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Class Information
Number: 438/714
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching) > Utilizing electromagnetic or wave energy > By creating electric field (e.g., plasma, glow discharge, etc.) > Including change in etch influencing parameter (e.g., energizing power, etchant composition, temperature, etc.)
Description: Processes wherein a parameter influencing material removal, such as energizing power, gas etchant composition, temperature, etc., is varied during the etching process.


Patents under this class:

Patent Number Title Of Patent Date Issued
7625824 Process change detection through the use of evolutionary algorithms Dec. 1, 2009
7625823 Method of patterning a metal layer in a semiconductor device Dec. 1, 2009
7625494 Plasma etching method and plasma etching unit Dec. 1, 2009
7622391 Method of forming an electrically conductive line in an integrated circuit Nov. 24, 2009
7622340 Method for manufacturing semiconductor device Nov. 24, 2009
7615164 Plasma etching methods and contact opening forming methods Nov. 10, 2009
7611995 Method for removing silicon oxide film and processing apparatus Nov. 3, 2009
7611993 Plasma processing method and plasma processing apparatus Nov. 3, 2009
7608195 High aspect ratio contacts Oct. 27, 2009
7605088 Method of uniformly etching refractory metals, refractory metal alloys and refractory metal silicides Oct. 20, 2009
7605069 Method for fabricating semiconductor device with gate Oct. 20, 2009
7598178 Carbon precursors for use during silicon epitaxial film formation Oct. 6, 2009
7589026 Method for fabricating a fine pattern in a semiconductor device Sep. 15, 2009
7589005 Methods of forming semiconductor structures and systems for forming semiconductor structures Sep. 15, 2009
7585776 Dry etching method of insulating film Sep. 8, 2009
7585775 System and method for faceting a masking layer in a plasma etch to slope a feature edge Sep. 8, 2009
7582568 Method of forming a phase changeable structure Sep. 1, 2009
7579283 Insulating layer patterning method, insulating layer formed by the insulating layer patterning method, display device having the insulating layer Aug. 25, 2009
7573116 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device Aug. 11, 2009
7572737 Apparatus and methods for adjusting an edge ring potential substrate processing Aug. 11, 2009
7572736 Method of dry-etching semiconductor devices Aug. 11, 2009
7572734 Etch depth control for dual damascene fabrication process Aug. 11, 2009
7572732 Method to modulate etch rate in SLAM Aug. 11, 2009
7569492 Method for post-etch cleans Aug. 4, 2009
7569488 Methods of making a MEMS device by monitoring a process parameter Aug. 4, 2009
7563723 Critical dimension control for integrated circuits Jul. 21, 2009
7560360 Methods for enhancing trench capacitance and trench capacitor Jul. 14, 2009
7554108 Forming a semiconductor device feature using acquired parameters Jun. 30, 2009
7553773 Pressure control method and processing device Jun. 30, 2009
7553679 Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current Jun. 30, 2009
7550394 Semiconductor device and fabrication process thereof Jun. 23, 2009
7550392 Semiconductor device and method of manufacturing the same Jun. 23, 2009
7550390 Method and apparatus for dielectric etching during integrated circuit fabrication Jun. 23, 2009
7547636 Pulsed ultra-high aspect ratio dielectric etch Jun. 16, 2009
7547635 Process for etching dielectric films with improved resist and/or etch profile characteristics Jun. 16, 2009
7544621 Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method Jun. 9, 2009
7538041 Magnetic recording medium, method of manufacturing the same, and intermediate for magnetic recording medium May. 26, 2009
7531460 Dry-etching method May. 12, 2009
7528074 Method of manufacturing a semiconductor device and method of etching an insulating film May. 5, 2009
7521370 Method of operating a plasma reactor chamber with respect to two plasma parameters selected from a group comprising ion density, wafer voltage, etch rate and wafer current, by controlling cham Apr. 21, 2009
7521365 Selective epitaxy process with alternating gas supply Apr. 21, 2009
7521362 Methods for the optimization of ion energy control in a plasma processing system Apr. 21, 2009
7517804 Selective etch chemistries for forming high aspect ratio features and associated structures Apr. 14, 2009
7517802 Method for reducing foreign material concentrations in etch chambers Apr. 14, 2009
7517801 Method for selectivity control in a plasma processing system Apr. 14, 2009
7510977 Method for manufacturing silicon carbide semiconductor device Mar. 31, 2009
7510665 Plasma generation and control using dual frequency RF signals Mar. 31, 2009
7507673 Method for etching an object to be processed Mar. 24, 2009
7507672 Plasma etching system and method Mar. 24, 2009
7504340 System and method for providing contact etch selectivity using RIE lag dependence on contact aspect ratio Mar. 17, 2009



 
 
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