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Class Information
Number: 438/695
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step > Simultaneous etching and coating
Description: Processes wherein the chemical etching and material deposition occur concurrently.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618894 |
Multi-step selective etching for cross-point memory |
Nov. 17, 2009 |
| 7608539 |
ALD method and apparatus |
Oct. 27, 2009 |
| 7608544 |
Etching method and storage medium |
Oct. 27, 2009 |
| 7605084 |
Method of gap-filling using amplitude modulation radio frequency power |
Oct. 20, 2009 |
| 7579280 |
Method of patterning a film |
Aug. 25, 2009 |
| 7576009 |
Method for forming fine pattern of semiconductor device |
Aug. 18, 2009 |
| 7576002 |
Multi-step barrier deposition method |
Aug. 18, 2009 |
| 7576008 |
Method for forming buried contact electrode of semiconductor device having pn junction and optoelectronic semiconductor device using the same |
Aug. 18, 2009 |
| 7572686 |
System for thin film deposition utilizing compensating forces |
Aug. 11, 2009 |
| 7572733 |
Gas switching during an etch process to modulate the characteristics of the etch |
Aug. 11, 2009 |
| 7569484 |
Plasma and electron beam etching device and method |
Aug. 4, 2009 |
| 7563716 |
Polishing method |
Jul. 21, 2009 |
| 7563379 |
Dry etching method and photonic crystal device fabricated by use of the same |
Jul. 21, 2009 |
| 7560389 |
Method for fabricating semiconductor element |
Jul. 14, 2009 |
| 7560385 |
Etching systems and processing gas specie modulation |
Jul. 14, 2009 |
| 7544620 |
Process for digging a deep trench in a semiconductor body and semiconductor body so obtained |
Jun. 9, 2009 |
| 7541288 |
Methods of forming integrated circuit structures using insulator deposition and insulator gap filling techniques |
Jun. 2, 2009 |
| 7538036 |
Methods of forming openings, and methods of forming container capacitors |
May. 26, 2009 |
| 7528076 |
Method for manufacturing gate oxide layer with different thicknesses |
May. 5, 2009 |
| 7514014 |
High density plasma chemical vapor deposition process |
Apr. 7, 2009 |
| 7476618 |
Selective formation of metal layers in an integrated circuit |
Jan. 13, 2009 |
| 7476610 |
Removable spacer |
Jan. 13, 2009 |
| 7476621 |
Halogen-free noble gas assisted H.sub.2 plasma etch process in deposition-etch-deposition gap fill |
Jan. 13, 2009 |
| 7473645 |
Method of depositing a layer comprising silicon, carbon, and fluorine onto a semiconductor substrate |
Jan. 6, 2009 |
| 7459400 |
Patterned structures fabricated by printing mask over lift-off pattern |
Dec. 2, 2008 |
| 7455893 |
Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD |
Nov. 25, 2008 |
| 7439143 |
Flash memory device and method of manufacturing the same |
Oct. 21, 2008 |
| 7435684 |
Resolving of fluorine loading effect in the vacuum chamber |
Oct. 14, 2008 |
| 7429535 |
Use of a plasma source to form a layer during the formation of a semiconductor device |
Sep. 30, 2008 |
| 7429533 |
Pitch reduction |
Sep. 30, 2008 |
| 7427568 |
Method of forming an interconnect structure |
Sep. 23, 2008 |
| 7413960 |
Method of forming floating gate electrode in flash memory device |
Aug. 19, 2008 |
| 7410901 |
Submicron device fabrication |
Aug. 12, 2008 |
| 7405139 |
Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch |
Jul. 29, 2008 |
| 7390748 |
Method of forming a polishing inhibiting layer using a slurry having an additive |
Jun. 24, 2008 |
| 7384873 |
Manufacturing process of semiconductor device |
Jun. 10, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7375032 |
Semiconductor substrate thinning method for manufacturing thinned die |
May. 20, 2008 |
| 7371671 |
System and method for photolithography in semiconductor manufacturing |
May. 13, 2008 |
| 7358184 |
Method of forming a conductive via plug |
Apr. 15, 2008 |
| 7345002 |
Replication and transfer of microstructures and nanostructures |
Mar. 18, 2008 |
| 7300878 |
Gas switching during an etch process to modulate the characteristics of the etch |
Nov. 27, 2007 |
| 7297640 |
Method for reducing argon diffusion from high density plasma films |
Nov. 20, 2007 |
| 7294578 |
Use of a plasma source to form a layer during the formation of a semiconductor device |
Nov. 13, 2007 |
| 7291561 |
MEMS device integrated chip package, and method of making same |
Nov. 6, 2007 |
| 7279425 |
Polishing method |
Oct. 9, 2007 |
| 7271101 |
High density plasma chemical vapor deposition process |
Sep. 18, 2007 |
| 7256121 |
Contact resistance reduction by new barrier stack process |
Aug. 14, 2007 |
| 7256134 |
Selective etching of carbon-doped low-k dielectrics |
Aug. 14, 2007 |
| 7244679 |
Methods of forming silicon quantum dots and methods of fabricating semiconductor memory devices using the same |
Jul. 17, 2007 |
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