 |
|
 |
| |
 |
|
Class Information
Number: 438/697
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Planarization by etching and coating
Description: Processes wherein at least one surface of the semiconductor substrate is leveled through a combination of chemical etching and material deposition.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7601646 |
Top-oxide-early process and array top oxide planarization |
Oct. 13, 2009 |
| 7579284 |
Etching solution, method of forming a pattern using the same, method of manufacturing a multiple gate oxide layer using the same and method of manufacturing a flash memory device using the sam |
Aug. 25, 2009 |
| 7563716 |
Polishing method |
Jul. 21, 2009 |
| 7550380 |
Electroless plating of metal caps for chalcogenide-based memory devices |
Jun. 23, 2009 |
| 7544621 |
Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method |
Jun. 9, 2009 |
| 7528075 |
Self-masking defect removing method |
May. 5, 2009 |
| 7528059 |
Method for reducing polish-induced damage in a contact structure by forming a capping layer |
May. 5, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7501051 |
Electropolishing electrolyte and method for planarizing a metal layer using the same |
Mar. 10, 2009 |
| 7488686 |
Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
Feb. 10, 2009 |
| 7473630 |
Semiconductor device and method for manufacturing same |
Jan. 6, 2009 |
| 7446045 |
Method of manufacturing nitride substrate for semiconductors |
Nov. 4, 2008 |
| 7435654 |
Analog capacitor having at least three high-k dielectric layers, and method of fabricating the same |
Oct. 14, 2008 |
| 7435632 |
Method for manufacturing a bottom substrate of a liquid crystal display device |
Oct. 14, 2008 |
| 7422985 |
Method for reducing dielectric overetch using a dielectric etch stop at a planar surface |
Sep. 9, 2008 |
| 7416985 |
Semiconductor device having a multilayer interconnection structure and fabrication method thereof |
Aug. 26, 2008 |
| 7413987 |
Method for manufacturing a semiconductor device |
Aug. 19, 2008 |
| 7405152 |
Reducing wire erosion during damascene processing |
Jul. 29, 2008 |
| 7393768 |
Etching of structures with high topography |
Jul. 1, 2008 |
| 7368385 |
Method for producing a structure on the surface of a substrate |
May. 6, 2008 |
| 7361598 |
Method for fabricating semiconductor device capable of preventing scratch |
Apr. 22, 2008 |
| 7354527 |
Chemical mechanical polishing pad and chemical mechanical polishing process |
Apr. 8, 2008 |
| 7354530 |
Chemical mechanical polishing systems and methods for their use |
Apr. 8, 2008 |
| 7346981 |
Method for fabricating microelectromechanical system (MEMS) devices |
Mar. 25, 2008 |
| 7344906 |
Structure and method for releasing stressy metal films |
Mar. 18, 2008 |
| 7319076 |
Low resistance T-shaped ridge structure |
Jan. 15, 2008 |
| 7291561 |
MEMS device integrated chip package, and method of making same |
Nov. 6, 2007 |
| 7282451 |
Methods of forming integrated circuit devices having metal interconnect layers therein |
Oct. 16, 2007 |
| 7279425 |
Polishing method |
Oct. 9, 2007 |
| 7270758 |
Method to improve ability to perform CMP-assisted liftoff for trackwidth definition |
Sep. 18, 2007 |
| 7256100 |
Manufacturing method of semiconductor device having trench type element isolation |
Aug. 14, 2007 |
| 7232762 |
Method for forming an improved low power SRAM contact |
Jun. 19, 2007 |
| 7229926 |
Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate |
Jun. 12, 2007 |
| 7223698 |
Method of forming a semiconductor arrangement with reduced field-to active step height |
May. 29, 2007 |
| 7217631 |
Semiconductor device and method for fabricating the device |
May. 15, 2007 |
| 7196013 |
Capping layer for a semiconductor device and a method of fabrication |
Mar. 27, 2007 |
| 7186655 |
Method for manufacturing semiconductor device |
Mar. 6, 2007 |
| 7179746 |
Method of surface treatment for manufacturing semiconductor device |
Feb. 20, 2007 |
| 7179735 |
Method of manufacturing semiconductor device |
Feb. 20, 2007 |
| 7129177 |
Write head fabrication by inverting order of process steps |
Oct. 31, 2006 |
| 7112458 |
Method of forming a liquid crystal display |
Sep. 26, 2006 |
| 7109118 |
Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
Sep. 19, 2006 |
| 7105452 |
Method of planarizing a semiconductor substrate with an etching chemistry |
Sep. 12, 2006 |
| 7105448 |
Method for peeling off semiconductor element and method for manufacturing semiconductor device |
Sep. 12, 2006 |
| 7087530 |
Aqueous dispersion for chemical mechanical polishing |
Aug. 8, 2006 |
| 7084059 |
CMP system for metal deposition |
Aug. 1, 2006 |
| 7081410 |
Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization |
Jul. 25, 2006 |
| 7071107 |
Method for manufacturing a semiconductor device |
Jul. 4, 2006 |
| 7067329 |
Methods of forming ferroelectric memory devices |
Jun. 27, 2006 |
| 7060622 |
Method of forming dummy wafer |
Jun. 13, 2006 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
