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Class Information
Number: 438/702
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench > Plural coating steps
Description: Processes wherein the viahole or trench is formed by a process having multiple material deposition steps.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5578524 |
Fabrication process of a semiconductor device with a wiring structure |
Nov. 26, 1996 |
| 5569355 |
Method for fabrication of microchannel electron multipliers |
Oct. 29, 1996 |
| 5567270 |
Process of forming contacts and vias having tapered sidewall |
Oct. 22, 1996 |
| 5567659 |
Method of etching patterns in III-V material with accurate depth control |
Oct. 22, 1996 |
| 5565384 |
Self-aligned via using low permittivity dielectric |
Oct. 15, 1996 |
| 5565376 |
Device isolation technology by liquid phase deposition |
Oct. 15, 1996 |
| 5563102 |
Method of sealing integrated circuits |
Oct. 8, 1996 |
| 5559058 |
Method for producing native oxides on compound semiconductors |
Sep. 24, 1996 |
| 5554256 |
Method of manufacturing a semiconductor device having a semiconductor body with field insulation regions formed by grooves filled with insulating material |
Sep. 10, 1996 |
| 5552344 |
Non-etchback self-aligned via size reduction method employing ozone assisted chemical vapor deposited silicon oxide |
Sep. 3, 1996 |
| 5543013 |
Method of forming a microstructure with bare silicon ground plane |
Aug. 6, 1996 |
| 5538592 |
Non-random sub-lithography vertical stack capacitor |
Jul. 23, 1996 |
| 5538592 |
Non-random sub-lithography vertical stack capacitor |
Jul. 23, 1996 |
| 5512513 |
Method of fabricating semiconductor device with water protective film |
Apr. 30, 1996 |
| 5510286 |
Method for forming narrow contact holes of a semiconductor device |
Apr. 23, 1996 |
| 5500080 |
Process of forming contact holes |
Mar. 19, 1996 |
| 5498570 |
Method of reducing overetch during the formation of a semiconductor device |
Mar. 12, 1996 |
| 5488011 |
Method of forming contact areas between vertical conductors |
Jan. 30, 1996 |
| 5482882 |
Method for forming most capacitor using polysilicon islands |
Jan. 9, 1996 |
| 5478438 |
Method of etching semiconductor substrate |
Dec. 26, 1995 |
| 5478460 |
Electrolyte composition for screen printing and miniaturized oxygen electrode and production process thereof |
Dec. 26, 1995 |
| 5476807 |
Method for forming fine patterns in a semiconductor device |
Dec. 19, 1995 |
| 5472885 |
Method of producing solar cell |
Dec. 5, 1995 |
| 5472562 |
Method of etching silicon nitride |
Dec. 5, 1995 |
| 5472913 |
Method of fabricating porous dielectric material with a passivation layer for electronics applications |
Dec. 5, 1995 |
| 5470797 |
Method for producing a silicon-on-insulator capacitive surface micromachined absolute pressure sensor |
Nov. 28, 1995 |
| 5466640 |
Method for forming a metal wire of a semiconductor device |
Nov. 14, 1995 |
| 5466640 |
Method for forming a metal wire of a semiconductor device |
Nov. 14, 1995 |
| 5466630 |
Silicon-on-insulator technique with buried gap |
Nov. 14, 1995 |
| 5466630 |
Silicon-on-insulator technique with buried gap |
Nov. 14, 1995 |
| 5459095 |
Method for making capacitor for use in DRAM cell using triple layers of photoresist |
Oct. 17, 1995 |
| 5459086 |
Metal via sidewall tilt angle implant for SOG |
Oct. 17, 1995 |
| 5457073 |
Multi-level interconnection CMOS devices with SOG |
Oct. 10, 1995 |
| 5453157 |
Low temperature anisotropic ashing of resist for semiconductor fabrication |
Sep. 26, 1995 |
| 5451543 |
Straight sidewall profile contact opening to underlying interconnect and method for making the same |
Sep. 19, 1995 |
| 5451541 |
Method for fabricating a semiconductor device |
Sep. 19, 1995 |
| 5451291 |
Method for forming a via contact hole of a semiconductor device |
Sep. 19, 1995 |
| 5449644 |
Process for contact hole formation using a sacrificial SOG layer |
Sep. 12, 1995 |
| 5447884 |
Shallow trench isolation with thin nitride liner |
Sep. 5, 1995 |
| 5444021 |
Method for making a contact hole of a semiconductor device |
Aug. 22, 1995 |
| 5437763 |
Method for formation of contact vias in integrated circuits |
Aug. 1, 1995 |
| 5438023 |
Passivation method and structure for a ferroelectric integrated circuit using hard ceramic materials or the like |
Aug. 1, 1995 |
| 5436188 |
Dram cell process having elk horn shaped capacitor |
Jul. 25, 1995 |
| 5433823 |
Selective dry-etching of bi-layer passivation films |
Jul. 18, 1995 |
| 5434109 |
Oxidation of silicon nitride in semiconductor devices |
Jul. 18, 1995 |
| 5432113 |
Method of making a semiconductor memory device |
Jul. 11, 1995 |
| 5429993 |
Semiconductor accelerometer and method of its manufacture |
Jul. 4, 1995 |
| 5429990 |
Spin-on-glass planarization process with ion implantation |
Jul. 4, 1995 |
| 5427975 |
Method of micromachining an integrated sensor on the surface of a silicon wafer |
Jun. 27, 1995 |
| 5425845 |
Method for selective removal of hard trench masks |
Jun. 20, 1995 |
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