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Class Information
Number: 438/700
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Formation of groove or trench
Description: Processes wherein at least one groove or trench is formed by a combination of chemical etching and material deposition.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371263 |
Plasmaless dry contact cleaning method using interhalogen compounds |
May. 13, 2008 |
| 7369697 |
Process variable of interest monitoring and control |
May. 6, 2008 |
| 7368390 |
Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition process |
May. 6, 2008 |
| 7368365 |
Memory array buried digit line |
May. 6, 2008 |
| 7365014 |
Reticle fabrication using a removable hard mask |
Apr. 29, 2008 |
| 7365012 |
Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus |
Apr. 29, 2008 |
| 7361571 |
Method for fabricating a trench isolation with spacers |
Apr. 22, 2008 |
| 7361287 |
Method for etching structures in an etching body by means of a plasma |
Apr. 22, 2008 |
| 7358191 |
Method for decreasing sheet resistivity variations of an interconnect metal layer |
Apr. 15, 2008 |
| 7358170 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Apr. 15, 2008 |
| 7354863 |
Methods of selectively removing silicon |
Apr. 8, 2008 |
| 7354855 |
Semiconductor device and a method of manufacturing the same |
Apr. 8, 2008 |
| 7354523 |
Methods for sidewall etching and etching during filling of a trench |
Apr. 8, 2008 |
| 7351665 |
Plasma etching method, plasma etching apparatus, control program, computer recording medium and recording medium having processing recipe recorded thereon |
Apr. 1, 2008 |
| 7351660 |
Process for producing high performance interconnects |
Apr. 1, 2008 |
| 7348277 |
Methods of fabricating semiconductor device using sacrificial layer |
Mar. 25, 2008 |
| 7344992 |
Method for forming via hole and trench for dual damascene interconnection |
Mar. 18, 2008 |
| 7344974 |
Metallization method of semiconductor device |
Mar. 18, 2008 |
| 7344954 |
Method of manufacturing a capacitor deep trench and of etching a deep trench opening |
Mar. 18, 2008 |
| 7341931 |
Methods of forming low resistivity contact for an integrated circuit device |
Mar. 11, 2008 |
| 7339273 |
Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode |
Mar. 4, 2008 |
| 7335593 |
Method of fabricating semiconductor device |
Feb. 26, 2008 |
| 7335554 |
Method for fabricating semiconductor |
Feb. 26, 2008 |
| 7327013 |
Stencil mask with charge-up prevention and method of manufacturing the same |
Feb. 5, 2008 |
| 7326650 |
Method of etching dual damascene structure |
Feb. 5, 2008 |
| 7323417 |
Method of forming a recessed structure employing a reverse tone process |
Jan. 29, 2008 |
| 7323410 |
Dry etchback of interconnect contacts |
Jan. 29, 2008 |
| 7323115 |
Substrate processing method and ink jet recording head substrate manufacturing method |
Jan. 29, 2008 |
| 7320927 |
In situ hardmask pullback using an in situ plasma resist trim process |
Jan. 22, 2008 |
| 7320908 |
Methods of forming semiconductor devices having buried oxide patterns |
Jan. 22, 2008 |
| 7319073 |
Method of reducing silicon damage around laser marking region of wafers in STI CMP process |
Jan. 15, 2008 |
| 7316978 |
Method for forming recesses |
Jan. 8, 2008 |
| 7316949 |
Integrating n-type and p-type metal gate transistors |
Jan. 8, 2008 |
| 7314792 |
Method for fabricating transistor of semiconductor device |
Jan. 1, 2008 |
| 7309654 |
Technique for reducing etch damage during the formation of vias and trenches in interlayer dielectrics |
Dec. 18, 2007 |
| 7309641 |
Method for rounding bottom corners of trench and shallow trench isolation process |
Dec. 18, 2007 |
| 7307023 |
Polishing method of Cu film and method for manufacturing semiconductor device |
Dec. 11, 2007 |
| 7307014 |
Method of forming a via contact structure using a dual damascene process |
Dec. 11, 2007 |
| 7300882 |
Etching method and semiconductor device fabricating method |
Nov. 27, 2007 |
| 7300879 |
Methods of fabricating metal wiring in semiconductor devices |
Nov. 27, 2007 |
| 7300848 |
Semiconductor device having a recess gate for improved reliability |
Nov. 27, 2007 |
| 7297634 |
Method and apparatus for semiconductor device and semiconductor memory device |
Nov. 20, 2007 |
| 7297633 |
Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection |
Nov. 20, 2007 |
| 7294579 |
Method for forming contact opening |
Nov. 13, 2007 |
| 7294552 |
Electrical contact for a MEMS device and method of making |
Nov. 13, 2007 |
| 7291559 |
Etching method, gate etching method, and method of manufacturing semiconductor devices |
Nov. 6, 2007 |
| 7291540 |
Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers |
Nov. 6, 2007 |
| 7288475 |
Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
Oct. 30, 2007 |
| 7285497 |
Mask, method for manufacturing a mask, method for manufacturing an electro-optical device, and electronic equipment |
Oct. 23, 2007 |
| 7282451 |
Methods of forming integrated circuit devices having metal interconnect layers therein |
Oct. 16, 2007 |
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