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Class Information
Number: 438/699
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating > Plural coating steps
Description: Processes having multiple material deposition steps are utilized in the planarization of the surface.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4775550 |
Surface planarization method for VLSI technology |
Oct. 4, 1988 |
| 4764483 |
Method for burying a step in a semiconductor substrate |
Aug. 16, 1988 |
| 4732658 |
Planarization of silicon semiconductor devices |
Mar. 22, 1988 |
| 4714520 |
Method for filling a trench in an integrated circuit structure without producing voids |
Dec. 22, 1987 |
| 4710264 |
Process for manufacturing a semiconductor arrangement |
Dec. 1, 1987 |
| 4708770 |
Planarized process for forming vias in silicon wafers |
Nov. 24, 1987 |
| 4708767 |
Method for providing a semiconductor device with planarized contacts |
Nov. 24, 1987 |
| 4692204 |
Method of planarizing the surface of a semiconductor device, in which silicon nitride is used as isolating material |
Sep. 8, 1987 |
| 4676867 |
Planarization process for double metal MOS using spin-on glass as a sacrificial layer |
Jun. 30, 1987 |
| 4675984 |
Method of exposing only the top surface of a mesa |
Jun. 30, 1987 |
| 4662986 |
Planarization method and technique for isolating semiconductor islands |
May. 5, 1987 |
| 4657630 |
Method for manufacturing semiconductor device having isolating groove |
Apr. 14, 1987 |
| 4654120 |
Method of making a planar trench semiconductor structure |
Mar. 31, 1987 |
| 4642162 |
Planarization of dielectric layers in integrated circuits |
Feb. 10, 1987 |
| 4634496 |
Method for planarizing the surface of an interlayer insulating film in a semiconductor device |
Jan. 6, 1987 |
| 4626317 |
Method for planarizing an isolation slot in an integrated circuit structure |
Dec. 2, 1986 |
| 4605470 |
Method for interconnecting conducting layers of an integrated circuit device |
Aug. 12, 1986 |
| 4604162 |
Formation and planarization of silicon-on-insulator structures |
Aug. 5, 1986 |
| 4599136 |
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials |
Jul. 8, 1986 |
| 4576834 |
Method for forming trench isolation structures |
Mar. 18, 1986 |
| 4575402 |
Method for fabricating conductors in integrated circuits |
Mar. 11, 1986 |
| 4545852 |
Planarization of dielectric films on integrated circuits |
Oct. 8, 1985 |
| 4541169 |
Method for making studs for interconnecting metallization layers at different levels in a semiconductor chip |
Sep. 17, 1985 |
| 4539744 |
Semiconductor planarization process and structures made thereby |
Sep. 10, 1985 |
| 4533430 |
Process for forming slots having near vertical sidewalls at their upper extremities |
Aug. 6, 1985 |
| 4491486 |
Method for manufacturing a semiconductor device |
Jan. 1, 1985 |
| 4481070 |
Double planarization process for multilayer metallization of integrated circuit structures |
Nov. 6, 1984 |
| 4470874 |
Planarization of multi-level interconnected metallization system |
Sep. 11, 1984 |
| 4460434 |
Method for planarizing patterned surfaces |
Jul. 17, 1984 |
| 4452826 |
Use of polysilicon for smoothing of liquid crystal MOS displays |
Jun. 5, 1984 |
| 4448800 |
Method for the manufacture of semiconductor device using refractory metal in a lift-off step |
May. 15, 1984 |
| 4419813 |
Method for fabricating semiconductor device |
Dec. 13, 1983 |
| 4407851 |
Method for manufacturing semiconductor device |
Oct. 4, 1983 |
| 4396460 |
Method of forming groove isolation in a semiconductor device |
Aug. 2, 1983 |
| 4396458 |
Method for forming planar metal/insulator structures |
Aug. 2, 1983 |
| 4385975 |
Method of forming wide, deep dielectric filled isolation trenches in the surface of a silicon semiconductor substrate |
May. 31, 1983 |
| 4377438 |
Method for producing semiconductor device |
Mar. 22, 1983 |
| 4311546 |
Method of manufacturing semiconductor device |
Jan. 19, 1982 |
| 4307180 |
Process of forming recessed dielectric regions in a monocrystalline silicon substrate |
Dec. 22, 1981 |
| 4305974 |
Method of manufacturing a semiconductor device |
Dec. 15, 1981 |
| 4295924 |
Method for providing self-aligned conductor in a V-groove device |
Oct. 20, 1981 |
| 4255229 |
Method of reworking PROMS |
Mar. 10, 1981 |
| 4222816 |
Method for reducing parasitic capacitance in integrated circuit structures |
Sep. 16, 1980 |
| 4123565 |
Method of manufacturing semiconductor devices |
Oct. 31, 1978 |
| 4109372 |
Method for making an insulated gate field effect transistor utilizing a silicon gate and silicide interconnection vias |
Aug. 29, 1978 |
| 4045594 |
Planar insulation of conductive patterns by chemical vapor deposition and sputtering |
Aug. 30, 1977 |
| 4039359 |
Method of manufacturing a flattened semiconductor device |
Aug. 2, 1977 |
| 3976524 |
Planarization of integrated circuit surfaces through selective photoresist masking |
Aug. 24, 1976 |
| 3958040 |
Semiconductor device manufacture |
May. 18, 1976 |
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