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Class Information
Number: 438/694
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with coating step
Description: Processes additionally having a step of depositing a material onto the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6258637 |
Method for thin film deposition on single-crystal semiconductor substrates |
Jul. 10, 2001 |
| 6259128 |
Metal-insulator-metal capacitor for copper damascene process and method of forming the same |
Jul. 10, 2001 |
| 6259143 |
Semiconductor memory device of NOR type mask ROM and manufacturing method of the same |
Jul. 10, 2001 |
| 6255689 |
Flash memory structure and method of manufacture |
Jul. 3, 2001 |
| 6255225 |
Method of forming a resist pattern, a method of manufacturing semiconductor device by the same method, and a device and a hot plate for forming a resist pattern |
Jul. 3, 2001 |
| 6251788 |
Method of integrated circuit polishing without dishing effects |
Jun. 26, 2001 |
| 6251000 |
Substrate holder, method for polishing substrate, and method for fabricating semiconductor device |
Jun. 26, 2001 |
| 6251783 |
Method of manufacturing shallow trench isolation |
Jun. 26, 2001 |
| 6251790 |
Method for fabricating contacts in a semiconductor device |
Jun. 26, 2001 |
| 6252247 |
Thin film transistor, a method for producing the thin film transistor, and a liquid crystal display using a TFT array substrate |
Jun. 26, 2001 |
| 6245648 |
Method of forming semiconducting materials and barriers |
Jun. 12, 2001 |
| 6245681 |
Dual temperature nitride strip process |
Jun. 12, 2001 |
| 6242356 |
Etchback method for forming microelectronic layer with enhanced surface smoothness |
Jun. 5, 2001 |
| 6239031 |
Stepper alignment mark structure for maintaining alignment integrity |
May. 29, 2001 |
| 6239040 |
Method of coating amorphous silicon film |
May. 29, 2001 |
| 6235642 |
Method for reducing plasma charging damages |
May. 22, 2001 |
| 6235637 |
Method for marking a wafer without inducing flat edge particle problem |
May. 22, 2001 |
| 6232232 |
High selectivity BPSG to TEOS etchant |
May. 15, 2001 |
| 6228768 |
Storage-annealing plated CU interconnects |
May. 8, 2001 |
| 6225228 |
Silicon oxide co-deposition/etching process |
May. 1, 2001 |
| 6225227 |
Method for manufacturing semiconductor device |
May. 1, 2001 |
| 6218308 |
Method of manufacturing a contact for a capacitor of high density DRAMs |
Apr. 17, 2001 |
| 6214720 |
Plasma process enhancement through reduction of gaseous contaminants |
Apr. 10, 2001 |
| 6204180 |
Apparatus and process for manufacturing semiconductor devices, products and precursor structures utilizing sorbent-based fluid storage and dispensing system for reagent delivery |
Mar. 20, 2001 |
| 6204539 |
Semiconductor apparatus and manufacturing method therefor |
Mar. 20, 2001 |
| 6197691 |
Shallow trench isolation process |
Mar. 6, 2001 |
| 6197668 |
Ferroelectric-enhanced tantalum pentoxide for dielectric material applications in CMOS devices |
Mar. 6, 2001 |
| 6197695 |
Process for the manufacture of passive and active components on the same insulating substrate |
Mar. 6, 2001 |
| 6197694 |
In situ method for cleaning silicon surface and forming layer thereon in same chamber |
Mar. 6, 2001 |
| 6194327 |
Rapid thermal etch and rapid thermal oxidation |
Feb. 27, 2001 |
| 6191041 |
Method of fabricating semiconductor device |
Feb. 20, 2001 |
| 6191026 |
Method for submicron gap filling on a semiconductor substrate |
Feb. 20, 2001 |
| 6191035 |
Recipe design to prevent tungsten (W) coating on wafer backside for those wafers with poly Si on wafer backside |
Feb. 20, 2001 |
| 6191037 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Feb. 20, 2001 |
| 6187682 |
Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material |
Feb. 13, 2001 |
| 6187685 |
Method and apparatus for etching a substrate |
Feb. 13, 2001 |
| 6177339 |
Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry |
Jan. 23, 2001 |
| 6177351 |
Method and structure for etching a thin film perovskite layer |
Jan. 23, 2001 |
| 6174815 |
Method for planarizing DRAM cells |
Jan. 16, 2001 |
| 6174805 |
Titanium film forming method |
Jan. 16, 2001 |
| 6171902 |
Method of forming a DRAM cylinder shaped capacitor |
Jan. 9, 2001 |
| 6171964 |
Method of forming a conductive spacer in a via |
Jan. 9, 2001 |
| 6169035 |
Method of local oxidation using etchant and oxidizer |
Jan. 2, 2001 |
| 6159820 |
Method for fabricating a DRAM cell capacitor |
Dec. 12, 2000 |
| 6159804 |
Disposable sidewall oxidation fabrication method for making a transistor having an ultra short channel length |
Dec. 12, 2000 |
| 6156662 |
Fabrication process of a liquid crystal display device with improved yield |
Dec. 5, 2000 |
| 6156393 |
Method of molecular-scale pattern imprinting at surfaces |
Dec. 5, 2000 |
| 6150273 |
Method of fabricating a kink-effect-free shallow trench isolations |
Nov. 21, 2000 |
| 6140240 |
Method for eliminating CMP induced microscratches |
Oct. 31, 2000 |
| 6140247 |
Semiconductor device manufacturing method |
Oct. 31, 2000 |
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