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Class Information
Number: 438/701
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench > Tapered configuration
Description: Processes wherein the viahole or trench is formed so as to possess nonparallel sides.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4445270 |
Low resistance contact for high density integrated circuit |
May. 1, 1984 |
| 4439270 |
Process for the controlled etching of tapered vias in borosilicate glass dielectrics |
Mar. 27, 1984 |
| 4420503 |
Low temperature elevated pressure glass flow/re-flow process |
Dec. 13, 1983 |
| 4411735 |
Polymeric insulation layer etching process and composition |
Oct. 25, 1983 |
| 4409319 |
Electron beam exposed positive resist mask process |
Oct. 11, 1983 |
| 4404733 |
Method of producing semiconductor devices |
Sep. 20, 1983 |
| 4390393 |
Method of forming an isolation trench in a semiconductor substrate |
Jun. 28, 1983 |
| 4389294 |
Method for avoiding residue on a vertical walled mesa |
Jun. 21, 1983 |
| 4389429 |
Method of forming integrated circuit chip transmission line |
Jun. 21, 1983 |
| 4363830 |
Method of forming tapered contact holes for integrated circuit devices |
Dec. 14, 1982 |
| 4356056 |
Process for insulating the interconnections of integrated circuits |
Oct. 26, 1982 |
| 4349584 |
Process for tapering openings in ternary glass coatings |
Sep. 14, 1982 |
| 4342617 |
Process for forming opening having tapered sides in a plasma nitride layer |
Aug. 3, 1982 |
| 4341010 |
Fabrication of electroluminescent semiconductor device utilizing selective etching and epitaxial deposition |
Jul. 27, 1982 |
| 4334349 |
Method of producing semiconductor device |
Jun. 15, 1982 |
| 4326771 |
Method of coupling between an optical fiber and an optoelectronic diode, and a transmitting or receiving head fabricated by means of said method |
Apr. 27, 1982 |
| 4307180 |
Process of forming recessed dielectric regions in a monocrystalline silicon substrate |
Dec. 22, 1981 |
| 4299862 |
Etching windows in thick dielectric coatings overlying semiconductor device surfaces |
Nov. 10, 1981 |
| 4286374 |
Large scale integrated circuit production |
Sep. 1, 1981 |
| 4284659 |
Insulation layer reflow |
Aug. 18, 1981 |
| 4279690 |
High-radiance emitters with integral microlens |
Jul. 21, 1981 |
| 4273805 |
Passivating composite for a semiconductor device comprising a silicon nitride (Si.sub.1 3N.sub.4) layer and phosphosilicate glass (PSG) layer |
Jun. 16, 1981 |
| 4256514 |
Method for forming a narrow dimensioned region on a body |
Mar. 17, 1981 |
| 4224089 |
Process for producing a semiconductor device |
Sep. 23, 1980 |
| 4218283 |
Method for fabricating semiconductor device and etchant for polymer resin |
Aug. 19, 1980 |
| 4210689 |
Method of producing semiconductor devices |
Jul. 1, 1980 |
| 4181564 |
Fabrication of patterned silicon nitride insulating layers having gently sloping sidewalls |
Jan. 1, 1980 |
| 4148133 |
Polysilicon mask for etching thick insulator |
Apr. 10, 1979 |
| 4104085 |
Method of manufacturing a semiconductor device by implanting ions through bevelled oxide layer in single masking step |
Aug. 1, 1978 |
| 4070501 |
Forming self-aligned via holes in thin film interconnection systems |
Jan. 24, 1978 |
| 4059480 |
Method of forming viaducts in semiconductor material |
Nov. 22, 1977 |
| 4052251 |
Method of etching sapphire utilizing sulfur hexafluoride |
Oct. 4, 1977 |
| 4040891 |
Etching process utilizing the same positive photoresist layer for two etching steps |
Aug. 9, 1977 |
| 4007104 |
Mesa fabrication process |
Feb. 8, 1977 |
| 3986200 |
Semiconductor structure and method |
Oct. 12, 1976 |
| 3980508 |
Process of producing semiconductor device |
Sep. 14, 1976 |
| 3958323 |
Three mask self aligned IGFET fabrication process |
May. 25, 1976 |
| 3947298 |
Method of forming junction regions utilizing R.F. sputtering |
Mar. 30, 1976 |
| 3945030 |
Semiconductor structure having contact openings with sloped side walls |
Mar. 16, 1976 |
| 3930305 |
Method for manufacturing integrated circuits |
Jan. 6, 1976 |
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