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Class Information
Number: 438/705
Name: Semiconductor device manufacturing: process > Chemical etching > Altering etchability of substrate region by compositional or crystalline modification
Description: Processes wherein the manner in which a semiconductor substrate is etched by a chemical etchant is altered by contacting the substrate prior to etching (a) with a material which alloys or diffuses into a substrate region or (b) by modifying the crystalline structure of a substrate region (e.g., amorphosizing, introducing dislocations, etc.).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6939758 |
Gate length control for semiconductor chip design |
Sep. 6, 2005 |
| 6932916 |
Semiconductor substrate with trenches of varying depth |
Aug. 23, 2005 |
| 6930030 |
Method of forming an electronic device on a recess in the surface of a thin film of silicon etched to a precise thickness |
Aug. 16, 2005 |
| 6927082 |
Method of evaluating the quality of a contact plug fill |
Aug. 9, 2005 |
| 6924217 |
Method of forming trench in semiconductor device |
Aug. 2, 2005 |
| 6903023 |
In-situ plasma etch for TERA hard mask materials |
Jun. 7, 2005 |
| 6900137 |
Dry etch process to edit copper lines |
May. 31, 2005 |
| 6881644 |
Smoothing method for cleaved films made using a release layer |
Apr. 19, 2005 |
| 6869884 |
Process to reduce substrate effects by forming channels under inductor devices and around analog blocks |
Mar. 22, 2005 |
| 6864190 |
Laser chemical fabrication of nanostructures |
Mar. 8, 2005 |
| 6855639 |
Precise patterning of high-K films |
Feb. 15, 2005 |
| 6852634 |
Low cost method of providing a semiconductor device having a high channel density |
Feb. 8, 2005 |
| 6849551 |
Method for forming isolation region in semiconductor device |
Feb. 1, 2005 |
| 6825057 |
Thermal membrane sensor and method for the production thereof |
Nov. 30, 2004 |
| 6818556 |
Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions |
Nov. 16, 2004 |
| 6815359 |
Process for improving the etch stability of ultra-thin photoresist |
Nov. 9, 2004 |
| 6815355 |
Method of integrating L-shaped spacers in a high performance CMOS process via use of an oxide-nitride-doped oxide spacer |
Nov. 9, 2004 |
| 6806204 |
Semiconductor etch speed modification |
Oct. 19, 2004 |
| 6806197 |
Method of forming integrated circuitry, and method of forming a contact opening |
Oct. 19, 2004 |
| 6797629 |
Method of manufacturing nano transistors |
Sep. 28, 2004 |
| 6780774 |
Method of semiconductor device isolation |
Aug. 24, 2004 |
| 6774043 |
Method of manufacturing semiconductor device |
Aug. 10, 2004 |
| 6767773 |
Method of Production of a thin film type semiconductor device having a heat-retaining layer |
Jul. 27, 2004 |
| 6767839 |
Method for forming multi-layer wiring structure |
Jul. 27, 2004 |
| 6759304 |
DRAM memory integration method |
Jul. 6, 2004 |
| 6759315 |
Method for selective trimming of gate structures and apparatus formed thereby |
Jul. 6, 2004 |
| 6753256 |
Method of manufacturing semiconductor wafer |
Jun. 22, 2004 |
| 6750149 |
Method of manufacturing electronic device |
Jun. 15, 2004 |
| 6746962 |
Method for fabricating a semi-conductor device having a tungsten film-filled via hole |
Jun. 8, 2004 |
| 6743724 |
Planarization process for semiconductor substrates |
Jun. 1, 2004 |
| 6734105 |
Method for forming silicon quantum dots and method for fabricating nonvolatile memory device using the same |
May. 11, 2004 |
| 6730607 |
Method for fabricating a barrier layer |
May. 4, 2004 |
| 6723649 |
Method of fabricating a semiconductor memory device |
Apr. 20, 2004 |
| 6716757 |
Method for forming bottle trenches |
Apr. 6, 2004 |
| 6716720 |
Method for filling depressions on a semiconductor wafer |
Apr. 6, 2004 |
| 6706611 |
Method for patterning a dual damascene with retrograde implantation |
Mar. 16, 2004 |
| 6696224 |
Methods of masking and etching a semiconductor substrate, and ion implant lithography methods of processing a semiconductor substrate |
Feb. 24, 2004 |
| 6664197 |
Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components |
Dec. 16, 2003 |
| 6645869 |
Etching back process to improve topographic planarization of a polysilicon layer |
Nov. 11, 2003 |
| 6639266 |
Modifying material removal selectivity in semiconductor structure development |
Oct. 28, 2003 |
| 6638895 |
Method for fabricating high aspect ratio structures in perovskite material |
Oct. 28, 2003 |
| 6638781 |
Semiconductor device and method of fabricating the same |
Oct. 28, 2003 |
| 6632699 |
Process for making a color selective Si detector array |
Oct. 14, 2003 |
| 6607967 |
Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrate |
Aug. 19, 2003 |
| 6605546 |
Dual bake for BARC fill without voids |
Aug. 12, 2003 |
| 6599839 |
Plasma etch process for nonhomogenous film |
Jul. 29, 2003 |
| 6599840 |
Material removal method for forming a structure |
Jul. 29, 2003 |
| 6596642 |
Material removal method for forming a structure |
Jul. 22, 2003 |
| 6594898 |
Method of manufacturing an ink jet printer head |
Jul. 22, 2003 |
| 6589447 |
Compound semiconductor single crystal and fabrication process for compound semiconductor device |
Jul. 8, 2003 |
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