| |
 |
|
Class Information
Number: 438/695
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Simultaneous etching and coating
Description: Processes wherein the chemical etching and material deposition occur concurrently.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6449521 |
Decontamination of a plasma reactor using a plasma after a chamber clean |
Sep. 10, 2002 |
| 6423653 |
Reduction of plasma damage for HDP-CVD PSG process |
Jul. 23, 2002 |
| 6423648 |
Controllable oxidation technique for the formation of high-quality ultra-thin gate oxide using carbon dioxide as the oxidizing agent |
Jul. 23, 2002 |
| 6416933 |
Method to produce small space pattern using plasma polymerization layer |
Jul. 9, 2002 |
| 6413866 |
Method of forming a solute-enriched layer in a substrate surface and article formed thereby |
Jul. 2, 2002 |
| 6410383 |
Method of forming conducting diffusion barriers |
Jun. 25, 2002 |
| 6410437 |
Method for etching dual damascene structures in organosilicate glass |
Jun. 25, 2002 |
| 6410445 |
Manufacturing method for integrated sensor arrays |
Jun. 25, 2002 |
| 6410446 |
Method for gap filling |
Jun. 25, 2002 |
| 6410452 |
Method of manufacturing semiconductor device |
Jun. 25, 2002 |
| 6395643 |
Gas manifold for uniform gas distribution and photochemistry |
May. 28, 2002 |
| 6368974 |
Shrinking equal effect critical dimension of mask by in situ polymer deposition and etching |
Apr. 9, 2002 |
| 6365529 |
Method for patterning dual damascene interconnects using a sacrificial light absorbing material |
Apr. 2, 2002 |
| 6365015 |
Method for depositing high density plasma chemical vapor deposition oxide in high aspect ratio gaps |
Apr. 2, 2002 |
| 6326298 |
Substantially planar semiconductor topography using dielectrics and chemical mechanical polish |
Dec. 4, 2001 |
| 6323124 |
Resputtering to achieve better step coverage |
Nov. 27, 2001 |
| 6319835 |
Stripping method |
Nov. 20, 2001 |
| 6319861 |
Method of improving deposition |
Nov. 20, 2001 |
| 6294102 |
Selective dry etch of a dielectric film |
Sep. 25, 2001 |
| 6287977 |
Method and apparatus for forming improved metal interconnects |
Sep. 11, 2001 |
| 6274493 |
Method for forming a via |
Aug. 14, 2001 |
| 6271141 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines |
Aug. 7, 2001 |
| 6271138 |
Chemical mechanical polish (CMP) planarizing method with enhanced chemical mechanical polish (CMP) planarized layer planarity |
Aug. 7, 2001 |
| 6268288 |
Plasma treated thermal CVD of TaN films from tantalum halide precursors |
Jul. 31, 2001 |
| 6261951 |
Plasma treatment to enhance inorganic dielectric adhesion to copper |
Jul. 17, 2001 |
| 6255177 |
Method for fabricating a salicide gate |
Jul. 3, 2001 |
| 6251000 |
Substrate holder, method for polishing substrate, and method for fabricating semiconductor device |
Jun. 26, 2001 |
| 6242356 |
Etchback method for forming microelectronic layer with enhanced surface smoothness |
Jun. 5, 2001 |
| 6238936 |
Method of using critical dimension mapping to qualify a new integrated circuit fabrication etch process |
May. 29, 2001 |
| 6235637 |
Method for marking a wafer without inducing flat edge particle problem |
May. 22, 2001 |
| 6235638 |
Simplified etching technique for producing multiple undercut profiles |
May. 22, 2001 |
| 6232216 |
Thin film forming method |
May. 15, 2001 |
| 6227211 |
Uniformity improvement of high aspect ratio contact by stop layer |
May. 8, 2001 |
| 6225228 |
Silicon oxide co-deposition/etching process |
May. 1, 2001 |
| 6214736 |
Silicon processing method |
Apr. 10, 2001 |
| 6211040 |
Two-step, low argon, HDP CVD oxide deposition process |
Apr. 3, 2001 |
| 6203863 |
Method of gap filling |
Mar. 20, 2001 |
| 6204184 |
Method of manufacturing semiconductor devices |
Mar. 20, 2001 |
| 6200900 |
Method for formation of an air gap in an integrated circuit architecture |
Mar. 13, 2001 |
| 6183940 |
Method of retaining the integrity of a photoresist pattern |
Feb. 6, 2001 |
| 6184158 |
Inductively coupled plasma CVD |
Feb. 6, 2001 |
| 6174813 |
Dual damascene manufacturing process |
Jan. 16, 2001 |
| 6171922 |
SiCr thin film resistors having improved temperature coefficients of resistance and sheet resistance |
Jan. 9, 2001 |
| 6171962 |
Shallow trench isolation formation without planarization mask |
Jan. 9, 2001 |
| 6171963 |
Method for forming a planar intermetal dielectric using a barrier layer |
Jan. 9, 2001 |
| 6171965 |
Treatment method of cleaved film for the manufacture of substrates |
Jan. 9, 2001 |
| 6171964 |
Method of forming a conductive spacer in a via |
Jan. 9, 2001 |
| 6169035 |
Method of local oxidation using etchant and oxidizer |
Jan. 2, 2001 |
| 6156663 |
Method and apparatus for plasma processing |
Dec. 5, 2000 |
| 6150285 |
Method for simultaneous deposition and sputtering of TEOS |
Nov. 21, 2000 |
|
|
|
