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Class Information
Number: 438/704
Name: Semiconductor device manufacturing: process > Chemical etching > Having liquid and vapor etching steps
Description: Processes having a liquid (i.e., wet) chemical etching step and a gaseous (i.e., dry) chemical etching step.


Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
4624740 Tailoring of via-hole sidewall slope Nov. 25, 1986
4615102 Method of producing enhancement mode and depletion mode FETs Oct. 7, 1986
4584055 Method for manufacturing a semiconductor device Apr. 22, 1986
4543320 Method of making a high performance, small area thin film transistor Sep. 24, 1985
4541892 Process for the positioning of an interconnection line on an electrical contact hole of an integrated circuit Sep. 17, 1985
4536249 Integrated circuit processing methods Aug. 20, 1985
4534826 Trench etch process for dielectric isolation Aug. 13, 1985
4468285 Plasma etch process for single-crystal silicon with improved selectivity to silicon dioxide Aug. 28, 1984
4456501 Process for dislocation-free slot isolations in device fabrication Jun. 26, 1984
4449285 Method for producing a vertical channel transistor May. 22, 1984
4447291 Method for via formation in HgCdTe May. 8, 1984
4398992 Defect free zero oxide encroachment process for semiconductor fabrication Aug. 16, 1983
4387145 Lift-off shadow mask Jun. 7, 1983
4372034 Process for forming contact openings through oxide layers Feb. 8, 1983
4354897 Process for forming contact through holes Oct. 19, 1982
4352724 Method of manufacturing a semiconductor device Oct. 5, 1982
4350563 Dry etching of metal film Sep. 21, 1982
4343677 Method for patterning films using reactive ion etching thereof Aug. 10, 1982
4341594 Method of restoring semiconductor device performance Jul. 27, 1982
4325181 Simplified fabrication method for high-performance FET Apr. 20, 1982
4318751 Self-aligned process for providing an improved high performance bipolar transistor Mar. 9, 1982
4267012 Process for patterning metal connections on a semiconductor structure by using a tungsten-titanium etch resistant layer May. 12, 1981
4057460 Plasma etching process Nov. 8, 1977
4035208 Method of patterning Cr-Pt-Au metallization for silicon devices Jul. 12, 1977

1 2 3 4 5 6 7 8 9


 
 
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