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Class Information
Number: 438/697
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating
Description: Processes wherein at least one surface of the semiconductor substrate is leveled through a combination of chemical etching and material deposition.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5747381 |
Technique for the removal of residual spin-on-glass (SOG) after full SOG etchback |
May. 5, 1998 |
| 5736451 |
Method of forming planar isolation in integrated circuits |
Apr. 7, 1998 |
| 5731245 |
High aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard cap |
Mar. 24, 1998 |
| 5728507 |
Method for planarizing a semiconductor layer |
Mar. 17, 1998 |
| 5726099 |
Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry |
Mar. 10, 1998 |
| 5723387 |
Method and apparatus for forming very small scale Cu interconnect metallurgy on semiconductor substrates |
Mar. 3, 1998 |
| 5714417 |
Planarization process using artificial gravity |
Feb. 3, 1998 |
| 5681425 |
Teos plasma protection technology |
Oct. 28, 1997 |
| 5679211 |
Spin-on-glass etchback planarization process using an oxygen plasma to remove an etchback polymer residue |
Oct. 21, 1997 |
| 5674783 |
Method for improving the chemical-mechanical polish (CMP) uniformity of insulator layers |
Oct. 7, 1997 |
| 5665633 |
Process for forming a semiconductor device having field isolation |
Sep. 9, 1997 |
| 5656554 |
Semiconductor chip reclamation technique involving multiple planarization processes |
Aug. 12, 1997 |
| 5635022 |
Silicon oxide removal in semiconductor processing |
Jun. 3, 1997 |
| 5628869 |
Plasma enhanced chemical vapor reactor with shaped electrodes |
May. 13, 1997 |
| 5601687 |
Mask design |
Feb. 11, 1997 |
| 5575886 |
Method for fabricating semiconductor device with chemical-mechanical polishing process for planarization of interlayer insulation films |
Nov. 19, 1996 |
| 5567658 |
Method for minimizing peeling at the surface of spin-on glasses |
Oct. 22, 1996 |
| 5567661 |
Formation of planarized insulating film by plasma-enhanced CVD of organic silicon compound |
Oct. 22, 1996 |
| 5500077 |
Method of polishing/flattening diamond |
Mar. 19, 1996 |
| 5482900 |
Method for forming a metallurgy system having a dielectric layer that is planar and void free |
Jan. 9, 1996 |
| 5456797 |
Method of planarizing trench structures |
Oct. 10, 1995 |
| 5445998 |
Method for the global planarization of surfaces of semiconductor integrated circuits |
Aug. 29, 1995 |
| 5441094 |
Trench planarization techniques |
Aug. 15, 1995 |
| 5429988 |
Process for producing high density conductive lines |
Jul. 4, 1995 |
| 5413953 |
Method for planarizing an insulator on a semiconductor substrate using ion implantation |
May. 9, 1995 |
| 5399389 |
Method for locally and globally planarizing chemical vapor deposition of SiO.sub.2 layers onto structured silicon substrates |
Mar. 21, 1995 |
| 5385867 |
Method for forming a multi-layer metallic wiring structure |
Jan. 31, 1995 |
| 5378318 |
Planarization |
Jan. 3, 1995 |
| 5372673 |
Method for processing a layer of material while using insitu monitoring and control |
Dec. 13, 1994 |
| 5354706 |
Formation of uniform dimension conductive lines on a semiconductor wafer |
Oct. 11, 1994 |
| 5324689 |
Critical dimension control with a planarized underlayer |
Jun. 28, 1994 |
| 5320708 |
Dry etching method |
Jun. 14, 1994 |
| 5316980 |
Method of making a semiconductor device by dry etching process |
May. 31, 1994 |
| 5302551 |
Method for planarizing the surface of an integrated circuit over a metal interconnect layer |
Apr. 12, 1994 |
| 5290399 |
Surface planarizing methods for integrated circuit devices |
Mar. 1, 1994 |
| 5275977 |
Insulating film forming method for semiconductor device interconnection |
Jan. 4, 1994 |
| 5264074 |
Flattening method for interlayer insulating film |
Nov. 23, 1993 |
| 5256565 |
Electrochemical planarization |
Oct. 26, 1993 |
| 5212116 |
Method for forming planarized films by preferential etching of the center of a wafer |
May. 18, 1993 |
| 5139608 |
Method of planarizing a semiconductor device surface |
Aug. 18, 1992 |
| 5122473 |
Process for forming a field isolation structure and gate structures in integrated MISFET devices |
Jun. 16, 1992 |
| 5110410 |
Zinc sulfide planarization |
May. 5, 1992 |
| 5091048 |
Ion milling to obtain planarization |
Feb. 25, 1992 |
| 5084407 |
Method for planarizing isolated regions |
Jan. 28, 1992 |
| 5084130 |
Method for depositing material on depressions |
Jan. 28, 1992 |
| 5077238 |
Method of manufacturing a semiconductor device with a planar interlayer insulating film |
Dec. 31, 1991 |
| 5068207 |
Method for producing a planar surface in integrated circuit manufacturing |
Nov. 26, 1991 |
| 4988405 |
Fabrication of devices utilizing a wet etchback procedure |
Jan. 29, 1991 |
| 4985373 |
Multiple insulating layer for two-level interconnected metallization in semiconductor integrated circuit structures |
Jan. 15, 1991 |
| 4983546 |
Method for curing spin-on-glass film by utilizing ultraviolet irradiation |
Jan. 8, 1991 |
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