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Class Information
Number: 438/694
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step
Description: Processes additionally having a step of depositing a material onto the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7112822 |
Semiconductor device using partial SOI substrate and manufacturing method thereof |
Sep. 26, 2006 |
| 7112458 |
Method of forming a liquid crystal display |
Sep. 26, 2006 |
| 7112243 |
Method for producing Group III nitride compound semiconductor |
Sep. 26, 2006 |
| 7109095 |
Method for fabricating semiconductor device |
Sep. 19, 2006 |
| 7105452 |
Method of planarizing a semiconductor substrate with an etching chemistry |
Sep. 12, 2006 |
| 7105448 |
Method for peeling off semiconductor element and method for manufacturing semiconductor device |
Sep. 12, 2006 |
| 7105395 |
Programming and erasing structure for an NVM cell |
Sep. 12, 2006 |
| 7101770 |
Capacitive techniques to reduce noise in high speed interconnections |
Sep. 5, 2006 |
| 7098135 |
Semiconductor device including bit line formed using damascene technique and method of fabricating the same |
Aug. 29, 2006 |
| 7097779 |
Processing system and method for chemically treating a TERA layer |
Aug. 29, 2006 |
| 7084064 |
Full sequence metal and barrier layer electrochemical mechanical processing |
Aug. 1, 2006 |
| 7084065 |
Method for fabricating a semiconductor device |
Aug. 1, 2006 |
| 7081403 |
Thin leadless plastic chip carrier |
Jul. 25, 2006 |
| 7078345 |
Method for manufacturing a semiconductor device |
Jul. 18, 2006 |
| 7074702 |
Methods of manufacturing semiconductor devices |
Jul. 11, 2006 |
| 7067329 |
Methods of forming ferroelectric memory devices |
Jun. 27, 2006 |
| 7067424 |
Method of manufacturing an electronic device |
Jun. 27, 2006 |
| 7067429 |
Processing method of forming MRAM circuitry |
Jun. 27, 2006 |
| 7064059 |
Method of forming dual damascene metal interconnection employing sacrificial metal oxide layer |
Jun. 20, 2006 |
| 7052997 |
Method to form etch and/or CMP stop layers |
May. 30, 2006 |
| 7052552 |
Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
May. 30, 2006 |
| 7053005 |
Method of forming a silicon oxide layer in a semiconductor manufacturing process |
May. 30, 2006 |
| 7053004 |
Decreasing the residue of a silicon dioxide layer after trench etching |
May. 30, 2006 |
| 7049241 |
Method for forming a trench in a layer or a layer stack on a semiconductor wafer |
May. 23, 2006 |
| 7045450 |
Method of manufacturing semiconductor device |
May. 16, 2006 |
| 7042751 |
Method to produce data cell region and system region for semiconductor memory |
May. 9, 2006 |
| 7041227 |
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials |
May. 9, 2006 |
| 7033941 |
Method of producing semiconductor devices using chemical mechanical polishing |
Apr. 25, 2006 |
| 7030020 |
Method to shrink cell size in a split gate flash |
Apr. 18, 2006 |
| 7030045 |
Method of fabricating oxides with low defect densities |
Apr. 18, 2006 |
| 7030021 |
Method of fabricating metal interconnection of semiconductor device |
Apr. 18, 2006 |
| 7022604 |
Method of forming spatial regions of a second material in a first material |
Apr. 4, 2006 |
| 7022609 |
Manufacturing method of a semiconductor substrate provided with a through hole electrode |
Apr. 4, 2006 |
| 7018780 |
Methods for controlling and reducing profile variation in photoresist trimming |
Mar. 28, 2006 |
| 7018575 |
Method for assembly of complementary-shaped receptacle site and device microstructures |
Mar. 28, 2006 |
| 7015147 |
Fabrication of silicon-on-nothing (SON) MOSFET fabrication using selective etching of Si.sub.1-xGe.sub.x layer |
Mar. 21, 2006 |
| 7015144 |
Compositions including perhydro-polysilazane used in a semiconductor manufacturing process and methods of manufacturing semiconductor devices using the same |
Mar. 21, 2006 |
| 7008874 |
Process for reclaiming semiconductor wafers and reclaimed wafers |
Mar. 7, 2006 |
| 7005385 |
Method for removing a resist mask with high selectivity to a carbon hard mask used for semiconductor structuring |
Feb. 28, 2006 |
| 7005390 |
Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials |
Feb. 28, 2006 |
| 7001854 |
Hydrogen-based phosphosilicate glass process for gap fill of high aspect ratio structures |
Feb. 21, 2006 |
| 7001849 |
Surface treatment and protection method for cadmium zinc telluride crystals |
Feb. 21, 2006 |
| 6995095 |
Methods of simultaneously fabricating isolation structures having varying dimensions |
Feb. 7, 2006 |
| 6992003 |
Integration of ultra low K dielectric in a semiconductor fabrication process |
Jan. 31, 2006 |
| 6992010 |
Gate structure and method of manufacture |
Jan. 31, 2006 |
| 6984858 |
Semiconductor device and manufacturing method thereof |
Jan. 10, 2006 |
| 6979625 |
Copper interconnects with metal capping layer and selective copper alloys |
Dec. 27, 2005 |
| 6979651 |
Method for forming alignment features and back-side contacts with fewer lithography and etch steps |
Dec. 27, 2005 |
| 6977408 |
High-performance non-volatile memory device and fabrication process |
Dec. 20, 2005 |
| 6974659 |
Method of forming a solder ball using a thermally stable resinous protective layer |
Dec. 13, 2005 |
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