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Class Information
Number: 438/695
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Simultaneous etching and coating
Description: Processes wherein the chemical etching and material deposition occur concurrently.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5505816 |
Etching of silicon dioxide selectively to silicon nitride and polysilicon |
Apr. 9, 1996 |
| 5504022 |
Method of making a semiconductor memory device having a floating gate |
Apr. 2, 1996 |
| 5498312 |
Method for anisotropic plasma etching of substrates |
Mar. 12, 1996 |
| 5492607 |
Method of fabricating a surface emitting laser with large area deflecting mirror |
Feb. 20, 1996 |
| 5492235 |
Process for single mask C4 solder bump fabrication |
Feb. 20, 1996 |
| 5478437 |
Selective processing using a hydrocarbon and hydrogen |
Dec. 26, 1995 |
| 5476807 |
Method for forming fine patterns in a semiconductor device |
Dec. 19, 1995 |
| 5474650 |
Method and apparatus for dry etching |
Dec. 12, 1995 |
| 5462638 |
Selective etching of TiW for C4 fabrication |
Oct. 31, 1995 |
| 5453156 |
Anisotropic polysilicon plasma etch using fluorine gases |
Sep. 26, 1995 |
| 5447598 |
Process for forming resist mask pattern |
Sep. 5, 1995 |
| 5445712 |
Dry etching method |
Aug. 29, 1995 |
| 5436205 |
Method of forming electrode in semiconductor device |
Jul. 25, 1995 |
| 5423945 |
Selectivity for etching an oxide over a nitride |
Jun. 13, 1995 |
| 5419809 |
Dry etching method |
May. 30, 1995 |
| 5420076 |
Method of forming a contact for multi-level interconnects in an integrated circuit |
May. 30, 1995 |
| 5416048 |
Method to slope conductor profile prior to dielectric deposition to improve dielectric step-coverage |
May. 16, 1995 |
| 5401359 |
Dry etching method |
Mar. 28, 1995 |
| 5397431 |
Dry etching method |
Mar. 14, 1995 |
| 5391244 |
Dry etching method |
Feb. 21, 1995 |
| 5389574 |
Selective etching method for III-V group semiconductor material using a mixed etching gas and a stop-etching gas |
Feb. 14, 1995 |
| 5387556 |
Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub. 2 |
Feb. 7, 1995 |
| 5378309 |
Method for controlling the etching profile of a layer of an integrated circuit |
Jan. 3, 1995 |
| 5378312 |
Process for fabricating a semiconductor structure having sidewalls |
Jan. 3, 1995 |
| 5376234 |
Dry etching method |
Dec. 27, 1994 |
| 5370769 |
Dry etching method of GaAs |
Dec. 6, 1994 |
| 5354417 |
Etching MoSi.sub.2 using SF.sub.6, HBr and O.sub.2 |
Oct. 11, 1994 |
| 5354421 |
Dry etching method |
Oct. 11, 1994 |
| 5338393 |
Method for the local removal of UV-transparent insulation layers on a semiconductor substrate |
Aug. 16, 1994 |
| 5336636 |
Method for contacting conductive structures in VLSI circuits |
Aug. 9, 1994 |
| 5320708 |
Dry etching method |
Jun. 14, 1994 |
| 5318668 |
Dry etching method |
Jun. 7, 1994 |
| 5314578 |
Process for etching a multi-layer substrate |
May. 24, 1994 |
| 5312518 |
Dry etching method |
May. 17, 1994 |
| 5310456 |
Dry etching method |
May. 10, 1994 |
| 5275977 |
Insulating film forming method for semiconductor device interconnection |
Jan. 4, 1994 |
| 5268070 |
Dry etching method |
Dec. 7, 1993 |
| 5264396 |
Method for enhancing nitridation and oxidation growth by introducing pulsed NF.sub.3 |
Nov. 23, 1993 |
| 5262002 |
Method for manufacturing a trench structure in a substrate |
Nov. 16, 1993 |
| 5254213 |
Method of forming contact windows |
Oct. 19, 1993 |
| 5252177 |
Method for forming a multilayer wiring of a semiconductor device |
Oct. 12, 1993 |
| 5236549 |
Process for plasma etching |
Aug. 17, 1993 |
| 5236547 |
Method of forming a pattern in semiconductor device manufacturing process |
Aug. 17, 1993 |
| 5211790 |
Dry etching method by sulfur conditioning |
May. 18, 1993 |
| 5200028 |
Etching process of silicon material |
Apr. 6, 1993 |
| 5185058 |
Process for etching semiconductor devices |
Feb. 9, 1993 |
| 5182234 |
Profile tailored trench etch using a SF.sub.6 -O.sub.2 etching composition wherein both isotropic and anisotropic etching is achieved by varying the amount of oxygen |
Jan. 26, 1993 |
| 5118387 |
Dry etching method |
Jun. 2, 1992 |
| 5110408 |
Process for etching |
May. 5, 1992 |
| 5100504 |
Method of cleaning silicon surface |
Mar. 31, 1992 |
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