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Class Information
Number: 438/734
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Sequential etching steps on a single layer
Description: Processes wherein plural etching steps are carried out on a single layer at different times.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8703620 Methods for PFET fabrication using APM solutions Apr. 22, 2014
8703604 Creation of vias and trenches with different depths Apr. 22, 2014
8703606 Method for manufacturing semiconductor device having a wiring structure Apr. 22, 2014
8703617 Method for planarizing interlayer dielectric layer Apr. 22, 2014
8703618 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die Apr. 22, 2014
8691701 Strip with reduced low-K dielectric damage Apr. 8, 2014
8691703 Method of manufacturing semiconductor device Apr. 8, 2014
8685862 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die Apr. 1, 2014
8679985 Dry etching method for silicon nitride film Mar. 25, 2014
8679983 Selective suppression of dry-etch rate of materials containing both silicon and nitrogen Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8673785 Gas distribution system having fast gas switching capabilities Mar. 18, 2014
8658543 Methods for pFET fabrication using APM solutions Feb. 25, 2014
8652345 Method of forming a patterned substrate Feb. 18, 2014
8637407 Methods of forming fine patterns in semiconductor devices Jan. 28, 2014
8609550 Methods for manufacturing integrated circuit devices having features with reduced edge curvature Dec. 17, 2013
8575034 Fabricating method of semiconductor element Nov. 5, 2013
8569168 Dual-metal self-aligned wires and vias Oct. 29, 2013
8569180 Method and structure of wafer level encapsulation of integrated circuits with cavity Oct. 29, 2013
8563429 Methods of forming a metal silicide layer for semiconductor devices Oct. 22, 2013
8563367 Method of fabricating array substrate for in-plane switching mode liquid crystal display device Oct. 22, 2013
8563437 Method for treating group III nitride semiconductor Oct. 22, 2013
8557706 Substrate processing method Oct. 15, 2013
8551886 CMP process for processing STI on two distinct silicon planes Oct. 8, 2013
8546265 Method, apparatus and program for manufacturing silicon structure Oct. 1, 2013
8541312 Selective suppression of dry-etch rate of materials containing both silicon and nitrogen Sep. 24, 2013
8518824 Self aligning via patterning Aug. 27, 2013
8513143 Semiconductor structure and method of manufacturing Aug. 20, 2013
8507346 Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layer Aug. 13, 2013
8492287 Substrate processing method Jul. 23, 2013
8492285 Method for plasma texturing Jul. 23, 2013
8492279 Method of controlling critical dimensions of vias in a metallization system of a semiconductor device during silicon-ARC etch Jul. 23, 2013
8476122 Etching method and method for manufacturing semiconductor device Jul. 2, 2013
8455324 Method of manufacturing a semiconductor device Jun. 4, 2013
8455325 Method of manufacturing a semiconductor device Jun. 4, 2013
8450166 Method of fabricating semiconductor devices May. 28, 2013
8450167 Method of fabricating semiconductor devices May. 28, 2013
8445324 Method of wafer-level fabrication of MEMS devices May. 21, 2013
8420543 Method for treating the dislocation in a GaN-containing semiconductor layer Apr. 16, 2013
8421228 Structure and methods of forming contact structures Apr. 16, 2013
8389402 Method for via formation in a semiconductor device Mar. 5, 2013
8357617 Method of patterning a metal gate of semiconductor device Jan. 22, 2013
8358010 Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method Jan. 22, 2013
8354741 Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semicond Jan. 15, 2013
8324109 Method for fabricating semiconductor device Dec. 4, 2012
8324110 Field effect transistor (FET) and method of forming the FET without damaging the wafer surface Dec. 4, 2012
8314034 Feature size reduction Nov. 20, 2012
8298943 Self aligning via patterning Oct. 30, 2012
8298961 Patterns of semiconductor device and method of forming the same Oct. 30, 2012
8298958 Organic line width roughness with H.sub.2 plasma treatment Oct. 30, 2012

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