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Class Information
Number: 438/694
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step
Description: Processes additionally having a step of depositing a material onto the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5885857 |
Semiconductor chip capable of suppressing cracks in the insulating layer |
Mar. 23, 1999 |
| 5885888 |
Etching material and etching process |
Mar. 23, 1999 |
| 5882489 |
Processes for cleaning and stripping photoresist from surfaces of semiconductor wafers |
Mar. 16, 1999 |
| 5879226 |
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
Mar. 9, 1999 |
| 5880030 |
Unlanded via structure and method for making same |
Mar. 9, 1999 |
| 5880028 |
Ridge waveguide type distributed feedback semiconductor laser device and method for manufacturing the same |
Mar. 9, 1999 |
| 5880029 |
Method of passivating semiconductor devices and the passivated devices |
Mar. 9, 1999 |
| 5877064 |
Method for marking a wafer |
Mar. 2, 1999 |
| 5869405 |
In situ rapid thermal etch and rapid thermal oxidation |
Feb. 9, 1999 |
| 5869357 |
Metallization and wire bonding process for manufacturing power semiconductor devices |
Feb. 9, 1999 |
| 5866481 |
Selective partial curing of spin-on-glass by ultraviolet radiation to protect integrated circuit dice near the wafer edge |
Feb. 2, 1999 |
| 5861102 |
Method for the flattening treatment of silicon single crystal surface |
Jan. 19, 1999 |
| 5858881 |
Method of producing thin film |
Jan. 12, 1999 |
| 5858854 |
Method for forming high contrast alignment marks |
Jan. 12, 1999 |
| 5851367 |
Differential copper deposition on integrated circuit surfaces and method for same |
Dec. 22, 1998 |
| 5843844 |
Probe sheet and method of manufacturing the same |
Dec. 1, 1998 |
| 5843250 |
Method of forming an image pattern on a die plate |
Dec. 1, 1998 |
| 5834378 |
Passivation of porous semiconductors for improved optoelectronic device performance and fabrication of light-emitting diode bases on same |
Nov. 10, 1998 |
| 5833817 |
Method for improving conformity and contact bottom coverage of sputtered titanium nitride barrier layers |
Nov. 10, 1998 |
| 5834371 |
Method and apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof |
Nov. 10, 1998 |
| 5830376 |
Topographical selective patterns |
Nov. 3, 1998 |
| 5824603 |
Method of forming a low-K layer in an integrated circuit |
Oct. 20, 1998 |
| 5817577 |
Grounding method for eliminating process antenna effect |
Oct. 6, 1998 |
| 5817174 |
Semiconductor substrate and method of treating semiconductor substrate |
Oct. 6, 1998 |
| 5814239 |
Gas-phase etching and regrowth method for Group III-nitride crystals |
Sep. 29, 1998 |
| 5814552 |
High step process for manufacturing alignment marks for twin-well integrated circuit devices |
Sep. 29, 1998 |
| 5798554 |
MOS-technology power device integrated structure and manufacturing process thereof |
Aug. 25, 1998 |
| 5798302 |
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers |
Aug. 25, 1998 |
| 5795825 |
Connection layer forming method |
Aug. 18, 1998 |
| 5795829 |
Method of high density plasma metal etching |
Aug. 18, 1998 |
| 5792673 |
Monitoring of eching |
Aug. 11, 1998 |
| 5773855 |
Microelectronic circuit including silicided field-effect transistor elements that bifunction as interconnects |
Jun. 30, 1998 |
| 5770000 |
Cleaning system and method |
Jun. 23, 1998 |
| 5766970 |
Method of manufacturing a twin well semiconductor device with improved planarity |
Jun. 16, 1998 |
| 5766492 |
Method of metal-plating electrode portions of printed-wiring board |
Jun. 16, 1998 |
| 5766499 |
Method of making a circuitized substrate |
Jun. 16, 1998 |
| 5766691 |
Process for manufacturing a high heat density transfer device |
Jun. 16, 1998 |
| 5767017 |
Selective removal of vertical portions of a film |
Jun. 16, 1998 |
| 5759919 |
Method for reducing gate oxide damages during gate electrode plasma etching |
Jun. 2, 1998 |
| 5760435 |
Use of spacers as floating gates in EEPROM with doubled storage efficiency |
Jun. 2, 1998 |
| 5744012 |
Method for fabricating semiconductor device |
Apr. 28, 1998 |
| 5741626 |
Method for forming a dielectric tantalum nitride layer as an anti-reflective coating (ARC) |
Apr. 21, 1998 |
| 5736462 |
Method of etching back layer on substrate |
Apr. 7, 1998 |
| 5733468 |
Pattern plating method for fabricating printed circuit boards |
Mar. 31, 1998 |
| 5733713 |
Method of manufacturing semiconductor device |
Mar. 31, 1998 |
| 5731243 |
Method of cleaning residue on a semiconductor wafer bonding pad |
Mar. 24, 1998 |
| 5723383 |
Semiconductor substrate treatment method |
Mar. 3, 1998 |
| 5716873 |
Method for cleaning waste matter from the backside of a semiconductor wafer substrate |
Feb. 10, 1998 |
| 5714037 |
Method of improving adhesion between thin films |
Feb. 3, 1998 |
| 5714039 |
Method for making sub-lithographic images by etching the intersection of two spacers |
Feb. 3, 1998 |
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