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Class Information
Number: 438/704
Name: Semiconductor device manufacturing: process > Chemical etching > Having liquid and vapor etching steps
Description: Processes having a liquid (i.e., wet) chemical etching step and a gaseous (i.e., dry) chemical etching step.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6830979 |
Method for fabricating semiconductor device |
Dec. 14, 2004 |
| 6828193 |
Methods of forming hemispherical grained silicon on a template on a semiconductor work object |
Dec. 7, 2004 |
| 6825128 |
Method for manufacturing semiconductor device |
Nov. 30, 2004 |
| 6825121 |
Method of manufacturing a capacitor of a semiconductor device |
Nov. 30, 2004 |
| 6821902 |
Electroless plating liquid and semiconductor device |
Nov. 23, 2004 |
| 6818488 |
Process for making a gate for a short channel CMOS transistor structure |
Nov. 16, 2004 |
| 6812120 |
Method of forming floating gate of memory device |
Nov. 2, 2004 |
| 6809004 |
Method of forming a shallow trench isolation |
Oct. 26, 2004 |
| 6806196 |
High precision integrated circuit capacitors |
Oct. 19, 2004 |
| 6797632 |
Bonded wafer producing method and bonded wafer |
Sep. 28, 2004 |
| 6794303 |
Two stage etching of silicon nitride to form a nitride spacer |
Sep. 21, 2004 |
| 6790786 |
Etching processes for integrated circuit manufacturing including methods of forming capacitors |
Sep. 14, 2004 |
| 6787052 |
Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers |
Sep. 7, 2004 |
| 6787390 |
Electrical and thermal contact for use in semiconductor devices |
Sep. 7, 2004 |
| 6777341 |
Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact |
Aug. 17, 2004 |
| 6770563 |
Process of forming a bottle-shaped trench |
Aug. 3, 2004 |
| 6766811 |
Method of removing smear from via holes |
Jul. 27, 2004 |
| 6767773 |
Method of Production of a thin film type semiconductor device having a heat-retaining layer |
Jul. 27, 2004 |
| 6764955 |
Semiconductor device having a contact window and fabrication method thereof |
Jul. 20, 2004 |
| 6762128 |
Apparatus and method for manufacturing a semiconductor circuit |
Jul. 13, 2004 |
| 6746945 |
Method of forming a via hole in a semiconductor device |
Jun. 8, 2004 |
| 6746966 |
Method to solve alignment mark blinded issues and a technology for application of semiconductor etching at a tiny area |
Jun. 8, 2004 |
| 6746615 |
Methods of achieving selective etching |
Jun. 8, 2004 |
| 6743729 |
Etching method and etching apparatus of carbon thin film |
Jun. 1, 2004 |
| 6740537 |
Process for fabricating a microelectromechanical optical component |
May. 25, 2004 |
| 6740595 |
Etch process for recessing polysilicon in trench structures |
May. 25, 2004 |
| 6737355 |
Thick thermal oxide layers and isolation regions in a silicon-containing substrate for high voltage applications |
May. 18, 2004 |
| 6737353 |
Semiconductor device having bump electrodes |
May. 18, 2004 |
| 6737202 |
Method of fabricating a tiered structure using a multi-layered resist stack and use |
May. 18, 2004 |
| 6737356 |
Method of fabricating a semiconductor work object |
May. 18, 2004 |
| 6734105 |
Method for forming silicon quantum dots and method for fabricating nonvolatile memory device using the same |
May. 11, 2004 |
| 6716757 |
Method for forming bottle trenches |
Apr. 6, 2004 |
| 6713440 |
Resist and etching by-product removing composition and resist removing method using the same |
Mar. 30, 2004 |
| 6712077 |
Method for forming capacitor |
Mar. 30, 2004 |
| 6696364 |
Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support |
Feb. 24, 2004 |
| 6689694 |
Micromechanical system fabrication method using (111) single crystalline silicon |
Feb. 10, 2004 |
| 6686271 |
Protective layers prior to alternating layer deposition |
Feb. 3, 2004 |
| 6686237 |
High precision integrated circuit capacitors |
Feb. 3, 2004 |
| 6682659 |
Method for forming corrosion inhibited conductor layer |
Jan. 27, 2004 |
| 6683008 |
Process of removing ion-implanted photoresist from a workpiece |
Jan. 27, 2004 |
| 6664192 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
Dec. 16, 2003 |
| 6656846 |
Apparatus for processing samples |
Dec. 2, 2003 |
| 6645869 |
Etching back process to improve topographic planarization of a polysilicon layer |
Nov. 11, 2003 |
| 6642148 |
RELACS shrink method applied for single print resist mask for LDD or buried bitline implants using chemically amplified DUV type photoresist |
Nov. 4, 2003 |
| 6635590 |
Apparatus and method for in-situ removal of polymer residue |
Oct. 21, 2003 |
| 6627553 |
Composition for removing side wall and method of removing side wall |
Sep. 30, 2003 |
| 6627548 |
Process for treating semiconductor substrates |
Sep. 30, 2003 |
| 6617252 |
Monolithic low dielectric constant platform for passive components and method |
Sep. 9, 2003 |
| 6617085 |
Wet etch reduction of gate widths |
Sep. 9, 2003 |
| 6613681 |
Method of removing etch residues |
Sep. 2, 2003 |
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