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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5935278 |
Abrasive composition for magnetic recording disc substrate |
Aug. 10, 1999 |
| 5934978 |
Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects |
Aug. 10, 1999 |
| 5934977 |
Method of planarizing a workpiece |
Aug. 10, 1999 |
| 5932486 |
Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers |
Aug. 3, 1999 |
| 5928962 |
Process for forming a semiconductor device |
Jul. 27, 1999 |
| 5922620 |
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus |
Jul. 13, 1999 |
| 5916412 |
Apparatus for and method of polishing workpiece |
Jun. 29, 1999 |
| 5916453 |
Methods of planarizing structures on wafers and substrates by polishing |
Jun. 29, 1999 |
| 5916855 |
Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films |
Jun. 29, 1999 |
| 5916819 |
Planarization fluid composition chelating agents and planarization method using same |
Jun. 29, 1999 |
| 5914275 |
Polishing apparatus and method for planarizing layer on a semiconductor wafer |
Jun. 22, 1999 |
| 5910022 |
Method and system for tungsten chemical mechanical polishing for unplanarized dielectric surfaces |
Jun. 8, 1999 |
| 5910846 |
Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
Jun. 8, 1999 |
| 5911111 |
Polysilicon polish for patterning improvement |
Jun. 8, 1999 |
| 5897375 |
Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
Apr. 27, 1999 |
| 5896870 |
Method of removing slurry particles |
Apr. 27, 1999 |
| 5893756 |
Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing |
Apr. 13, 1999 |
| 5893754 |
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
Apr. 13, 1999 |
| 5893753 |
Vibrating polishing pad conditioning system and method |
Apr. 13, 1999 |
| 5885899 |
Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry |
Mar. 23, 1999 |
| 5885334 |
Polishing fluid composition and polishing method |
Mar. 23, 1999 |
| 5882539 |
Wafer processing method and equipment therefor |
Mar. 16, 1999 |
| 5879226 |
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
Mar. 9, 1999 |
| 5876490 |
Polish process and slurry for planarization |
Mar. 2, 1999 |
| 5877089 |
Slurry containing manganese oxide |
Mar. 2, 1999 |
| 5866480 |
Method and apparatus for polishing semiconductor substrate |
Feb. 2, 1999 |
| 5863838 |
Method for chemically-mechanically polishing a metal layer |
Jan. 26, 1999 |
| 5863307 |
Method and slurry composition for chemical-mechanical polish (CMP) planarizing of copper containing conductor layers |
Jan. 26, 1999 |
| 5861054 |
Polishing slurry |
Jan. 19, 1999 |
| 5861055 |
Polishing composition for CMP operations |
Jan. 19, 1999 |
| 5858813 |
Chemical mechanical polishing slurry for metal layers and films |
Jan. 12, 1999 |
| 5855735 |
Process for recovering substrates |
Jan. 5, 1999 |
| 5854093 |
Direct attachment of silicon chip to circuit carrier |
Dec. 29, 1998 |
| 5854133 |
Method for manufacturing a semiconductor device |
Dec. 29, 1998 |
| 5851894 |
Method of vertically integrating microelectronic systems |
Dec. 22, 1998 |
| 5840629 |
Copper chemical mechanical polishing slurry utilizing a chromate oxidant |
Nov. 24, 1998 |
| 5834377 |
In situ method for CMP endpoint detection |
Nov. 10, 1998 |
| 5834375 |
Chemical-mechanical polishing planarization monitor |
Nov. 10, 1998 |
| 5827395 |
Polishing pad used for polishing silicon wafers and polishing method using the same |
Oct. 27, 1998 |
| 5827781 |
Planarization slurry including a dispersant and method of using same |
Oct. 27, 1998 |
| 5804513 |
Abrasive composition and use of the same |
Sep. 8, 1998 |
| 5798302 |
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers |
Aug. 25, 1998 |
| 5792709 |
High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers |
Aug. 11, 1998 |
| 5783489 |
Multi-oxidizer slurry for chemical mechanical polishing |
Jul. 21, 1998 |
| 5773364 |
Method for using ammonium salt slurries for chemical mechanical polishing (CMP) |
Jun. 30, 1998 |
| 5770095 |
Polishing agent and polishing method using the same |
Jun. 23, 1998 |
| 5767827 |
Reflective type active matrix display panel and method of manufacturing same |
Jun. 16, 1998 |
| 5767016 |
Method of forming a wiring layer on a semiconductor by polishing with treated slurry |
Jun. 16, 1998 |
| 5763325 |
Fabrication process of a semiconductor device using a slurry containing manganese oxide |
Jun. 9, 1998 |
| 5759917 |
Composition for oxide CMP |
Jun. 2, 1998 |
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