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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6833324 |
Process and device for cleaning a semiconductor wafer |
Dec. 21, 2004 |
| 6830504 |
Barrier-slurry-free copper CMP process |
Dec. 14, 2004 |
| 6830500 |
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
Dec. 14, 2004 |
| 6827752 |
Cerium oxide slurry, and method of manufacturing substrate |
Dec. 7, 2004 |
| 6825117 |
High PH slurry for chemical mechanical polishing of copper |
Nov. 30, 2004 |
| 6825116 |
Method for removing structures |
Nov. 30, 2004 |
| 6825120 |
Metal surface and film protection method to prolong Q-time after metal deposition |
Nov. 30, 2004 |
| 6821894 |
CMP process |
Nov. 23, 2004 |
| 6821895 |
Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
Nov. 23, 2004 |
| 6821897 |
Method for copper CMP using polymeric complexing agents |
Nov. 23, 2004 |
| 6821896 |
Method to eliminate via poison effect |
Nov. 23, 2004 |
| 6818030 |
Process for producing abrasive particles and abrasive particles produced by the process |
Nov. 16, 2004 |
| 6818031 |
Polishing composition |
Nov. 16, 2004 |
| 6814766 |
Polishing composition and polishing method employing it |
Nov. 9, 2004 |
| 6815357 |
Process and apparatus for manufacturing a semiconductor device |
Nov. 9, 2004 |
| 6815353 |
Multi-layer film stack polish stop |
Nov. 9, 2004 |
| 6806193 |
CMP in-situ conditioning with pad and retaining ring clean |
Oct. 19, 2004 |
| 6805615 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
Oct. 19, 2004 |
| 6803353 |
Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
Oct. 12, 2004 |
| 6800556 |
Polishing method using ceria slurry, and method of manufacturing semiconductor device |
Oct. 5, 2004 |
| 6797623 |
Methods of producing and polishing semiconductor device and polishing apparatus |
Sep. 28, 2004 |
| 6797626 |
Method of polishing copper layer of substrate |
Sep. 28, 2004 |
| 6797682 |
Resist stripper |
Sep. 28, 2004 |
| 6794285 |
Slurry for CMP, and method of manufacturing semiconductor device |
Sep. 21, 2004 |
| 6794289 |
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
Sep. 21, 2004 |
| 6790769 |
CMP slurry and method of manufacturing semiconductor device |
Sep. 14, 2004 |
| 6790786 |
Etching processes for integrated circuit manufacturing including methods of forming capacitors |
Sep. 14, 2004 |
| 6786945 |
Polishing compound and method for polishing substrate |
Sep. 7, 2004 |
| 6786944 |
Aqueous dispersion for chemical mechanical polishing |
Sep. 7, 2004 |
| 6787471 |
Method of manufacturing a semiconductor device |
Sep. 7, 2004 |
| 6780773 |
Method of chemical mechanical polishing with high throughput and low dishing |
Aug. 24, 2004 |
| 6776810 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Aug. 17, 2004 |
| 6776696 |
Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
Aug. 17, 2004 |
| 6776852 |
Process of removing holefill residue from a metallic surface of an electronic substrate |
Aug. 17, 2004 |
| 6773476 |
Polishing composition and polishing method employing it |
Aug. 10, 2004 |
| 6774042 |
Planarization method for deep sub micron shallow trench isolation process |
Aug. 10, 2004 |
| 6767476 |
Polishing composition for metal CMP |
Jul. 27, 2004 |
| 6767807 |
Method for producing organic thin film device and transfer material used therein |
Jul. 27, 2004 |
| 6767377 |
Aqueous dispersion containing cerium oxide-coated silicon powder, process for the production thereof and use thereof |
Jul. 27, 2004 |
| 6761747 |
Dispersion containing pyrogenically manufactured abrasive particles with superparamagnetic domains |
Jul. 13, 2004 |
| 6753258 |
Integration scheme for dual damascene structure |
Jun. 22, 2004 |
| 6753246 |
Semiconductor device with a first dummy pattern |
Jun. 22, 2004 |
| 6752844 |
Ceric-ion slurry for use in chemical-mechanical polishing |
Jun. 22, 2004 |
| 6750145 |
Method of eliminating agglomerate particles in a polishing slurry |
Jun. 15, 2004 |
| 6749488 |
Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers |
Jun. 15, 2004 |
| 6746498 |
Abrasive with a modified surface and a method for making it |
Jun. 8, 2004 |
| 6743268 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy |
Jun. 1, 2004 |
| 6743723 |
Method for fabricating semiconductor device |
Jun. 1, 2004 |
| 6743267 |
Gel-free colloidal abrasive polishing compositions and associated methods |
Jun. 1, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
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