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Class Information
Number: 438/697
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating
Description: Processes wherein at least one surface of the semiconductor substrate is leveled through a combination of chemical etching and material deposition.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6913997 |
Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices |
Jul. 5, 2005 |
| 6913993 |
Chemical-mechanical polishing method |
Jul. 5, 2005 |
| 6911362 |
Methods for forming electronic devices including capacitor structures |
Jun. 28, 2005 |
| 6911396 |
Method of producing metallic film |
Jun. 28, 2005 |
| 6908860 |
Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
Jun. 21, 2005 |
| 6905967 |
Method for improving planarity of shallow trench isolation using multiple simultaneous tiling systems |
Jun. 14, 2005 |
| 6905966 |
METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, METHOD FOR DESIGNING PATTERNING MASK USING THE METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, AND METHOD FOR MANUFACT |
Jun. 14, 2005 |
| 6902984 |
Methods of forming void regions, dielectric regions and capacitor constructions |
Jun. 7, 2005 |
| 6903022 |
Method of forming contact hole |
Jun. 7, 2005 |
| 6897121 |
Method of removing HDP oxide deposition |
May. 24, 2005 |
| 6893968 |
Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices |
May. 17, 2005 |
| 6890597 |
HDP-CVD uniformity control |
May. 10, 2005 |
| 6884724 |
Method for dishing reduction and feature passivation in polishing processes |
Apr. 26, 2005 |
| 6864179 |
Semiconductor memory device having COB structure and method of fabricating the same |
Mar. 8, 2005 |
| 6858539 |
Post-CMP treating liquid and method for manufacturing semiconductor device |
Feb. 22, 2005 |
| 6858537 |
Process for smoothing a rough surface on a substrate by dry etching |
Feb. 22, 2005 |
| 6855634 |
Polishing method and polishing apparatus |
Feb. 15, 2005 |
| 6855585 |
Integrating multiple thin film resistors |
Feb. 15, 2005 |
| 6852634 |
Low cost method of providing a semiconductor device having a high channel density |
Feb. 8, 2005 |
| 6849946 |
Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect |
Feb. 1, 2005 |
| 6849551 |
Method for forming isolation region in semiconductor device |
Feb. 1, 2005 |
| 6827868 |
Thinning of fuse passivation after C4 formation |
Dec. 7, 2004 |
| 6828678 |
Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer |
Dec. 7, 2004 |
| 6828227 |
Method for applying uniform pressurized film across wafer |
Dec. 7, 2004 |
| 6821899 |
System, method and apparatus for improved local dual-damascene planarization |
Nov. 23, 2004 |
| 6821865 |
Deep isolation trenches |
Nov. 23, 2004 |
| 6821872 |
Method of making a bit line contact device |
Nov. 23, 2004 |
| 6818558 |
Method of manufacturing a dielectric layer for a silicon-oxide-nitride-oxide-silicon (SONOS) type devices |
Nov. 16, 2004 |
| 6815291 |
Method of manufacturing semiconductor device |
Nov. 9, 2004 |
| 6815334 |
Method for forming multi-layer metal line of semiconductor device |
Nov. 9, 2004 |
| 6815336 |
Planarization of copper damascene using reverse current electroplating and chemical mechanical polishing |
Nov. 9, 2004 |
| 6815357 |
Process and apparatus for manufacturing a semiconductor device |
Nov. 9, 2004 |
| 6809033 |
Innovative method of hard mask removal |
Oct. 26, 2004 |
| 6809032 |
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques |
Oct. 26, 2004 |
| 6809031 |
Method for manufacturing a reclaimable test pattern wafer for CMP applications |
Oct. 26, 2004 |
| 6803316 |
Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate |
Oct. 12, 2004 |
| 6800560 |
Gas assisted method for applying resist stripper and gas-resist stripper combinations |
Oct. 5, 2004 |
| 6797416 |
GaN substrate formed under controlled growth condition over GaN layer having discretely formed pits |
Sep. 28, 2004 |
| 6794261 |
Methods of forming void regions, dielectric regions and capacitor constructions |
Sep. 21, 2004 |
| 6794691 |
Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features |
Sep. 21, 2004 |
| 6790786 |
Etching processes for integrated circuit manufacturing including methods of forming capacitors |
Sep. 14, 2004 |
| 6780753 |
Airgap for semiconductor devices |
Aug. 24, 2004 |
| 6780774 |
Method of semiconductor device isolation |
Aug. 24, 2004 |
| 6774042 |
Planarization method for deep sub micron shallow trench isolation process |
Aug. 10, 2004 |
| 6774020 |
Semiconductor device and method of manufacturing the same |
Aug. 10, 2004 |
| 6767837 |
Etch-back method for dielectric layer |
Jul. 27, 2004 |
| 6753259 |
Method of improving the bondability between Au wires and Cu bonding pads |
Jun. 22, 2004 |
| 6750144 |
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes |
Jun. 15, 2004 |
| 6746958 |
Method of controlling the duration of an endpoint polishing process in a multistage polishing process |
Jun. 8, 2004 |
| 6734106 |
Method of buried strap out-diffusion formation by gas phase doping |
May. 11, 2004 |
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