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Class Information
Number: 438/698
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating > Utilizing reflow
Description: Processes wherein the planarization method requires decreasing the viscosity of a layer residing on the substrate in order to fluidize the same.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7575995 |
Method of forming fine metal pattern and method of forming metal line using the same |
Aug. 18, 2009 |
| 7544621 |
Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method |
Jun. 9, 2009 |
| 7507618 |
Method for making electronic devices using metal oxide nanoparticles |
Mar. 24, 2009 |
| 7479455 |
Method for manufacturing semiconductor wafer |
Jan. 20, 2009 |
| 7410863 |
Methods of forming and using memory cell structures |
Aug. 12, 2008 |
| 7357873 |
Polymide thin film self-assembly process |
Apr. 15, 2008 |
| 7348278 |
Method of making nitride-based compound semiconductor crystal and substrate |
Mar. 25, 2008 |
| 7335255 |
Manufacturing method of semiconductor device |
Feb. 26, 2008 |
| 7264976 |
Advance ridge structure for microlens gapless approach |
Sep. 4, 2007 |
| 7226865 |
Process for forming pattern and method for producing liquid crystal display apparatus |
Jun. 5, 2007 |
| 7192867 |
Protection of low-k dielectric in a passivation level |
Mar. 20, 2007 |
| 7176087 |
Methods of forming electrical connections |
Feb. 13, 2007 |
| 7144817 |
Etching solutions and processes for manufacturing flexible wiring boards |
Dec. 5, 2006 |
| 7060623 |
Method of deforming a pattern and semiconductor device formed by utilizing deformed pattern |
Jun. 13, 2006 |
| 7053407 |
Liquid crystal display device and method for manufacturing the same |
May. 30, 2006 |
| 7022579 |
Method for filling via with metal |
Apr. 4, 2006 |
| 7022608 |
Method and composition for the removal of residual materials during substrate planarization |
Apr. 4, 2006 |
| 6979526 |
Lithography alignment and overlay measurement marks formed by resist mask blocking for MRAMs |
Dec. 27, 2005 |
| 6972259 |
Method for forming openings in low dielectric constant material layer |
Dec. 6, 2005 |
| 6916743 |
Semiconductor device and method for manufacturing thereof |
Jul. 12, 2005 |
| 6914000 |
Polishing method, polishing system and process-managing system |
Jul. 5, 2005 |
| 6803308 |
Method of forming a dual damascene pattern in a semiconductor device |
Oct. 12, 2004 |
| 6774042 |
Planarization method for deep sub micron shallow trench isolation process |
Aug. 10, 2004 |
| 6753259 |
Method of improving the bondability between Au wires and Cu bonding pads |
Jun. 22, 2004 |
| 6746888 |
Display and fabricating method thereof |
Jun. 8, 2004 |
| 6743724 |
Planarization process for semiconductor substrates |
Jun. 1, 2004 |
| 6716739 |
Bump manufacturing method |
Apr. 6, 2004 |
| 6682820 |
Recession resistant coated ceramic part |
Jan. 27, 2004 |
| 6645865 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Nov. 11, 2003 |
| 6639285 |
Method for fabricating a semiconductor device |
Oct. 28, 2003 |
| 6627551 |
Method for avoiding microscratch in interlevel dielectric layer chemical mechanical polishing process |
Sep. 30, 2003 |
| 6620534 |
Film having enhanced reflow characteristics at low thermal budget |
Sep. 16, 2003 |
| 6617252 |
Monolithic low dielectric constant platform for passive components and method |
Sep. 9, 2003 |
| 6602793 |
Pre-clean chamber |
Aug. 5, 2003 |
| 6555461 |
Method of forming low resistance barrier on low k interconnect |
Apr. 29, 2003 |
| 6531353 |
Method for fabricating semiconductor device |
Mar. 11, 2003 |
| 6479389 |
Method of doping copper metallization |
Nov. 12, 2002 |
| 6451181 |
Method of forming a semiconductor device barrier layer |
Sep. 17, 2002 |
| 6423638 |
Filter apparatus and method therefor |
Jul. 23, 2002 |
| 6413870 |
Process of removing CMP scratches by BPSG reflow and integrated circuit chip formed thereby |
Jul. 2, 2002 |
| 6368957 |
Semiconductor device and method for manufacturing semiconductor device |
Apr. 9, 2002 |
| 6342448 |
Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process |
Jan. 29, 2002 |
| 6331488 |
Planarization process for semiconductor substrates |
Dec. 18, 2001 |
| 6277748 |
Method for manufacturing a planar reflective light valve backplane |
Aug. 21, 2001 |
| 6277754 |
Method of planarizing dielectric layer |
Aug. 21, 2001 |
| 6245688 |
Dry Air/N2 post treatment to avoid the formation of B/P precipitation after BPSG film deposition |
Jun. 12, 2001 |
| 6225227 |
Method for manufacturing semiconductor device |
May. 1, 2001 |
| 6184137 |
Structure and method for improving low temperature copper reflow in semiconductor features |
Feb. 6, 2001 |
| 6180510 |
Method of manufacturing a substantially flat surface of a semiconductor device through a polishing operation |
Jan. 30, 2001 |
| 6177337 |
Method of reducing metal voids in semiconductor device interconnection |
Jan. 23, 2001 |
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