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Class Information
Number: 438/694
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step
Description: Processes additionally having a step of depositing a material onto the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6605537 |
Polishing of metal substrates |
Aug. 12, 2003 |
| 6605546 |
Dual bake for BARC fill without voids |
Aug. 12, 2003 |
| 6602794 |
Silylation process for forming contacts |
Aug. 5, 2003 |
| 6593177 |
Self aligned method of forming a semiconductor memory array of floating gate memory cells, and a memory array made thereby |
Jul. 15, 2003 |
| 6593239 |
Chemical mechanical polishing method useful for copper substrates |
Jul. 15, 2003 |
| 6589873 |
Process for manufacturing a semiconductor device |
Jul. 8, 2003 |
| 6589874 |
Method for forming electromigration-resistant structures by doping |
Jul. 8, 2003 |
| 6582512 |
Method of forming three-dimensional photonic band structures in solid materials |
Jun. 24, 2003 |
| 6579808 |
Method of fabricating a semiconductor device |
Jun. 17, 2003 |
| 6579798 |
Processes for chemical-mechanical polishing of a semiconductor wafer |
Jun. 17, 2003 |
| 6576563 |
Method of manufacturing a semiconductor device employing a fluorine-based etch substantially free of hydrogen |
Jun. 10, 2003 |
| 6576555 |
Method of making upper conductive line in dual damascene having lower copper lines |
Jun. 10, 2003 |
| 6569765 |
Hybrid deposition system and methods |
May. 27, 2003 |
| 6569768 |
Surface treatment and capping layer process for producing a copper interface in a semiconductor device |
May. 27, 2003 |
| 6569777 |
Plasma etching method to form dual damascene with improved via profile |
May. 27, 2003 |
| 6566264 |
Method for forming an opening in a semiconductor device substrate |
May. 20, 2003 |
| 6555477 |
Method for preventing Cu CMP corrosion |
Apr. 29, 2003 |
| 6551936 |
Method of etching patterns into epitaxial material |
Apr. 22, 2003 |
| 6551937 |
Process for device using partial SOI |
Apr. 22, 2003 |
| 6551905 |
Wafer adhesive for semiconductor dry etch applications |
Apr. 22, 2003 |
| 6548406 |
Method for forming integrated circuit having MONOS device and mixed-signal circuit |
Apr. 15, 2003 |
| 6548410 |
Method of fabricating wires for semiconductor devices |
Apr. 15, 2003 |
| 6548411 |
Apparatus and methods for processing a workpiece |
Apr. 15, 2003 |
| 6544905 |
Metal gate trim process by using self assembled monolayers |
Apr. 8, 2003 |
| 6537917 |
Method for fabricating electrically insulating layers |
Mar. 25, 2003 |
| 6538273 |
Ferroelectric transistor and method for fabricating it |
Mar. 25, 2003 |
| 6531036 |
Fabrication of micron-sized parts from conductive materials by silicon electric-discharge machining |
Mar. 11, 2003 |
| 6531400 |
Process for manufacturing semiconductor integrated circuit device |
Mar. 11, 2003 |
| 6528426 |
Integrated circuit interconnect and method |
Mar. 4, 2003 |
| 6528427 |
Methods for reducing contamination of semiconductor substrates |
Mar. 4, 2003 |
| 6524946 |
Method of fabricating a semiconductor device having a contact hole |
Feb. 25, 2003 |
| 6524962 |
Method for forming dual-damascene interconnect structure |
Feb. 25, 2003 |
| 6514864 |
Fabrication method for semiconductor integrated circuit device |
Feb. 4, 2003 |
| 6514850 |
Interface with dielectric layer and method of making |
Feb. 4, 2003 |
| 6511914 |
Reactor for processing a workpiece using sonic energy |
Jan. 28, 2003 |
| 6511913 |
Method for manufacturing a membrane |
Jan. 28, 2003 |
| 6503840 |
Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning |
Jan. 7, 2003 |
| 6500765 |
Method for manufacturing dual-spacer structure |
Dec. 31, 2002 |
| 6500763 |
Method for manufacturing an electrode of a capacitor |
Dec. 31, 2002 |
| 6500749 |
Method to improve copper via electromigration (EM) resistance |
Dec. 31, 2002 |
| 6498091 |
Method of using a barrier sputter reactor to remove an underlying barrier layer |
Dec. 24, 2002 |
| 6498103 |
Method for manufacturing solid-state imaging device |
Dec. 24, 2002 |
| 6495464 |
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
Dec. 17, 2002 |
| 6492283 |
Method of forming ultrathin oxide layer |
Dec. 10, 2002 |
| 6492209 |
Selectively thin silicon film for creating fully and partially depleted SOI on same wafer |
Dec. 10, 2002 |
| 6492284 |
Reactor for processing a workpiece using sonic energy |
Dec. 10, 2002 |
| 6486058 |
Method of forming a photoresist pattern using WASOOM |
Nov. 26, 2002 |
| 6479411 |
Method for forming high quality multiple thickness oxide using high temperature descum |
Nov. 12, 2002 |
| 6475966 |
Plasma etching residue removal |
Nov. 5, 2002 |
| 6475867 |
Method of forming integrated circuit features by oxidation of titanium hard mask |
Nov. 5, 2002 |
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