| |
 |
|
Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5036015 |
Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
Jul. 30, 1991 |
| 4968381 |
Method of haze-free polishing for semiconductor wafers |
Nov. 6, 1990 |
| 4956313 |
Via-filling and planarization technique |
Sep. 11, 1990 |
| 4944836 |
Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
Jul. 31, 1990 |
| 4910155 |
Wafer flood polishing |
Mar. 20, 1990 |
| 4892612 |
Polishing method |
Jan. 9, 1990 |
| 4889586 |
Method for polishing AlGaAs surfaces |
Dec. 26, 1989 |
| 4874463 |
Integrated circuits from wafers having improved flatness |
Oct. 17, 1989 |
| 4755478 |
Method of forming metal-strapped polysilicon gate electrode for FET device |
Jul. 5, 1988 |
| 4735679 |
Method of improving silicon-on-insulator uniformity |
Apr. 5, 1988 |
| 4687682 |
Back sealing of silicon wafers |
Aug. 18, 1987 |
| 4671851 |
Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique |
Jun. 9, 1987 |
| 4448634 |
Process for polishing III-V-semiconductor surfaces |
May. 15, 1984 |
| 4184908 |
Method for polishing cadmium sulfide semiconductors |
Jan. 22, 1980 |
| 4043861 |
Process for polishing semiconductor surfaces and polishing agent used in said process |
Aug. 23, 1977 |
|
|
|
