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Class Information
Number: 438/699
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating > Plural coating steps
Description: Processes having multiple material deposition steps are utilized in the planarization of the surface.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5378318 |
Planarization |
Jan. 3, 1995 |
| 5371046 |
Method to solve sog non-uniformity in the VLSI process |
Dec. 6, 1994 |
| 5366850 |
Submicron planarization process with passivation on metal line |
Nov. 22, 1994 |
| 5356513 |
Polishstop planarization method and structure |
Oct. 18, 1994 |
| 5356828 |
Method of forming micro-trench isolation regions in the fabrication of semiconductor devices |
Oct. 18, 1994 |
| 5354715 |
Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
Oct. 11, 1994 |
| 5350486 |
Semiconductor planarization process |
Sep. 27, 1994 |
| 5346584 |
Planarization process for IC trench isolation using oxidized polysilicon filler |
Sep. 13, 1994 |
| 5347100 |
Semiconductor device, process for the production thereof and apparatus for microwave plasma treatment |
Sep. 13, 1994 |
| 5346587 |
Planarization of a gate electrode for improved gate patterning over non-planar active area isolation |
Sep. 13, 1994 |
| 5344797 |
Method of forming interlevel dielectric for integrated circuits |
Sep. 6, 1994 |
| 5342480 |
Method of manufacturing a semiconductor integrated circuit device |
Aug. 30, 1994 |
| 5340774 |
Semiconductor fabrication technique using local planarization with self-aligned transistors |
Aug. 23, 1994 |
| 5332694 |
Process for manufacturing a semiconductor device |
Jul. 26, 1994 |
| 5332467 |
Chemical/mechanical polishing for ULSI planarization |
Jul. 26, 1994 |
| 5328553 |
Method for fabricating a semiconductor device having a planar surface |
Jul. 12, 1994 |
| 5326727 |
Method for integrated circuit fabrication including linewidth control during etching |
Jul. 5, 1994 |
| 5324690 |
Semiconductor device having a ternary boron nitride film and a method for forming the same |
Jun. 28, 1994 |
| 5324689 |
Critical dimension control with a planarized underlayer |
Jun. 28, 1994 |
| 5316965 |
Method of decreasing the field oxide etch rate in isolation technology |
May. 31, 1994 |
| 5312512 |
Global planarization using SOG and CMP |
May. 17, 1994 |
| 5310700 |
Conductor capacitance reduction in integrated circuits |
May. 10, 1994 |
| 5300188 |
Process for making substantially smooth diamond |
Apr. 5, 1994 |
| 5296092 |
Planarization method for a semiconductor substrate |
Mar. 22, 1994 |
| 5294294 |
Method of dry etching in semiconductor device processing |
Mar. 15, 1994 |
| 5294296 |
Method for manufacturing a contact hole of a semiconductor device |
Mar. 15, 1994 |
| 5292689 |
Method for planarizing semiconductor structure using subminimum features |
Mar. 8, 1994 |
| 5290396 |
Trench planarization techniques |
Mar. 1, 1994 |
| 5284804 |
Global planarization process |
Feb. 8, 1994 |
| 5272117 |
Method for planarizing a layer of material |
Dec. 21, 1993 |
| 5272115 |
Method of leveling the laminated surface of a semiconductor substrate |
Dec. 21, 1993 |
| 5270264 |
Process for filling submicron spaces with dielectric |
Dec. 14, 1993 |
| 5266446 |
Method of making a multilayer thin film structure |
Nov. 30, 1993 |
| 5266525 |
Microelectronic interlayer dielectric structure and methods of manufacturing same |
Nov. 30, 1993 |
| 5250472 |
Spin-on-glass integration planarization having siloxane partial etchback and silicate processes |
Oct. 5, 1993 |
| 5244841 |
Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing |
Sep. 14, 1993 |
| 5245213 |
Planarized semiconductor product |
Sep. 14, 1993 |
| 5242853 |
Manufacturing process for a semiconductor device using bias ECRCVD and an etch stop layer |
Sep. 7, 1993 |
| 5236861 |
Manufacturing method of metal-insulator-semiconductor device using trench isolation technique |
Aug. 17, 1993 |
| 5231052 |
Process for forming a multilayer polysilicon semiconductor electrode |
Jul. 27, 1993 |
| 5231044 |
Method of making semiconductor memory elements |
Jul. 27, 1993 |
| 5223084 |
Simultaneous dielectric planarization and contact hole etching |
Jun. 29, 1993 |
| 5217926 |
Method of passivating a semiconductor wafer |
Jun. 8, 1993 |
| 5213657 |
Method for making uniform the thickness of a Si single crystal thin film |
May. 25, 1993 |
| 5212114 |
Process for global planarizing of surfaces for integrated semiconductor circuits |
May. 18, 1993 |
| 5204288 |
Method for planarizing an integrated circuit structure using low melting inorganic material |
Apr. 20, 1993 |
| 5192715 |
Process for avoiding spin-on-glass cracking in high aspect ratio cavities |
Mar. 9, 1993 |
| 5187119 |
Multichip module and integrated circuit substrates having planarized patterned surfaces |
Feb. 16, 1993 |
| 5187121 |
Process for fabrication of a semiconductor structure and contact stud |
Feb. 16, 1993 |
| 5175122 |
Planarization process for trench isolation in integrated circuit manufacture |
Dec. 29, 1992 |
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