| Patent Number |
Title Of Patent |
Date Issued |
| 7300886 |
Interlayer dielectric for charge loss improvement |
Nov. 27, 2007 |
| 7268075 |
Method to reduce the copper line roughness for increased electrical conductivity of narrow interconnects (<100nm) |
Sep. 11, 2007 |
| 7247569 |
Ultra-thin Si MOSFET device structure and method of manufacture |
Jul. 24, 2007 |
| 7179757 |
Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials |
Feb. 20, 2007 |
| 7180706 |
Magnetic heads and semiconductor devices and surface planarization processes for the fabrication thereof |
Feb. 20, 2007 |
| 7112458 |
Method of forming a liquid crystal display |
Sep. 26, 2006 |
| 7084059 |
CMP system for metal deposition |
Aug. 1, 2006 |
| 7078312 |
Method for controlling etch process repeatability |
Jul. 18, 2006 |
| 7033930 |
Interconnect structures in a semiconductor device and processes of formation |
Apr. 25, 2006 |
| 7022579 |
Method for filling via with metal |
Apr. 4, 2006 |
| 7009811 |
Surface planarization processes for the fabrication of magnetic heads and semiconductor devices |
Mar. 7, 2006 |
| 6979649 |
Fabrication method of semiconductor integrated circuit device |
Dec. 27, 2005 |
| 6972259 |
Method for forming openings in low dielectric constant material layer |
Dec. 6, 2005 |
| 6943118 |
Method of fabricating flash memory |
Sep. 13, 2005 |
| 6924238 |
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance |
Aug. 2, 2005 |
| 6921718 |
Semiconductor device and method of manufacturing the same |
Jul. 26, 2005 |
| 6913993 |
Chemical-mechanical polishing method |
Jul. 5, 2005 |
| 6905975 |
Methods of forming patterned compositions |
Jun. 14, 2005 |
| 6884724 |
Method for dishing reduction and feature passivation in polishing processes |
Apr. 26, 2005 |
| 6872664 |
Dual gate nitride process |
Mar. 29, 2005 |
| 6867139 |
Method of manufacturing semiconductor device |
Mar. 15, 2005 |
| 6864179 |
Semiconductor memory device having COB structure and method of fabricating the same |
Mar. 8, 2005 |
| 6855634 |
Polishing method and polishing apparatus |
Feb. 15, 2005 |
| 6833232 |
Micro-pattern forming method for semiconductor device |
Dec. 21, 2004 |
| 6821872 |
Method of making a bit line contact device |
Nov. 23, 2004 |
| 6812115 |
Method of filling an opening in a material layer with an insulating material |
Nov. 2, 2004 |
| 6809032 |
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques |
Oct. 26, 2004 |
| 6784077 |
Shallow trench isolation process |
Aug. 31, 2004 |
| 6780774 |
Method of semiconductor device isolation |
Aug. 24, 2004 |
| 6774045 |
Residual halogen reduction with microwave stripper |
Aug. 10, 2004 |
| 6774042 |
Planarization method for deep sub micron shallow trench isolation process |
Aug. 10, 2004 |
| 6759319 |
Residue-free solder bumping process |
Jul. 6, 2004 |
| 6750148 |
Method of manufacturing wireless suspension blank |
Jun. 15, 2004 |
| 6746888 |
Display and fabricating method thereof |
Jun. 8, 2004 |
| 6746960 |
Electronic techniques for analyte detection |
Jun. 8, 2004 |
| 6734105 |
Method for forming silicon quantum dots and method for fabricating nonvolatile memory device using the same |
May. 11, 2004 |
| 6730603 |
System and method of determining a polishing endpoint by monitoring signal intensity |
May. 4, 2004 |
| 6716769 |
Use of a plasma source to form a layer during the formation of a semiconductor device |
Apr. 6, 2004 |
| 6706635 |
Innovative method to build a high precision analog capacitor with low voltage coefficient and hysteresis |
Mar. 16, 2004 |
| 6703314 |
Method for fabricating semiconductor device |
Mar. 9, 2004 |
| 6682820 |
Recession resistant coated ceramic part |
Jan. 27, 2004 |
| 6677227 |
Method of forming patterned metalization on patterned semiconductor wafers |
Jan. 13, 2004 |
| 6670274 |
Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure |
Dec. 30, 2003 |
| 6660618 |
Reverse mask and oxide layer deposition for reduction of vertical capacitance variation in multi-layer metallization systems |
Dec. 9, 2003 |
| 6660641 |
Method for forming crack resistant planarizing layer within microelectronic fabrication |
Dec. 9, 2003 |
| 6627551 |
Method for avoiding microscratch in interlevel dielectric layer chemical mechanical polishing process |
Sep. 30, 2003 |
| 6617241 |
Method of thick film planarization |
Sep. 9, 2003 |
| 6596639 |
Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities |
Jul. 22, 2003 |
| 6596608 |
Method of manufacturing non-volatile semiconductor memory device |
Jul. 22, 2003 |
| 6573187 |
Method of forming dual damascene structure |
Jun. 3, 2003 |
