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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6967125 |
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same |
Nov. 22, 2005 |
| 6964924 |
Integrated circuit process monitoring and metrology system |
Nov. 15, 2005 |
| 6955935 |
Method for chemical mechanical polishing for fabricating semiconductor device |
Oct. 18, 2005 |
| 6955586 |
CMP composition and process |
Oct. 18, 2005 |
| 6953389 |
Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching |
Oct. 11, 2005 |
| 6953751 |
Micro device and process for producing it |
Oct. 11, 2005 |
| 6951695 |
High surface quality GaN wafer and method of fabricating same |
Oct. 4, 2005 |
| 6943114 |
Integration scheme for metal gap fill, with fixed abrasive CMP |
Sep. 13, 2005 |
| 6935013 |
Apparatus and method for precise lapping of recessed and protruding elements in a workpiece |
Aug. 30, 2005 |
| 6936534 |
Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization |
Aug. 30, 2005 |
| 6936541 |
Method for planarizing metal interconnects |
Aug. 30, 2005 |
| 6936542 |
Polishing slurries for copper and associated materials |
Aug. 30, 2005 |
| 6933226 |
Method of forming a metal gate in a semiconductor device |
Aug. 23, 2005 |
| 6933186 |
Method for BEOL resistor tolerance improvement using anodic oxidation |
Aug. 23, 2005 |
| 6930037 |
Process for forming a metal interconnect |
Aug. 16, 2005 |
| 6924227 |
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device |
Aug. 2, 2005 |
| 6916742 |
Modular barrier removal polishing slurry |
Jul. 12, 2005 |
| 6914002 |
Differential planarization |
Jul. 5, 2005 |
| 6914001 |
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same |
Jul. 5, 2005 |
| 6903021 |
Method of polishing a semiconductor device |
Jun. 7, 2005 |
| 6902591 |
Polishing composition |
Jun. 7, 2005 |
| 6890858 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines |
May. 10, 2005 |
| 6890857 |
Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same |
May. 10, 2005 |
| 6884723 |
Methods for planarization of group VIII metal-containing surfaces using complexing agents |
Apr. 26, 2005 |
| 6881660 |
Method for forming wiring structure |
Apr. 19, 2005 |
| 6878631 |
Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
Apr. 12, 2005 |
| 6878630 |
Method of manufacturing a wafer |
Apr. 12, 2005 |
| 6875696 |
Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal di |
Apr. 5, 2005 |
| 6867138 |
Method of chemical/mechanical polishing of the surface of semiconductor device |
Mar. 15, 2005 |
| 6867140 |
Method of polishing a multi-layer substrate |
Mar. 15, 2005 |
| 6863700 |
Cerium oxide abrasive and method of polishing substrates |
Mar. 8, 2005 |
| 6861360 |
Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers |
Mar. 1, 2005 |
| 6861353 |
Methods for planarization of metal-containing surfaces using halogens and halide salts |
Mar. 1, 2005 |
| 6857434 |
CMP slurry additive for foreign matter detection |
Feb. 22, 2005 |
| 6858540 |
Selective removal of tantalum-containing barrier layer during metal CMP |
Feb. 22, 2005 |
| 6857950 |
Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method |
Feb. 22, 2005 |
| 6858539 |
Post-CMP treating liquid and method for manufacturing semiconductor device |
Feb. 22, 2005 |
| 6858531 |
Electro chemical mechanical polishing method |
Feb. 22, 2005 |
| 6858538 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
Feb. 22, 2005 |
| 6854484 |
Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve |
Feb. 15, 2005 |
| 6849548 |
Method of reducing particulate contamination during polishing of a wafer |
Feb. 1, 2005 |
| 6849547 |
Apparatus and process for polishing a workpiece |
Feb. 1, 2005 |
| 6849542 |
Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives |
Feb. 1, 2005 |
| 6849099 |
Polishing composition |
Feb. 1, 2005 |
| 6841470 |
Removal of residue from a substrate |
Jan. 11, 2005 |
| 6841480 |
Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
Jan. 11, 2005 |
| 6840971 |
Chemical mechanical polishing systems and methods for their use |
Jan. 11, 2005 |
| 6838382 |
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
Jan. 4, 2005 |
| 6833109 |
Method and apparatus for storing a semiconductor wafer after its CMP polishing |
Dec. 21, 2004 |
| 6833324 |
Process and device for cleaning a semiconductor wafer |
Dec. 21, 2004 |
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