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Class Information
Number: 438/695
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Simultaneous etching and coating
Description: Processes wherein the chemical etching and material deposition occur concurrently.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7033943 |
Etching solution, etching method and method for manufacturing semiconductor device |
Apr. 25, 2006 |
| 7026244 |
Low resistance and reliable copper interconnects by variable doping |
Apr. 11, 2006 |
| 7022609 |
Manufacturing method of a semiconductor substrate provided with a through hole electrode |
Apr. 4, 2006 |
| 7018780 |
Methods for controlling and reducing profile variation in photoresist trimming |
Mar. 28, 2006 |
| 7015049 |
Fence-free etching of iridium barrier having a steep taper angle |
Mar. 21, 2006 |
| 6998304 |
Method for integrated manufacturing of split gate flash memory with high voltage MOSFETS |
Feb. 14, 2006 |
| 6995089 |
Method to remove copper without pattern density effect |
Feb. 7, 2006 |
| 6992012 |
Method and apparatus for forming improved metal interconnects |
Jan. 31, 2006 |
| 6984858 |
Semiconductor device and manufacturing method thereof |
Jan. 10, 2006 |
| 6982175 |
End point detection in time division multiplexed etch processes |
Jan. 3, 2006 |
| 6969668 |
Treatment method of film quality for the manufacture of substrates |
Nov. 29, 2005 |
| 6967165 |
Method for fabricating multilayer interconnect and method for checking the same |
Nov. 22, 2005 |
| 6960528 |
Method of forming a nanotip array in a substrate by forming masks on portions of the substrate and etching the unmasked portions |
Nov. 1, 2005 |
| 6949466 |
CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines |
Sep. 27, 2005 |
| 6949392 |
Integrated optical circuit with dense planarized cladding layer |
Sep. 27, 2005 |
| 6943039 |
Method of etching ferroelectric layers |
Sep. 13, 2005 |
| 6933236 |
Method for forming pattern using argon fluoride photolithography |
Aug. 23, 2005 |
| 6927160 |
Fabrication of copper-containing region such as electrical interconnect |
Aug. 9, 2005 |
| 6926011 |
Post etching treatment process for high density oxide etcher |
Aug. 9, 2005 |
| 6914000 |
Polishing method, polishing system and process-managing system |
Jul. 5, 2005 |
| 6913993 |
Chemical-mechanical polishing method |
Jul. 5, 2005 |
| 6913871 |
Fabricating sub-resolution structures in planar lightwave devices |
Jul. 5, 2005 |
| 6893893 |
Method of preventing short circuits in magnetic film stacks |
May. 17, 2005 |
| 6889697 |
Post etching treatment process for high density oxide etcher |
May. 10, 2005 |
| 6890858 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines |
May. 10, 2005 |
| 6875697 |
Dual depth trench isolation |
Apr. 5, 2005 |
| 6869880 |
In situ application of etch back for improved deposition into high-aspect-ratio features |
Mar. 22, 2005 |
| 6867141 |
Method for fabricating semiconductor device and forming interlayer dielectric film using high-density plasma |
Mar. 15, 2005 |
| 6860275 |
Post etching treatment process for high density oxide etcher |
Mar. 1, 2005 |
| 6855643 |
Method for fabricating a gate structure |
Feb. 15, 2005 |
| 6855634 |
Polishing method and polishing apparatus |
Feb. 15, 2005 |
| 6846748 |
Method for removing photoresist |
Jan. 25, 2005 |
| 6844262 |
CMP process |
Jan. 18, 2005 |
| 6835663 |
Hardmask of amorphous carbon-hydrogen (a-C:H) layers with tunable etch resistivity |
Dec. 28, 2004 |
| 6828237 |
Sidewall polymer deposition method for forming a patterned microelectronic layer |
Dec. 7, 2004 |
| 6825123 |
Method for treating semiconductor processing components and components formed thereby |
Nov. 30, 2004 |
| 6825049 |
Method and system for field assisted statistical assembly of wafers |
Nov. 30, 2004 |
| 6815357 |
Process and apparatus for manufacturing a semiconductor device |
Nov. 9, 2004 |
| 6809033 |
Innovative method of hard mask removal |
Oct. 26, 2004 |
| 6808748 |
Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology |
Oct. 26, 2004 |
| 6794291 |
Reactor for processing a semiconductor wafer |
Sep. 21, 2004 |
| 6784093 |
Copper surface passivation during semiconductor manufacturing |
Aug. 31, 2004 |
| 6784096 |
Methods and apparatus for forming barrier layers in high aspect ratio vias |
Aug. 31, 2004 |
| 6780337 |
Method for trench etching |
Aug. 24, 2004 |
| 6780731 |
HDP gap-filling process for structures with extra step at side-wall |
Aug. 24, 2004 |
| 6776851 |
In-situ cleaning of a polymer coated plasma processing chamber |
Aug. 17, 2004 |
| 6774040 |
Apparatus and method for surface finishing a silicon film |
Aug. 10, 2004 |
| 6764864 |
BST on low-loss substrates for frequency agile applications |
Jul. 20, 2004 |
| 6743727 |
Method of etching high aspect ratio openings |
Jun. 1, 2004 |
| 6743729 |
Etching method and etching apparatus of carbon thin film |
Jun. 1, 2004 |
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