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Class Information
Number: 438/706
Name: Semiconductor device manufacturing: process > Chemical etching > Vapor phase etching (i.e., dry etching)
Description: Processes wherein the chemical etchant is in a gaseous state when brought into contact with the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6475879 |
Semiconductor wafer, method for processing the same and method for manufacturing semiconductor device |
Nov. 5, 2002 |
| 6475889 |
Method of forming vias in silicon carbide and resulting devices and circuits |
Nov. 5, 2002 |
| 6475915 |
Ono etch using CL2/HE chemistry |
Nov. 5, 2002 |
| 6475916 |
Method of patterning gate electrode with ultra-thin gate dielectric |
Nov. 5, 2002 |
| 6468904 |
RPO process for selective CoSix formation |
Oct. 22, 2002 |
| 6468915 |
Method of silicon oxynitride ARC removal after gate etching |
Oct. 22, 2002 |
| 6468916 |
Method of forming structure having surface roughness due to nano-sized surface features |
Oct. 22, 2002 |
| 6465343 |
Method for forming backend interconnect with copper etching and ultra low-k dielectric materials |
Oct. 15, 2002 |
| 6465346 |
Conducting line of semiconductor device and manufacturing method thereof using aluminum oxide layer as hard mask |
Oct. 15, 2002 |
| 6465351 |
Method of forming a capacitor lower electrode using a CMP stopping layer |
Oct. 15, 2002 |
| 6465352 |
Method for removing dry-etching residue in a semiconductor device fabricating process |
Oct. 15, 2002 |
| 6465359 |
Etchant for use in a semiconductor processing method and system |
Oct. 15, 2002 |
| 6465360 |
Method for fabricating an ultra small opening |
Oct. 15, 2002 |
| 6465361 |
Method for preventing damage of low-k dielectrics during patterning |
Oct. 15, 2002 |
| 6461533 |
Etchant for silicon oxide and method |
Oct. 8, 2002 |
| 6461963 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
Oct. 8, 2002 |
| 6461968 |
Method for fabricating a semiconductor device |
Oct. 8, 2002 |
| 6461969 |
Multiple-step plasma etching process for silicon nitride |
Oct. 8, 2002 |
| 6458655 |
Method of manufacturing semiconductor device and flash memory |
Oct. 1, 2002 |
| 6458685 |
Method of forming a self-aligned contact opening |
Oct. 1, 2002 |
| 6455406 |
Semiconductor processing method of forming a conductive connection through WxSiyNz material with specific contact opening etching |
Sep. 24, 2002 |
| 6455411 |
Defect and etch rate control in trench etch for dual damascene patterning of low-k dielectrics |
Sep. 24, 2002 |
| 6455436 |
Method of fabricating semiconductor device |
Sep. 24, 2002 |
| 6451157 |
Gas distribution apparatus for semiconductor processing |
Sep. 17, 2002 |
| 6451702 |
Methods for forming lateral trench optical detectors |
Sep. 17, 2002 |
| 6448184 |
Formation of diamond particle interconnects |
Sep. 10, 2002 |
| 6448185 |
Method for making a semiconductor device that has a dual damascene interconnect |
Sep. 10, 2002 |
| 6444540 |
Semiconductor apparatus and method for fabricating the same |
Sep. 3, 2002 |
| 6444556 |
Chemistry for chemical vapor deposition of titanium containing films |
Sep. 3, 2002 |
| 6444566 |
Method of making borderless contact having a sion buffer layer |
Sep. 3, 2002 |
| 6444581 |
AB etch endpoint by ABFILL compensation |
Sep. 3, 2002 |
| 6444584 |
Plasma etch method for forming composite silicon/dielectric/silicon stack layer |
Sep. 3, 2002 |
| 6444585 |
Method for manufacturing semiconductor device capable of expelling argon gas |
Sep. 3, 2002 |
| 6444586 |
Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher |
Sep. 3, 2002 |
| 6440858 |
Multi-layer hard mask for deep trench silicon etch |
Aug. 27, 2002 |
| 6440861 |
Method of forming dual damascene structure |
Aug. 27, 2002 |
| 6436837 |
Domed wafer reactor vessel window with reduced stress at atmospheric and above atmospheric pressures |
Aug. 20, 2002 |
| 6432824 |
Method for manufacturing a semiconductor wafer |
Aug. 13, 2002 |
| 6432830 |
Semiconductor fabrication process |
Aug. 13, 2002 |
| 6429132 |
Combination CMP-etch method for forming a thin planar layer over the surface of a device |
Aug. 6, 2002 |
| 6429137 |
Solid state thermal switch |
Aug. 6, 2002 |
| 6426016 |
Method for etching passivation layers and antireflective layer on a substrate |
Jul. 30, 2002 |
| 6426298 |
Method of patterning a dual damascene |
Jul. 30, 2002 |
| 6426299 |
Method and apparatus for manufacturing semiconductor device |
Jul. 30, 2002 |
| 6426300 |
Method for fabricating semiconductor device by using etching polymer |
Jul. 30, 2002 |
| 6426301 |
Reduction of via etch charging damage through the use of a conducting hard mask |
Jul. 30, 2002 |
| 6420273 |
Self-aligned etch-stop layer formation for semiconductor devices |
Jul. 16, 2002 |
| 6420274 |
Method for conditioning process chambers |
Jul. 16, 2002 |
| 6420280 |
Method and system for reducing ARC layer removal by providing a capping layer for the ARC layer |
Jul. 16, 2002 |
| 6417109 |
Chemical-mechanical etch (CME) method for patterned etching of a substrate surface |
Jul. 9, 2002 |
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