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Class Information
Number: 438/700
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench
Description: Processes wherein at least one groove or trench is formed by a combination of chemical etching and material deposition.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7335593 |
Method of fabricating semiconductor device |
Feb. 26, 2008 |
| 7335554 |
Method for fabricating semiconductor |
Feb. 26, 2008 |
| 7327013 |
Stencil mask with charge-up prevention and method of manufacturing the same |
Feb. 5, 2008 |
| 7326650 |
Method of etching dual damascene structure |
Feb. 5, 2008 |
| 7323417 |
Method of forming a recessed structure employing a reverse tone process |
Jan. 29, 2008 |
| 7323410 |
Dry etchback of interconnect contacts |
Jan. 29, 2008 |
| 7323115 |
Substrate processing method and ink jet recording head substrate manufacturing method |
Jan. 29, 2008 |
| 7320927 |
In situ hardmask pullback using an in situ plasma resist trim process |
Jan. 22, 2008 |
| 7320908 |
Methods of forming semiconductor devices having buried oxide patterns |
Jan. 22, 2008 |
| 7319073 |
Method of reducing silicon damage around laser marking region of wafers in STI CMP process |
Jan. 15, 2008 |
| 7316978 |
Method for forming recesses |
Jan. 8, 2008 |
| 7316949 |
Integrating n-type and p-type metal gate transistors |
Jan. 8, 2008 |
| 7314792 |
Method for fabricating transistor of semiconductor device |
Jan. 1, 2008 |
| 7309654 |
Technique for reducing etch damage during the formation of vias and trenches in interlayer dielectrics |
Dec. 18, 2007 |
| 7309641 |
Method for rounding bottom corners of trench and shallow trench isolation process |
Dec. 18, 2007 |
| 7307023 |
Polishing method of Cu film and method for manufacturing semiconductor device |
Dec. 11, 2007 |
| 7307014 |
Method of forming a via contact structure using a dual damascene process |
Dec. 11, 2007 |
| 7300882 |
Etching method and semiconductor device fabricating method |
Nov. 27, 2007 |
| 7300879 |
Methods of fabricating metal wiring in semiconductor devices |
Nov. 27, 2007 |
| 7300848 |
Semiconductor device having a recess gate for improved reliability |
Nov. 27, 2007 |
| 7297634 |
Method and apparatus for semiconductor device and semiconductor memory device |
Nov. 20, 2007 |
| 7297633 |
Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection |
Nov. 20, 2007 |
| 7294579 |
Method for forming contact opening |
Nov. 13, 2007 |
| 7294552 |
Electrical contact for a MEMS device and method of making |
Nov. 13, 2007 |
| 7291559 |
Etching method, gate etching method, and method of manufacturing semiconductor devices |
Nov. 6, 2007 |
| 7291540 |
Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers |
Nov. 6, 2007 |
| 7288475 |
Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
Oct. 30, 2007 |
| 7285497 |
Mask, method for manufacturing a mask, method for manufacturing an electro-optical device, and electronic equipment |
Oct. 23, 2007 |
| 7282451 |
Methods of forming integrated circuit devices having metal interconnect layers therein |
Oct. 16, 2007 |
| 7282448 |
Substrate and method of forming substrate for fluid ejection device |
Oct. 16, 2007 |
| 7282440 |
Integrated circuit contact |
Oct. 16, 2007 |
| 7282434 |
Method of manufacturing a semiconductor device |
Oct. 16, 2007 |
| 7279426 |
Like integrated circuit devices with different depth |
Oct. 9, 2007 |
| 7279415 |
Method for forming a metallization layer stack to reduce the roughness of metal lines |
Oct. 9, 2007 |
| 7279410 |
Method for forming inlaid structures for IC interconnections |
Oct. 9, 2007 |
| 7279376 |
Method for manufacturing semiconductor device |
Oct. 9, 2007 |
| 7276447 |
Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material |
Oct. 2, 2007 |
| 7276445 |
Method for forming pattern using printing method |
Oct. 2, 2007 |
| 7274104 |
Semiconductor device having an interconnect that increases in impurity concentration as width increases |
Sep. 25, 2007 |
| 7271459 |
Physical quantity sensor |
Sep. 18, 2007 |
| 7271105 |
Method for making a micro-fluid ejection device |
Sep. 18, 2007 |
| 7271101 |
High density plasma chemical vapor deposition process |
Sep. 18, 2007 |
| 7265026 |
Method of forming a shallow trench isolation structure in a semiconductor device |
Sep. 4, 2007 |
| 7262137 |
Dry etching process for compound semiconductors |
Aug. 28, 2007 |
| 7259103 |
Fabrication method of polycrystalline silicon TFT |
Aug. 21, 2007 |
| 7259101 |
Nanoparticles and method for making the same |
Aug. 21, 2007 |
| 7259100 |
Nanoparticles and method for making the same |
Aug. 21, 2007 |
| 7259099 |
Strongly textured atomic ridge nanowindows |
Aug. 21, 2007 |
| 7256502 |
Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall |
Aug. 14, 2007 |
| 7256136 |
Self-patterning of photo-active dielectric materials for interconnect isolation |
Aug. 14, 2007 |
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