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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6475879 |
Semiconductor wafer, method for processing the same and method for manufacturing semiconductor device |
Nov. 5, 2002 |
| 6475875 |
Shallow trench isolation elevation uniformity via insertion of a polysilicon etch layer |
Nov. 5, 2002 |
| 6475407 |
Composition for polishing metal on semiconductor wafer and method of using same |
Nov. 5, 2002 |
| 6471735 |
Compositions for use in a chemical-mechanical planarization process |
Oct. 29, 2002 |
| 6471884 |
Method for polishing a memory or rigid disk with an amino acid-containing composition |
Oct. 29, 2002 |
| 6472291 |
Planarization process to achieve improved uniformity across semiconductor wafers |
Oct. 29, 2002 |
| 6468913 |
Ready-to-use stable chemical-mechanical polishing slurries |
Oct. 22, 2002 |
| 6468911 |
Method of chemical/mechanical polishing of the surface of semiconductor device |
Oct. 22, 2002 |
| 6468910 |
Slurry for chemical mechanical polishing silicon dioxide |
Oct. 22, 2002 |
| 6468909 |
Isolation and/or removal of ionic contaminants from planarization fluid compositions using macrocyclic polyethers and methods of using such compositions |
Oct. 22, 2002 |
| 6458704 |
Light sensitive chemical-mechanical polishing method |
Oct. 1, 2002 |
| 6458674 |
Process for manufacturing semiconductor integrated circuit device |
Oct. 1, 2002 |
| 6454819 |
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device |
Sep. 24, 2002 |
| 6451697 |
Method for abrasive-free metal CMP in passivation domain |
Sep. 17, 2002 |
| 6451696 |
Method for reclaiming wafer substrate and polishing solution compositions therefor |
Sep. 17, 2002 |
| 6447563 |
Chemical mechanical polishing slurry system having an activator solution |
Sep. 10, 2002 |
| 6448182 |
Stabilization of peroxygen-containing slurries used in a chemical mechanical planarization |
Sep. 10, 2002 |
| 6444569 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process |
Sep. 3, 2002 |
| 6444491 |
Composite semiconductor devices and method for manufacture thereof |
Sep. 3, 2002 |
| 6440848 |
Interconnection of a semiconductor device and a method of forming thereof |
Aug. 27, 2002 |
| 6440187 |
Alumina powder, process for producing the same and polishing composition |
Aug. 27, 2002 |
| 6440186 |
Polishing composition and polishing method employing it |
Aug. 27, 2002 |
| 6436830 |
CMP system for polishing semiconductor wafers and related method |
Aug. 20, 2002 |
| 6436811 |
Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry |
Aug. 20, 2002 |
| 6436302 |
Post CU CMP polishing for reduced defects |
Aug. 20, 2002 |
| 6435944 |
CMP slurry for planarizing metals |
Aug. 20, 2002 |
| 6436834 |
Chemical-mechanical abrasive composition and method |
Aug. 20, 2002 |
| 6436829 |
Two phase chemical/mechanical polishing process for tungsten layers |
Aug. 20, 2002 |
| 6436835 |
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same |
Aug. 20, 2002 |
| 6432826 |
Planarized Cu cleaning for reduced defects |
Aug. 13, 2002 |
| 6432823 |
Off-concentric polishing system design |
Aug. 13, 2002 |
| 6432828 |
Chemical mechanical polishing slurry useful for copper substrates |
Aug. 13, 2002 |
| 6428721 |
Polishing composition and polishing method employing it |
Aug. 6, 2002 |
| 6429130 |
Method and apparatus for end point detection in a chemical mechanical polishing process using two laser beams |
Aug. 6, 2002 |
| 6429134 |
Method of manufacturing semiconductor device |
Aug. 6, 2002 |
| 6428398 |
Method for wafer polishing and method for polishing-pad dressing |
Aug. 6, 2002 |
| 6429132 |
Combination CMP-etch method for forming a thin planar layer over the surface of a device |
Aug. 6, 2002 |
| 6426295 |
Reduction of surface roughness during chemical mechanical planarization(CMP) |
Jul. 30, 2002 |
| 6425956 |
Process for removing chemical mechanical polishing residual slurry |
Jul. 30, 2002 |
| 6423638 |
Filter apparatus and method therefor |
Jul. 23, 2002 |
| 6420266 |
Methods for creating elements of predetermined shape and apparatuses using these elements |
Jul. 16, 2002 |
| 6420269 |
Cerium oxide abrasive for polishing insulating films formed on substrate and methods for using the same |
Jul. 16, 2002 |
| 6420265 |
Method for polishing semiconductor device |
Jul. 16, 2002 |
| RE37786 |
Copper-based metal polishing solution and method for manufacturing semiconductor device |
Jul. 9, 2002 |
| 6417102 |
Semiconductor processing method using high pressure liquid media treatment |
Jul. 9, 2002 |
| 6413869 |
Dielectric protected chemical-mechanical polishing in integrated circuit interconnects |
Jul. 2, 2002 |
| 6413873 |
System for chemical mechanical planarization |
Jul. 2, 2002 |
| 6410443 |
Method for removing semiconductor ARC using ARC CMP buffing |
Jun. 25, 2002 |
| 6410439 |
Semiconductor polishing apparatus and method for chemical/mechanical polishing of films |
Jun. 25, 2002 |
| 6410444 |
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same |
Jun. 25, 2002 |
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