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Class Information
Number: 438/705
Name: Semiconductor device manufacturing: process > Chemical etching > Altering etchability of substrate region by compositional or crystalline modification
Description: Processes wherein the manner in which a semiconductor substrate is etched by a chemical etchant is altered by contacting the substrate prior to etching (a) with a material which alloys or diffuses into a substrate region or (b) by modifying the crystalline structure of a substrate region (e.g., amorphosizing, introducing dislocations, etc.).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618894 |
Multi-step selective etching for cross-point memory |
Nov. 17, 2009 |
| 7611978 |
Method for forming gate electrode of semiconductor device |
Nov. 3, 2009 |
| 7585424 |
Pattern reversal process for self aligned imprint lithography and device |
Sep. 8, 2009 |
| 7579281 |
Transistor assembly and method of its fabrication |
Aug. 25, 2009 |
| 7557023 |
Implantation of gate regions in semiconductor device fabrication |
Jul. 7, 2009 |
| 7557043 |
Method of fabricating the stacked structure and damascene process |
Jul. 7, 2009 |
| 7553771 |
Method of forming pattern of semiconductor device |
Jun. 30, 2009 |
| 7544622 |
Passivation for cleaning a material |
Jun. 9, 2009 |
| 7541199 |
Methods of forming magnetic memory devices including oxidizing and etching magnetic layers |
Jun. 2, 2009 |
| 7528072 |
Crystallographic preferential etch to define a recessed-region for epitaxial growth |
May. 5, 2009 |
| 7504339 |
Method to form shallow trench isolation with rounded upper corner for advanced semiconductor circuits |
Mar. 17, 2009 |
| 7497095 |
Method for producing quartz glass jig and quartz glass jig |
Mar. 3, 2009 |
| 7498222 |
Enhanced etching of a high dielectric constant layer |
Mar. 3, 2009 |
| 7494933 |
Method for achieving uniform etch depth using ion implantation and a timed etch |
Feb. 24, 2009 |
| 7429534 |
Etching a nitride-based heterostructure |
Sep. 30, 2008 |
| 7422936 |
Facilitating removal of sacrificial layers via implantation to form replacement metal gates |
Sep. 9, 2008 |
| 7422020 |
Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric |
Sep. 9, 2008 |
| 7419914 |
Semiconductor device fabrication method |
Sep. 2, 2008 |
| 7419915 |
Laser assisted chemical etching method for release microscale and nanoscale devices |
Sep. 2, 2008 |
| 7416988 |
Semiconductor device and fabrication process thereof |
Aug. 26, 2008 |
| 7407853 |
Display device and manufacturing method of the same |
Aug. 5, 2008 |
| 7390753 |
In-situ plasma treatment of advanced resists in fine pattern definition |
Jun. 24, 2008 |
| 7390748 |
Method of forming a polishing inhibiting layer using a slurry having an additive |
Jun. 24, 2008 |
| 7390745 |
Pattern enhancement by crystallographic etching |
Jun. 24, 2008 |
| 7386162 |
Post fabrication CD modification on imprint lithography mask |
Jun. 10, 2008 |
| 7376259 |
Topography compensation of imprint lithography patterning |
May. 20, 2008 |
| 7358181 |
Method for structuring a semiconductor device |
Apr. 15, 2008 |
| 7341941 |
Methods to facilitate etch uniformity and selectivity |
Mar. 11, 2008 |
| 7316978 |
Method for forming recesses |
Jan. 8, 2008 |
| 7276175 |
Semiconductor device fabrication method |
Oct. 2, 2007 |
| 7267127 |
Method for manufacturing electronic device |
Sep. 11, 2007 |
| 7259103 |
Fabrication method of polycrystalline silicon TFT |
Aug. 21, 2007 |
| 7256130 |
Process for defining a chalcogenide material layer, in particular in a process for manufacturing phase change memory cells |
Aug. 14, 2007 |
| 7253120 |
Selectable area laser assisted processing of substrates |
Aug. 7, 2007 |
| 7232765 |
Utilization of a Ta-containing cap over copper to facilitate concurrent formation of copper vias and memory element structures |
Jun. 19, 2007 |
| 7229928 |
Method for processing a layered stack in the production of a semiconductor device |
Jun. 12, 2007 |
| 7214978 |
Semiconductor fabrication that includes surface tension control |
May. 8, 2007 |
| 7208419 |
Method for fabricating semiconductor device |
Apr. 24, 2007 |
| 7205244 |
Patterning substrates employing multi-film layers defining etch-differential interfaces |
Apr. 17, 2007 |
| 7202122 |
Cobalt silicidation process for substrates with a silicon--germanium layer |
Apr. 10, 2007 |
| 7196016 |
Fabrication process for preparing recording head sliders made from silicon substrates with SiO.sub.2 overcoats |
Mar. 27, 2007 |
| 7195946 |
Process for fabricating a semiconductor device having a suspended micro-system and resultant device |
Mar. 27, 2007 |
| 7186657 |
Method for patterning HfO2-containing dielectric |
Mar. 6, 2007 |
| 7179748 |
Method for forming recesses |
Feb. 20, 2007 |
| 7169669 |
Method of making thin silicon sheets for solar cells |
Jan. 30, 2007 |
| 7166232 |
Method for producing a solid body including a microstructure |
Jan. 23, 2007 |
| 7157377 |
Method of making a semiconductor device using treated photoresist |
Jan. 2, 2007 |
| 7135360 |
Liquid crystal display device and method of fabricating the same |
Nov. 14, 2006 |
| 7119006 |
Via formation for damascene metal conductors in an integrated circuit |
Oct. 10, 2006 |
| 7087440 |
Monitoring of nitrided oxide gate dielectrics by determination of a wet etch |
Aug. 8, 2006 |
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