Semiconductor integrated circuit device with moisture-proof ring and its manufacture method |
Dec. 24, 2002 |
| 6489248 |
Method and apparatus for etch passivating and etching a substrate |
Dec. 3, 2002 |
| 6475884 |
Devices and methods for addressing optical edge effects in connection with etched trenches |
Nov. 5, 2002 |
| 6475841 |
Transistor with shaped gate electrode and method therefor |
Nov. 5, 2002 |
| 6468918 |
In situ photoresist hot bake in loading chamber of dry etch |
Oct. 22, 2002 |
| 6468919 |
Method of making a local interconnect in an embedded memory |
Oct. 22, 2002 |
| 6448184 |
Formation of diamond particle interconnects |
Sep. 10, 2002 |
| 6448094 |
Method of detecting etching depth |
Sep. 10, 2002 |
| 6444566 |
Method of making borderless contact having a sion buffer layer |
Sep. 3, 2002 |
| 6444588 |
Anti-reflective coatings and methods regarding same |
Sep. 3, 2002 |
| 6440837 |
Method of forming a contact structure in a semiconductor device |
Aug. 27, 2002 |
| 6436229 |
Gas phase silicon etching with bromine trifluoride |
Aug. 20, 2002 |
| 6428713 |
MEMS sensor structure and microfabrication process therefor |
Aug. 6, 2002 |
| 6426238 |
Charge transfer device and solid image pickup apparatus using the same |
Jul. 30, 2002 |
| 6402974 |
Method for etching polysilicon to have a smooth surface |
Jun. 11, 2002 |
| 6403495 |
Capacitor fabricating method of semiconductor device |
Jun. 11, 2002 |
| 6403494 |
Method of forming a floating gate self-aligned to STI on EEPROM |
Jun. 11, 2002 |
| 6399505 |
Method and system for copper interconnect formation |
Jun. 4, 2002 |
| 6395644 |
Process for fabricating a semiconductor device using a silicon-rich silicon nitride ARC |
May. 28, 2002 |
| 6391788 |
Two etchant etch method |
May. 21, 2002 |
| 6387797 |
Method for reducing the capacitance between interconnects by forming voids in dielectric material |
May. 14, 2002 |
| 6383937 |
Method of fabricating a silicon island |
May. 7, 2002 |
| 6376389 |
Method for eliminating anti-reflective coating in semiconductors |
Apr. 23, 2002 |
| 6368980 |
Resist mark having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer and method for manufacturing semiconductor wafer having it |
Apr. 9, 2002 |
| 6362113 |
Method of forming pattern |
Mar. 26, 2002 |
| 6346455 |
Method to form a corrugated structure for enhanced capacitance |
Feb. 12, 2002 |
| 6329296 |
Metal catalyst technique for texturing silicon solar cells |
Dec. 11, 2001 |
| 6319654 |
Process for forming a photoresist pattern by top surface imaging process |
Nov. 20, 2001 |
| 6319797 |
Process for manufacturing a semiconductor device |
Nov. 20, 2001 |
| 6319844 |
Method of manufacturing semiconductor device with via holes reaching interconnect layers having different top-surface widths |
Nov. 20, 2001 |
| 6309962 |
Film stack and etching sequence for dual damascene |
Oct. 30, 2001 |
| 6309974 |
Method for eliminating residual oxygen impurities from silicon wafers pulled from a crucible |
Oct. 30, 2001 |
| 6306774 |
Method of forming a wordline |
Oct. 23, 2001 |
| 6306772 |
Deep trench bottle-shaped etching using Cl2 gas |
Oct. 23, 2001 |
| 6303515 |
Method of forming a capacitor |
Oct. 16, 2001 |
| 6297170 |
Sacrificial multilayer anti-reflective coating for mos gate formation |
Oct. 2, 2001 |
| 6294450 |
Nanoscale patterning for the formation of extensive wires |
Sep. 25, 2001 |
| 6294099 |
Method of processing circular patterning |
Sep. 25, 2001 |
| 6290631 |
Method for restoring an alignment mark after planarization of a dielectric layer |
Sep. 18, 2001 |
| 6291334 |
Etch stop layer for dual damascene process |
Sep. 18, 2001 |
| 6291357 |
Method and apparatus for etching a substrate with reduced microloading |
Sep. 18, 2001 |
| 6287979 |
Method for forming an air gap as low dielectric constant material using buckminsterfullerene as a porogen in an air bridge or a sacrificial layer |
Sep. 11, 2001 |
| 6277716 |
Method of reduce gate oxide damage by using a multi-step etch process with a predictable premature endpoint system |
Aug. 21, 2001 |
| 6274393 |
Method for measuring submicron images |
Aug. 14, 2001 |
| 6274503 |
Etching method for doped polysilicon layer |
Aug. 14, 2001 |
| 6268295 |
Method of manufacturing semiconductor device |
Jul. 31, 2001 |
| 6265304 |
Controlling an etching process of multiple layers based upon thickness ratio of the dielectric layers |
Jul. 24, 2001 |
| 6248666 |
Process of manufacturing a semiconductor device including a buried channel field effect transistor |
Jun. 19, 2001 |
| 6242363 |
Method of etching a wafer layer using a sacrificial wall to form vertical sidewall |
Jun. 5, 2001 |
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