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Class Information
Number: 438/703
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Plural coating steps
Description: Processes having multiple material deposition steps.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6613680 |
Method of manufacturing a semiconductor device |
Sep. 2, 2003 |
| 6589854 |
Method of forming shallow trench isolation |
Jul. 8, 2003 |
| 6589877 |
Method of providing an oxide |
Jul. 8, 2003 |
| 6579812 |
Method for removing residual polymer after the dry etching process and reducing oxide loss |
Jun. 17, 2003 |
| 6579742 |
Fabrication of molecular electronic circuit by imprinting |
Jun. 17, 2003 |
| 6555201 |
Method for fabricating a microelectromechanical bearing |
Apr. 29, 2003 |
| 6548412 |
Method of forming patterned thin film |
Apr. 15, 2003 |
| 6531067 |
Method for forming contact hole |
Mar. 11, 2003 |
| 6523494 |
Apparatus for depositing low dielectric constant oxide film |
Feb. 25, 2003 |
| 6514805 |
Trench sidewall profile for device isolation |
Feb. 4, 2003 |
| 6498105 |
Method of forming fine patterns of a semiconductor device |
Dec. 24, 2002 |
| 6492281 |
Method of fabricating conductor structures with metal comb bridging avoidance |
Dec. 10, 2002 |
| 6479360 |
Semiconductor device and manufacturing method |
Nov. 12, 2002 |
| 6461966 |
Method of high density plasma phosphosilicate glass process on pre-metal dielectric application for plasma damage reducing and throughput improvement |
Oct. 8, 2002 |
| 6458516 |
Method of etching dielectric layers using a removable hardmask |
Oct. 1, 2002 |
| 6458708 |
Method for forming metal wiring in semiconductor device |
Oct. 1, 2002 |
| 6451678 |
Method of reducing overetch during the formation of a semiconductor device |
Sep. 17, 2002 |
| 6451698 |
System and method for preventing electrochemical erosion by depositing a protective film |
Sep. 17, 2002 |
| 6444513 |
Metal gate stack with etch stop layer having implanted metal species |
Sep. 3, 2002 |
| 6440860 |
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride |
Aug. 27, 2002 |
| 6436836 |
Method of fabricating a DRAM cell configuration |
Aug. 20, 2002 |
| 6432740 |
Fabrication of molecular electronic circuit by imprinting |
Aug. 13, 2002 |
| 6426287 |
Method for forming a semiconductor connection with a top surface having an enlarged recess |
Jul. 30, 2002 |
| 6410452 |
Method of manufacturing semiconductor device |
Jun. 25, 2002 |
| 6406995 |
Pattern-sensitive deposition for damascene processing |
Jun. 18, 2002 |
| 6406982 |
Method of improving epitaxially-filled trench by smoothing trench prior to filling |
Jun. 18, 2002 |
| 6391783 |
Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique |
May. 21, 2002 |
| 6365524 |
Method for making a concave bottom oxide within a trench |
Apr. 2, 2002 |
| 6365509 |
Semiconductor manufacturing method using a dielectric photomask |
Apr. 2, 2002 |
| 6358856 |
Bright field image reversal for contact hole patterning |
Mar. 19, 2002 |
| 6358838 |
Semiconductor device and process for producing the same |
Mar. 19, 2002 |
| 6352933 |
Methods of forming insulating materials between conductive components and methods of forming insulating materials around a conductive component |
Mar. 5, 2002 |
| 6339027 |
Process for borderless stop in tin via formation |
Jan. 15, 2002 |
| 6323138 |
Capacitor, methods of forming capacitors, methods for forming silicon nitride layers on silicon-comprising substrates, and methods of densifying silicon nitride layers |
Nov. 27, 2001 |
| 6277731 |
Method for forming a semiconductor connection with a top surface having an enlarged recess |
Aug. 21, 2001 |
| 6274493 |
Method for forming a via |
Aug. 14, 2001 |
| 6268620 |
Method of forming capacitors on integrated circuit |
Jul. 31, 2001 |
| 6255218 |
Semiconductor device and fabrication method thereof |
Jul. 3, 2001 |
| 6251470 |
Methods of forming insulating materials, and methods of forming insulating materials around a conductive component |
Jun. 26, 2001 |
| 6245642 |
Process for planarizing buried oxide films in trenches by applying sequential diverse CMP treatments |
Jun. 12, 2001 |
| 6246070 |
Semiconductor device provided with semiconductor circuit made of semiconductor element and method of fabricating the same |
Jun. 12, 2001 |
| 6242337 |
Semiconductor device and method of manufacturing the same |
Jun. 5, 2001 |
| 6239035 |
Semiconductor wafer fabrication |
May. 29, 2001 |
| 6238936 |
Method of using critical dimension mapping to qualify a new integrated circuit fabrication etch process |
May. 29, 2001 |
| 6232218 |
Etch stop for use in etching of silicon oxide |
May. 15, 2001 |
| 6221780 |
Dual damascene flowable oxide insulation structure and metallic barrier |
Apr. 24, 2001 |
| 6214735 |
Method for planarizing a semiconductor substrate |
Apr. 10, 2001 |
| 6207574 |
Method for fabricating a DRAM cell storage node |
Mar. 27, 2001 |
| 6194320 |
Method for preparing a semiconductor device |
Feb. 27, 2001 |
| 6190233 |
Method and apparatus for improving gap-fill capability using chemical and physical etchbacks |
Feb. 20, 2001 |
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