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Class Information
Number: 438/735
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate
Description: Processes directed to (a) contact only selected surface areas of the substrate with the etchant to remove a constituent part of the substrate at the selected surface areas only or (b) cause the substrate to be treated at different rates in different areas to produce a nonuniform surface.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625603 |
Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics |
Dec. 1, 2009 |
| 7608504 |
Memory and manufacturing method thereof |
Oct. 27, 2009 |
| 7595206 |
Manufacturing method for semiconductor light emitting device |
Sep. 29, 2009 |
| 7592264 |
Process for removing material from substrates |
Sep. 22, 2009 |
| 7569489 |
High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching |
Aug. 4, 2009 |
| 7560389 |
Method for fabricating semiconductor element |
Jul. 14, 2009 |
| 7547635 |
Process for etching dielectric films with improved resist and/or etch profile characteristics |
Jun. 16, 2009 |
| 7534721 |
Semiconductor device manufacturing device |
May. 19, 2009 |
| 7534686 |
Multi-structured Si-fin and method of manufacture |
May. 19, 2009 |
| 7528075 |
Self-masking defect removing method |
May. 5, 2009 |
| 7524770 |
Methods of forming image sensor microlens structures |
Apr. 28, 2009 |
| 7485485 |
Method and apparatus for making a MEMS scanner |
Feb. 3, 2009 |
| 7473648 |
Double exposure double resist layer process for forming gate patterns |
Jan. 6, 2009 |
| 7470630 |
Approach to reduce parasitic capacitance from dummy fill |
Dec. 30, 2008 |
| 7456112 |
Method of fabricating micro-needle array |
Nov. 25, 2008 |
| 7435685 |
Method of forming a low-K dual damascene interconnect structure |
Oct. 14, 2008 |
| 7432213 |
Electrical connection pattern in an electronic panel |
Oct. 7, 2008 |
| 7429534 |
Etching a nitride-based heterostructure |
Sep. 30, 2008 |
| 7427569 |
Metal etching process and rework method thereof |
Sep. 23, 2008 |
| 7419915 |
Laser assisted chemical etching method for release microscale and nanoscale devices |
Sep. 2, 2008 |
| 7410907 |
Fabricating integrated devices using embedded masks |
Aug. 12, 2008 |
| 7381640 |
Method of forming metal line and contact plug of flash memory device |
Jun. 3, 2008 |
| 7344997 |
Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
Mar. 18, 2008 |
| 7344994 |
Multiple layer etch stop and etching method |
Mar. 18, 2008 |
| 7341943 |
Post etch copper cleaning using dry plasma |
Mar. 11, 2008 |
| 7309654 |
Technique for reducing etch damage during the formation of vias and trenches in interlayer dielectrics |
Dec. 18, 2007 |
| 7291282 |
Method of fabricating a mold for imprinting a structure |
Nov. 6, 2007 |
| 7282447 |
Method for an integrated circuit contact |
Oct. 16, 2007 |
| 7282455 |
Method of producing a diffraction grating |
Oct. 16, 2007 |
| 7217631 |
Semiconductor device and method for fabricating the device |
May. 15, 2007 |
| 7214626 |
Etching process for decreasing mask defect |
May. 8, 2007 |
| 7208396 |
Permanent adherence of the back end of a wafer to an electrical component or sub-assembly |
Apr. 24, 2007 |
| 7205244 |
Patterning substrates employing multi-film layers defining etch-differential interfaces |
Apr. 17, 2007 |
| 7166232 |
Method for producing a solid body including a microstructure |
Jan. 23, 2007 |
| 7153710 |
Etching method, method of manufacturing semiconductor device, and semiconductor device |
Dec. 26, 2006 |
| 7141275 |
Imprinting lithography using the liquid/solid transition of metals and their alloys |
Nov. 28, 2006 |
| 7135360 |
Liquid crystal display device and method of fabricating the same |
Nov. 14, 2006 |
| 7109125 |
Selective fabrication of high capacitance density areas in a low dielectric constant material |
Sep. 19, 2006 |
| 7105436 |
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing |
Sep. 12, 2006 |
| 7105457 |
Semiconductor device manufacturing method and apparatus used in the semiconductor device manufacturing method |
Sep. 12, 2006 |
| 7098143 |
Etching method using an at least semi-solid media |
Aug. 29, 2006 |
| 7074718 |
Method of fabricating a semiconductor device having a buried and enlarged contact hole |
Jul. 11, 2006 |
| 7064081 |
Semiconductor device and method for producing the same |
Jun. 20, 2006 |
| 7064080 |
Semiconductor processing method using photoresist and an antireflective coating |
Jun. 20, 2006 |
| 7060197 |
Micromechanical mass flow sensor and method for the production thereof |
Jun. 13, 2006 |
| 7049246 |
Method for selective fabrication of high capacitance density areas in a low dielectric constant material |
May. 23, 2006 |
| 7041604 |
Method of patterning surfaces while providing greater control of recess anisotropy |
May. 9, 2006 |
| 7029965 |
Semiconductor device and manufacturing method thereof |
Apr. 18, 2006 |
| 7015149 |
Simplified dual damascene process |
Mar. 21, 2006 |
| 7012029 |
Method of forming a lamination film pattern and improved lamination film pattern |
Mar. 14, 2006 |
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