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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6740591 |
Slurry and method for chemical mechanical polishing of copper |
May. 25, 2004 |
| 6740590 |
AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATIO |
May. 25, 2004 |
| 6734427 |
TEM/SEM sample preparation |
May. 11, 2004 |
| 6734103 |
Method of polishing a semiconductor device |
May. 11, 2004 |
| 6733685 |
Methods of planarizing structures on wafers and substrates by polishing |
May. 11, 2004 |
| 6733553 |
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same |
May. 11, 2004 |
| 6730602 |
Method for forming aluminum bumps by sputtering and chemical mechanical polishing |
May. 4, 2004 |
| 6730603 |
System and method of determining a polishing endpoint by monitoring signal intensity |
May. 4, 2004 |
| 6730644 |
Cleaning solution for substrates of electronic materials |
May. 4, 2004 |
| 6730592 |
Methods for planarization of metal-containing surfaces using halogens and halide salts |
May. 4, 2004 |
| 6723144 |
Semiconductor device fabricating method |
Apr. 20, 2004 |
| 6723646 |
Method for controlling and monitoring a chemical mechanical polishing process |
Apr. 20, 2004 |
| 6723576 |
Disposing method for semiconductor elements |
Apr. 20, 2004 |
| 6720250 |
Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper |
Apr. 13, 2004 |
| 6721628 |
Closed loop concentration control system for chemical mechanical polishing slurry |
Apr. 13, 2004 |
| 6716743 |
Method of manufacturing a semiconductor device |
Apr. 6, 2004 |
| 6716755 |
Composition and method for planarizing surfaces |
Apr. 6, 2004 |
| 6713394 |
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures |
Mar. 30, 2004 |
| 6709981 |
Method and apparatus for processing a semiconductor wafer using novel final polishing method |
Mar. 23, 2004 |
| 6709316 |
Method and apparatus for two-step barrier layer polishing |
Mar. 23, 2004 |
| 6693036 |
Method for producing semiconductor device polishing apparatus, and polishing method |
Feb. 17, 2004 |
| 6693035 |
Methods to control film removal rates for improved polishing in metal CMP |
Feb. 17, 2004 |
| 6689692 |
Composition for oxide CMP |
Feb. 10, 2004 |
| 6685543 |
Compensating chemical mechanical wafer polishing apparatus and method |
Feb. 3, 2004 |
| 6686284 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using |
Feb. 3, 2004 |
| 6682575 |
Methanol-containing silica-based CMP compositions |
Jan. 27, 2004 |
| 6679929 |
Polishing composition and polishing method employing it |
Jan. 20, 2004 |
| 6679928 |
Polishing composition having a surfactant |
Jan. 20, 2004 |
| 6677239 |
Methods and compositions for chemical mechanical polishing |
Jan. 13, 2004 |
| 6676719 |
Aqueous dispersion, a process for the preparation and the use thereof |
Jan. 13, 2004 |
| 6676718 |
Polishing of semiconductor substrates |
Jan. 13, 2004 |
| 6670272 |
Method for reducing dishing in chemical mechanical polishing |
Dec. 30, 2003 |
| 6664188 |
Semiconductor wafer with a resistant film |
Dec. 16, 2003 |
| 6664189 |
Removal of wafer edge defocus due to CMP |
Dec. 16, 2003 |
| 6663683 |
Aqueous dispersions, process for their production, and their use |
Dec. 16, 2003 |
| 6660640 |
Process for planarizing patterned metal structures for magnetic thin film heads |
Dec. 9, 2003 |
| 6660639 |
Method of fabricating a copper damascene structure |
Dec. 9, 2003 |
| 6660638 |
CMP process leaving no residual oxide layer or slurry particles |
Dec. 9, 2003 |
| 6660636 |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
Dec. 9, 2003 |
| 6656241 |
Silica-based slurry |
Dec. 2, 2003 |
| 6656029 |
Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
Dec. 2, 2003 |
| 6656842 |
Barrier layer buffing after Cu CMP |
Dec. 2, 2003 |
| 6653242 |
Solution to metal re-deposition during substrate planarization |
Nov. 25, 2003 |
| 6652764 |
Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
Nov. 25, 2003 |
| 6649523 |
Method and system to provide material removal and planarization employing a reactive pad |
Nov. 18, 2003 |
| 6649524 |
Method and apparatus for forming glass layer, method and apparatus for forming metal layer, and electronic component manufacturing method |
Nov. 18, 2003 |
| 6645865 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Nov. 11, 2003 |
| 6645863 |
Method of manufacturing semiconductor device and semiconductor device |
Nov. 11, 2003 |
| 6645862 |
Double-side polishing process with reduced scratch rate and device for carrying out the process |
Nov. 11, 2003 |
| 6642147 |
Method of making thermally stable planarizing films |
Nov. 4, 2003 |
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