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Class Information
Number: 438/703
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Plural coating steps
Description: Processes having multiple material deposition steps.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6184144 |
Methods for growing defect-free heteroepitaxial layers |
Feb. 6, 2001 |
| 6174416 |
Micromechanical component production method |
Jan. 16, 2001 |
| 6171964 |
Method of forming a conductive spacer in a via |
Jan. 9, 2001 |
| 6156643 |
Method of forming a dual damascene trench and borderless via structure |
Dec. 5, 2000 |
| 6140247 |
Semiconductor device manufacturing method |
Oct. 31, 2000 |
| 6130164 |
Semiconductor device having gate oxide formed by selective oxide removal and method of manufacture thereof |
Oct. 10, 2000 |
| 6127258 |
Method for forming a semiconductor device |
Oct. 3, 2000 |
| 6127272 |
Method of electron beam lithography on very high resistivity substrates |
Oct. 3, 2000 |
| 6121145 |
Method of fabricating via and interconnection |
Sep. 19, 2000 |
| 6091132 |
Passivation for integrated circuit sensors |
Jul. 18, 2000 |
| 6077754 |
Methods of forming a silicon nitride film, a capacitor dielectric layer and a capacitor |
Jun. 20, 2000 |
| 6060398 |
Guard cell for etching |
May. 9, 2000 |
| 6059983 |
Method for fabricating an overcoated printed circuit board with contaminant-free areas |
May. 9, 2000 |
| 6043160 |
Method of manufacturing a monitor pad for chemical mechanical polishing planarization |
Mar. 28, 2000 |
| 6043151 |
Method for forming a semiconductor connection with a top surface having an enlarged recess |
Mar. 28, 2000 |
| 6040207 |
Oxide formation technique using thin film silicon deposition |
Mar. 21, 2000 |
| 6040619 |
Semiconductor device including antireflective etch stop layer |
Mar. 21, 2000 |
| 6036872 |
Method for making a wafer-pair having sealed chambers |
Mar. 14, 2000 |
| 6037261 |
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material |
Mar. 14, 2000 |
| 6033584 |
Process for reducing copper oxide during integrated circuit fabrication |
Mar. 7, 2000 |
| 6030900 |
Process for generating a space in a structure |
Feb. 29, 2000 |
| 6027860 |
Method for forming a structure using redeposition of etchable layer |
Feb. 22, 2000 |
| 6020267 |
Method for forming local interconnect metal structures via the addition of a titanium nitride anti-reflective coating |
Feb. 1, 2000 |
| 6020261 |
Process for forming high aspect ratio circuit features |
Feb. 1, 2000 |
| 6017823 |
Method of forming a MOS field effect transistor with improved gate side wall insulation films |
Jan. 25, 2000 |
| 6004875 |
Etch stop for use in etching of silicon oxide |
Dec. 21, 1999 |
| 5989997 |
Method for forming dual damascene structure |
Nov. 23, 1999 |
| 5981397 |
Integrated circuitry having a pair of adjacent conductive lines and method of forming |
Nov. 9, 1999 |
| 5972744 |
Quantum effect device, method of manufacturing the same |
Oct. 26, 1999 |
| 5968844 |
Method for etching nitride features in integrated circuit construction |
Oct. 19, 1999 |
| 5965939 |
Semiconductor device and a method of manufacture |
Oct. 12, 1999 |
| 5948701 |
Self-aligned contact (SAC) etching using polymer-building chemistry |
Sep. 7, 1999 |
| 5948280 |
Multilayer printed circuit board laminated with unreinforced resin |
Sep. 7, 1999 |
| 5928966 |
Method for manufacturing a stacked electrode for a semiconductor device |
Jul. 27, 1999 |
| 5902493 |
Method for forming micro patterns of semiconductor devices |
May. 11, 1999 |
| 5902126 |
Methods for forming integrated circuit capacitor electrodes including surrounding insulating sidewalls and spacers |
May. 11, 1999 |
| 5899750 |
Fine processing method |
May. 4, 1999 |
| 5891798 |
Method for forming a High dielectric constant insulator in the fabrication of an integrated circuit |
Apr. 6, 1999 |
| 5883705 |
Atomic force microscope for high speed imaging including integral actuator and sensor |
Mar. 16, 1999 |
| 5882978 |
Methods of forming a silicon nitride film, a capacitor dielectric layer and a capacitor |
Mar. 16, 1999 |
| 5882489 |
Processes for cleaning and stripping photoresist from surfaces of semiconductor wafers |
Mar. 16, 1999 |
| 5880003 |
Method of giving a substantially flat surface of a semiconductor device through a polishing operation |
Mar. 9, 1999 |
| 5858854 |
Method for forming high contrast alignment marks |
Jan. 12, 1999 |
| 5849635 |
Semiconductor processing method of forming an insulating dielectric layer and a contact opening therein |
Dec. 15, 1998 |
| 5833817 |
Method for improving conformity and contact bottom coverage of sputtered titanium nitride barrier layers |
Nov. 10, 1998 |
| 5827780 |
Additive metalization using photosensitive polymer as RIE mask and part of composite insulator |
Oct. 27, 1998 |
| 5814552 |
High step process for manufacturing alignment marks for twin-well integrated circuit devices |
Sep. 29, 1998 |
| 5814186 |
SOG etchant gas and method for using same |
Sep. 29, 1998 |
| 5804515 |
Method for forming contact holes of semiconductor device |
Sep. 8, 1998 |
| 5795825 |
Connection layer forming method |
Aug. 18, 1998 |
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