| Patent Number |
Title Of Patent |
Date Issued |
| 5759869 |
Method to imporve metal step coverage by contact reflow |
Jun. 2, 1998 |
| 5753561 |
Method for making shallow trench isolation structure having rounded corners |
May. 19, 1998 |
| 5746884 |
Fluted via formation for superior metal step coverage |
May. 5, 1998 |
| 5728608 |
Tapered dielectric etch in semiconductor devices |
Mar. 17, 1998 |
| 5716218 |
Process for manufacturing an interconnect for testing a semiconductor die |
Feb. 10, 1998 |
| 5714407 |
Etching agent, electronic device and method of manufacturing the device |
Feb. 3, 1998 |
| 5714038 |
Method for forming contact hole of semiconductor device |
Feb. 3, 1998 |
| 5711891 |
Wafer processing using thermal nitride etch mask |
Jan. 27, 1998 |
| 5700382 |
Method for fabricating a silicon semiconductor substrate having an integrated waveguide and an optical fiber coupled thereto |
Dec. 23, 1997 |
| 5686339 |
High dielectric constant capacitor and a fabricating method thereof |
Nov. 11, 1997 |
| 5686337 |
Method for fabricating stacked capacitors in a DRAM cell |
Nov. 11, 1997 |
| 5683908 |
Method of fabricating trench isolation structure having tapered opening |
Nov. 4, 1997 |
| 5677242 |
Process of fabricating semiconductor integrated circuit device having small geometry contact by using spacer on photoresist mask |
Oct. 14, 1997 |
| 5672241 |
Method of forming metal contact holes in semiconductor fabrication |
Sep. 30, 1997 |
| 5663091 |
Method for fabricating an electrically programmable antifuse |
Sep. 2, 1997 |
| 5662814 |
Micro-machining minute hollow using native oxide membrane |
Sep. 2, 1997 |
| 5662768 |
High surface area trenches for an integrated ciruit device |
Sep. 2, 1997 |
| 5658829 |
Semiconductor processing method of forming an electrically conductive contact plug |
Aug. 19, 1997 |
| 5652172 |
Method for controlling the etch profile of an aperture formed through a multi-layer insulator layer |
Jul. 29, 1997 |
| 5633197 |
Metallization to improve electromigration resistance by etching concavo-concave opening |
May. 27, 1997 |
| 5629237 |
Taper etching without re-entrance profile |
May. 13, 1997 |
| 5622883 |
Method for manufacturing semiconductor memory device having landing pad |
Apr. 22, 1997 |
| 5621556 |
Method of manufacturing active matrix LCD using five masks |
Apr. 15, 1997 |
| 5612252 |
Method of forming metallization to improve electromigration resistance |
Mar. 18, 1997 |
| 5610090 |
Method of making a FET having a recessed gate structure |
Mar. 11, 1997 |
| 5605864 |
Method for forming a semiconductor buried contact with a removable spacer |
Feb. 25, 1997 |
| 5591675 |
Interconnecting method for semiconductor device |
Jan. 7, 1997 |
| 5580821 |
Semiconductor processing method of forming an electrically conductive contact plug |
Dec. 3, 1996 |
| 5578528 |
Method of fabrication glass diaphragm on silicon macrostructure |
Nov. 26, 1996 |
| 5578518 |
Method of manufacturing a trench isolation having round corners |
Nov. 26, 1996 |
| 5567270 |
Process of forming contacts and vias having tapered sidewall |
Oct. 22, 1996 |
| 5565381 |
Method of removing sharp edges in a dielectric coating located above a semiconductor substrate and a semiconductor device formed by this method |
Oct. 15, 1996 |
| 5556797 |
Method of fabricating a self-aligned double recess gate profile |
Sep. 17, 1996 |
| 5552343 |
Method for tapered contact formation |
Sep. 3, 1996 |
| 5552342 |
Method for producing a contact hole in a semiconductor device using reflow and etch |
Sep. 3, 1996 |
| 5550088 |
Fabrication process for a self-aligned optical subassembly |
Aug. 27, 1996 |
| 5545581 |
Plug strap process utilizing selective nitride and oxide etches |
Aug. 13, 1996 |
| 5543351 |
Method of producing electrically insulated silicon structure |
Aug. 6, 1996 |
| 5534452 |
Method for producing semiconductor device |
Jul. 9, 1996 |
| 5522966 |
Dry etching process for semiconductor |
Jun. 4, 1996 |
| 5520297 |
Aperture plate and a method of manufacturing the same |
May. 28, 1996 |
| 5510294 |
Method of forming vias for multilevel metallization |
Apr. 23, 1996 |
| 5507911 |
Monolithic micromechanical vibrating string accelerometer with trimmable resonant frequency |
Apr. 16, 1996 |
| 5500080 |
Process of forming contact holes |
Mar. 19, 1996 |
| 5492868 |
Capped reflow process to avoid contact autodoping and supress tungsten silicide peeling |
Feb. 20, 1996 |
| 5491100 |
Method for manufacturing a semiconductor device having a contact window structure |
Feb. 13, 1996 |
| 5484507 |
Self compensating process for aligning an aperture with crystal planes in a substrate |
Jan. 16, 1996 |
| 5470781 |
Method to reduce stress from trench structure on SOI wafer |
Nov. 28, 1995 |
| 5470790 |
Via hole profile and method of fabrication |
Nov. 28, 1995 |
| 5458734 |
Method of fabricating a semiconductor device |
Oct. 17, 1995 |
