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Class Information
Number: 438/701
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench > Tapered configuration
Description: Processes wherein the viahole or trench is formed so as to possess nonparallel sides.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6037265 |
Etchant gas and a method for etching transistor gates |
Mar. 14, 2000 |
| 6025277 |
Method and structure for preventing bonding pad peel back |
Feb. 15, 2000 |
| 6010957 |
Semiconductor device having tapered conductive lines and fabrication thereof |
Jan. 4, 2000 |
| 6010953 |
Method for forming a semiconductor buried contact with a removable spacer |
Jan. 4, 2000 |
| 5998301 |
Method and system for providing tapered shallow trench isolation structure profile |
Dec. 7, 1999 |
| 5994220 |
Method for forming a semiconductor connection with a top surface having an enlarged recess |
Nov. 30, 1999 |
| 5994228 |
Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes |
Nov. 30, 1999 |
| 5989997 |
Method for forming dual damascene structure |
Nov. 23, 1999 |
| 5981397 |
Integrated circuitry having a pair of adjacent conductive lines and method of forming |
Nov. 9, 1999 |
| 5976985 |
Processing methods of forming contact openings and integrated circuitry |
Nov. 2, 1999 |
| 5946593 |
Semiconductor device manufacturing method |
Aug. 31, 1999 |
| 5940731 |
Method for forming tapered polysilicon plug and plug formed |
Aug. 17, 1999 |
| 5937309 |
Method for fabricating shallow trench isolation structure |
Aug. 10, 1999 |
| 5933755 |
Method of fabricating contact sites for microelectronic devices |
Aug. 3, 1999 |
| 5933715 |
Process for manufacturing discrete electronic devices |
Aug. 3, 1999 |
| 5930644 |
Method of forming a shallow trench isolation using oxide slope etching |
Jul. 27, 1999 |
| 5926735 |
Method of forming semiconductor device |
Jul. 20, 1999 |
| 5926725 |
Method of manufacturing semiconductor devices with a reverse tapered sectional configuration |
Jul. 20, 1999 |
| 5920781 |
Method of making semiconductor device |
Jul. 6, 1999 |
| 5914189 |
Protected thermal barrier coating composite with multiple coatings |
Jun. 22, 1999 |
| 5913148 |
Reduced size etching method for integrated circuits |
Jun. 15, 1999 |
| 5912185 |
Methods for forming contact holes having improved sidewall profiles |
Jun. 15, 1999 |
| 5897374 |
Vertical via/contact with undercut dielectric |
Apr. 27, 1999 |
| 5895271 |
Metal film forming method |
Apr. 20, 1999 |
| 5895253 |
Trench isolation for CMOS devices |
Apr. 20, 1999 |
| 5895937 |
Tapered dielectric etch in semiconductor devices |
Apr. 20, 1999 |
| 5893757 |
Tapered profile etching method |
Apr. 13, 1999 |
| 5891771 |
Recessed structure for shallow trench isolation and salicide process |
Apr. 6, 1999 |
| 5883002 |
Method of forming contact profile by improving TEOS/BPSG selectivity for manufacturing a semiconductor device |
Mar. 16, 1999 |
| 5882968 |
Semiconductor device fabrication method |
Mar. 16, 1999 |
| 5882982 |
Trench isolation method |
Mar. 16, 1999 |
| 5880030 |
Unlanded via structure and method for making same |
Mar. 9, 1999 |
| 5880019 |
Insitu contact descum for self-aligned contact process |
Mar. 9, 1999 |
| 5880005 |
Method for forming a tapered profile insulator shape |
Mar. 9, 1999 |
| 5880004 |
Trench isolation process |
Mar. 9, 1999 |
| 5874358 |
Via hole profile and method of fabrication |
Feb. 23, 1999 |
| 5864180 |
Semiconductor device and method for manufacturing the same |
Jan. 26, 1999 |
| 5858859 |
Semiconductor device having a trench for device isolation fabrication method |
Jan. 12, 1999 |
| 5858824 |
Method of forming fine electrode on semiconductor substrate |
Jan. 12, 1999 |
| 5854140 |
Method of making an aluminum contact |
Dec. 29, 1998 |
| 5854509 |
Method of fabricating semiconductor device and semiconductor device |
Dec. 29, 1998 |
| 5849611 |
Method for forming a taper shaped contact hole by oxidizing a wiring |
Dec. 15, 1998 |
| 5841195 |
Semiconductor contact via structure |
Nov. 24, 1998 |
| 5807789 |
Method for forming a shallow trench with tapered profile and round corners for the application of shallow trench isolation (STI) |
Sep. 15, 1998 |
| 5801083 |
Use of polymer spacers for the fabrication of shallow trench isolation regions with rounded top corners |
Sep. 1, 1998 |
| 5795814 |
Method for manufacturing semiconductor device having groove-type isolation area |
Aug. 18, 1998 |
| 5795823 |
Self aligned via dual damascene |
Aug. 18, 1998 |
| 5795825 |
Connection layer forming method |
Aug. 18, 1998 |
| 5786632 |
Semiconductor package |
Jul. 28, 1998 |
| 5767019 |
Method for forming a fine contact hole in a semiconductor device |
Jun. 16, 1998 |
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