| |
 |
|
Class Information
Number: 438/702
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench > Plural coating steps
Description: Processes wherein the viahole or trench is formed by a process having multiple material deposition steps.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5023204 |
Method of manufacturing semiconductor device using silicone protective layer |
Jun. 11, 1991 |
| 5013680 |
Process for fabricating a DRAM array having feature widths that transcend the resolution limit of available photolithography |
May. 7, 1991 |
| 5013689 |
Method of forming a passivation film |
May. 7, 1991 |
| 5011568 |
Use of sol-gel derived tantalum oxide as a protective coating for etching silicon |
Apr. 30, 1991 |
| 5010039 |
Method of forming contacts to a semiconductor device |
Apr. 23, 1991 |
| 5006485 |
Method of manufacturing an intergrated circuit including steps for forming interconnections between patterns formed at different levels |
Apr. 9, 1991 |
| 5004703 |
Multiple trench semiconductor structure method |
Apr. 2, 1991 |
| 5002902 |
Method for fabricating a semiconductor device including the step of forming an alignment mark |
Mar. 26, 1991 |
| 5001085 |
Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches |
Mar. 19, 1991 |
| 4990467 |
Method of preventing residue on an insulator layer in the fabrication of a semiconductor device |
Feb. 5, 1991 |
| 4987101 |
Method for providing improved insulation in VLSI and ULSI circuits |
Jan. 22, 1991 |
| 4977105 |
Method for manufacturing interconnection structure in semiconductor device |
Dec. 11, 1990 |
| 4966870 |
Method for making borderless contacts |
Oct. 30, 1990 |
| 4960727 |
Method for forming a dielectric filled trench |
Oct. 2, 1990 |
| 4956312 |
Method of manufacturing a semiconductor device |
Sep. 11, 1990 |
| 4954218 |
Method for etching a pattern |
Sep. 4, 1990 |
| 4944682 |
Method of forming borderless contacts |
Jul. 31, 1990 |
| 4945069 |
Organic space holder for trench processing |
Jul. 31, 1990 |
| 4933305 |
Process of wire bonding for semiconductor device |
Jun. 12, 1990 |
| 4900692 |
Method of forming an oxide liner and active area mask for selective epitaxial growth in an isolation trench |
Feb. 13, 1990 |
| 4892635 |
Pattern transfer process utilizing multilevel resist structure for fabricating integrated-circuit devices |
Jan. 9, 1990 |
| 4890370 |
Manufacturing method for integrated resonator |
Jan. 2, 1990 |
| 4883767 |
Method of fabricating self aligned semiconductor devices |
Nov. 28, 1989 |
| 4859622 |
Method of making a trench capacitor for dram |
Aug. 22, 1989 |
| 4837176 |
Integrated circuit structures having polycrystalline electrode contacts and process |
Jun. 6, 1989 |
| 4821094 |
Gate alignment procedure in fabricating semiconductor devices |
Apr. 11, 1989 |
| 4818725 |
Technique for forming planarized gate structure |
Apr. 4, 1989 |
| 4808552 |
Process for making vertically-oriented interconnections for VLSI devices |
Feb. 28, 1989 |
| 4807016 |
Dry etch of phosphosilicate glass with selectivity to undoped oxide |
Feb. 21, 1989 |
| 4801350 |
Method for obtaining submicron features from optical lithography technology |
Jan. 31, 1989 |
| 4799990 |
Method of self-aligning a trench isolation structure to an implanted well region |
Jan. 24, 1989 |
| 4780428 |
Mosfet semiconductor device and manufacturing method thereof |
Oct. 25, 1988 |
| 4757033 |
Semiconductor device manufacturing by sequential ion and wet etchings prior to lift-off metallization |
Jul. 12, 1988 |
| 4750971 |
Method of manufacturing a semiconductor device |
Jun. 14, 1988 |
| 4741802 |
Method for manufacturing semiconductor device |
May. 3, 1988 |
| 4735681 |
Fabrication method for sub-micron trench |
Apr. 5, 1988 |
| 4732871 |
Process for producing undercut dummy gate mask profiles for MESFETs |
Mar. 22, 1988 |
| 4728997 |
Method of fabricating a light image detector and a linear image detector obtained by this method |
Mar. 1, 1988 |
| 4717689 |
Method of forming semimicron grooves in semiconductor material |
Jan. 5, 1988 |
| 4717449 |
Dielectric barrier material |
Jan. 5, 1988 |
| 4715109 |
Method of forming a high density vertical stud titanium silicide for reachup contact applications |
Dec. 29, 1987 |
| 4714518 |
Dual layer encapsulation coating for III-V semiconductor compounds |
Dec. 22, 1987 |
| 4707218 |
Lithographic image size reduction |
Nov. 17, 1987 |
| 4692998 |
Process for fabricating semiconductor components |
Sep. 15, 1987 |
| 4693781 |
Trench formation process |
Sep. 15, 1987 |
| 4686763 |
Method of making a planar polysilicon bipolar device |
Aug. 18, 1987 |
| 4686000 |
Self-aligned contact process |
Aug. 11, 1987 |
| 4683024 |
Device fabrication method using spin-on glass resins |
Jul. 28, 1987 |
| 4679306 |
Self-aligned process for forming dielectrically isolating regions formed in semiconductor device |
Jul. 14, 1987 |
| 4675984 |
Method of exposing only the top surface of a mesa |
Jun. 30, 1987 |
|
|
|
