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Class Information
Number: 438/695
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Simultaneous etching and coating
Description: Processes wherein the chemical etching and material deposition occur concurrently.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6737286 |
Apparatus and method for fabricating arrays of atomic-scale contacts and gaps between electrodes and applications thereof |
May. 18, 2004 |
| 6737349 |
Method of forming a copper wiring in a semiconductor device |
May. 18, 2004 |
| 6734105 |
Method for forming silicon quantum dots and method for fabricating nonvolatile memory device using the same |
May. 11, 2004 |
| 6730605 |
Redistribution of copper deposited films |
May. 4, 2004 |
| 6727158 |
Structure and method for forming a faceted opening and a layer filling therein |
Apr. 27, 2004 |
| 6709987 |
Method and apparatus for forming improved metal interconnects |
Mar. 23, 2004 |
| 6699795 |
Gate etch process |
Mar. 2, 2004 |
| 6699792 |
Polymer spacers for creating small geometry space and method of manufacture thereof |
Mar. 2, 2004 |
| 6685847 |
Method for observing cross-sectional structure of sample |
Feb. 3, 2004 |
| 6686322 |
Cleaning agent and cleaning process using the same |
Feb. 3, 2004 |
| 6686285 |
Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing |
Feb. 3, 2004 |
| 6653058 |
Methods for reducing profile variation in photoresist trimming |
Nov. 25, 2003 |
| 6638872 |
Integration of monocrystalline oxide devices with fully depleted CMOS on non-silicon substrates |
Oct. 28, 2003 |
| 6627548 |
Process for treating semiconductor substrates |
Sep. 30, 2003 |
| 6624076 |
Semiconductor device and method for fabricating the same |
Sep. 23, 2003 |
| 6620575 |
Construction of built-up structures on the surface of patterned masking used for polysilicon etch |
Sep. 16, 2003 |
| 6613678 |
Process for manufacturing a semiconductor substrate as well as a semiconductor thin film, and multilayer structure |
Sep. 2, 2003 |
| 6605526 |
Wirebond passivation pad connection using heated capillary |
Aug. 12, 2003 |
| 6599437 |
Method of etching organic antireflection coating (ARC) layers |
Jul. 29, 2003 |
| 6589864 |
Method for defining windows with different etching depths simultaneously |
Jul. 8, 2003 |
| 6583060 |
Dual depth trench isolation |
Jun. 24, 2003 |
| 6579808 |
Method of fabricating a semiconductor device |
Jun. 17, 2003 |
| 6576563 |
Method of manufacturing a semiconductor device employing a fluorine-based etch substantially free of hydrogen |
Jun. 10, 2003 |
| 6562720 |
Apparatus and method for surface finishing a silicon film |
May. 13, 2003 |
| 6559057 |
Semiconductor processing methods of forming a conductive projection and methods of increasing alignment tolerances |
May. 6, 2003 |
| 6555476 |
Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectric |
Apr. 29, 2003 |
| 6551915 |
Thermal annealing/hydrogen containing plasma method for forming structurally stable low contact resistance damascene conductor structure |
Apr. 22, 2003 |
| 6537923 |
Process for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines |
Mar. 25, 2003 |
| 6534409 |
Silicon oxide co-deposition/etching process |
Mar. 18, 2003 |
| 6531067 |
Method for forming contact hole |
Mar. 11, 2003 |
| 6531412 |
Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications |
Mar. 11, 2003 |
| 6531068 |
Method of anisotropic etching of silicon |
Mar. 11, 2003 |
| 6528427 |
Methods for reducing contamination of semiconductor substrates |
Mar. 4, 2003 |
| 6521538 |
Method of forming a trench with a rounded bottom in a semiconductor device |
Feb. 18, 2003 |
| 6521507 |
Selective deposition of undoped silicon film seeded in chlorine and hydride gas for a stacked capacitor |
Feb. 18, 2003 |
| 6511915 |
Electrochemical etching process |
Jan. 28, 2003 |
| 6500351 |
Process for producing magnetic recording head poles utilizing sputtered materials and a recording head made thereby |
Dec. 31, 2002 |
| 6498104 |
Method of in-situ cleaning for LPCVD TEOS pump |
Dec. 24, 2002 |
| 6498091 |
Method of using a barrier sputter reactor to remove an underlying barrier layer |
Dec. 24, 2002 |
| 6489244 |
Fuse, memory incorporating same and method |
Dec. 3, 2002 |
| 6489247 |
Copper etch using HCl and HBR chemistry |
Dec. 3, 2002 |
| 6479388 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines |
Nov. 12, 2002 |
| 6472324 |
Method of manufacturing trench type element isolation structure |
Oct. 29, 2002 |
| 6465345 |
Prevention of inter-channel current leakage in semiconductors |
Oct. 15, 2002 |
| 6465159 |
Method and apparatus for side wall passivation for organic etch |
Oct. 15, 2002 |
| 6461966 |
Method of high density plasma phosphosilicate glass process on pre-metal dielectric application for plasma damage reducing and throughput improvement |
Oct. 8, 2002 |
| 6458655 |
Method of manufacturing semiconductor device and flash memory |
Oct. 1, 2002 |
| 6455399 |
Smoothing method for cleaved films made using thermal treatment |
Sep. 24, 2002 |
| 6451700 |
Method and apparatus for measuring planarity of a polished layer |
Sep. 17, 2002 |
| 6451698 |
System and method for preventing electrochemical erosion by depositing a protective film |
Sep. 17, 2002 |
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