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Class Information
Number: 438/735
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Differential etching of semiconductor substrate
Description: Processes directed to (a) contact only selected surface areas of the substrate with the etchant to remove a constituent part of the substrate at the selected surface areas only or (b) cause the substrate to be treated at different rates in different areas to produce a nonuniform surface.










Sub-classes under this class:

Class Number Class Name Patents
438/737 Substrate possessing multiple layers 280
438/736 Utilizing multilayered mask 499


Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8709267 Double patterning method using tilt-angle deposition Apr. 29, 2014
8703619 Taper-etching method and method of manufacturing near-field light generator Apr. 22, 2014
8692339 Micromechanical component having a rear volume Apr. 8, 2014
8679985 Dry etching method for silicon nitride film Mar. 25, 2014
8664699 Methods and devices for fabricating and assembling printable semiconductor elements Mar. 4, 2014
8658537 Mask manufacturing method for nanoimprinting Feb. 25, 2014
8642484 Method for manufacturing semiconductor device Feb. 4, 2014
8628981 Method of manufacturing a ferroelectric-capacitor memory device including recovery annealing Jan. 14, 2014
8623713 Trench isolation structure Jan. 7, 2014
8609491 Method for fabricating semiconductor device with buried bit lines Dec. 17, 2013
8609533 Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts Dec. 17, 2013
8598043 Methods of forming semiconductor constructions Dec. 3, 2013
8592320 Method for forming fin-shaped semiconductor structure Nov. 26, 2013
8580158 Methods of removing silicon dioxide Nov. 12, 2013
8574928 MRAM fabrication method with sidewall cleaning Nov. 5, 2013
8575034 Fabricating method of semiconductor element Nov. 5, 2013
8569182 Methods of fabricating three-dimensional semiconductor device Oct. 29, 2013
8563367 Method of fabricating array substrate for in-plane switching mode liquid crystal display device Oct. 22, 2013
8557706 Substrate processing method Oct. 15, 2013
8557691 Method of fabricating semiconductor device having buried wiring and related device Oct. 15, 2013
8557613 Methods for designing, fabricating, and predicting shape formations in a material Oct. 15, 2013
8557612 Method for fabricating micro and nanostructures in a material Oct. 15, 2013
8551846 Methods for fabricating semiconductor devices Oct. 8, 2013
8546218 Method for fabricating semiconductor device with buried word line Oct. 1, 2013
8541313 Method for etching a sacrificial layer for a micro-machined structure Sep. 24, 2013
8536063 MRAM etching processes Sep. 17, 2013
8537527 Mounting board and display device Sep. 17, 2013
8524101 Method and apparatus for manufacturing semiconductor device, and storage medium Sep. 3, 2013
8512586 Gas cluster ion beam etching process for achieving target etch process metrics for multiple materials Aug. 20, 2013
8513143 Semiconductor structure and method of manufacturing Aug. 20, 2013
8481431 Method for opening one-side contact region of vertical transistor and method for fabricating one-side junction region using the same Jul. 9, 2013
8476166 Manufacturing method of semiconductor device Jul. 2, 2013
8440576 Method for pitch reduction in integrated circuit fabrication May. 14, 2013
8435416 Method for manufacturing porous structure and method for forming pattern May. 7, 2013
8420547 Plasma processing method Apr. 16, 2013
8383521 Substrate processing method Feb. 26, 2013
8377785 Planar field effect transistor structure having an angled crystallographic etch-defined source/drain recess and a method of forming the transistor structure Feb. 19, 2013
8372751 Method for fabricating side contact in semiconductor device Feb. 12, 2013
8361907 Directionally etched nanowire field effect transistors Jan. 29, 2013
8354347 Method of forming high-k dielectric stop layer for contact hole opening Jan. 15, 2013
8338305 Multi-fin device by self-aligned castle fin formation Dec. 25, 2012
8329585 Method for reducing line width roughness with plasma pre-etch treatment on photoresist Dec. 11, 2012
8293656 Selective self-aligned double patterning of regions in an integrated circuit device Oct. 23, 2012
8283256 Methods of forming microdevice substrates using double-sided alignment techniques Oct. 9, 2012
8278223 Method for forming hole pattern Oct. 2, 2012
8252693 Self-alignment for semiconductor patterns Aug. 28, 2012
8241940 Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing Aug. 14, 2012
8236700 Method for patterning an ARC layer using SF.sub.6 and a hydrocarbon gas Aug. 7, 2012
8232215 Spacer linewidth control Jul. 31, 2012
8226840 Methods of removing silicon dioxide Jul. 24, 2012

1 2 3 4 5 6 7 8










 
 
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