 |
|
 |
| |
 |
|
Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6051499 |
Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
Apr. 18, 2000 |
| 6046110 |
Copper-based metal polishing solution and method for manufacturing a semiconductor device |
Apr. 4, 2000 |
| 6046112 |
Chemical mechanical polishing slurry |
Apr. 4, 2000 |
| 6046111 |
Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates |
Apr. 4, 2000 |
| 6045605 |
Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material |
Apr. 4, 2000 |
| 6045716 |
Chemical mechanical polishing apparatus and method |
Apr. 4, 2000 |
| 6046099 |
Plug or via formation using novel slurries for chemical mechanical polishing |
Apr. 4, 2000 |
| 6043159 |
Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon |
Mar. 28, 2000 |
| 6043160 |
Method of manufacturing a monitor pad for chemical mechanical polishing planarization |
Mar. 28, 2000 |
| 6040245 |
IC mechanical planarization process incorporating two slurry compositions for faster material removal times |
Mar. 21, 2000 |
| 6037260 |
Polishing composition |
Mar. 14, 2000 |
| 6028006 |
Method for maintaining the buffer capacity of siliceous chemical-mechanical silicon polishing slurries |
Feb. 22, 2000 |
| 6027554 |
Polishing composition |
Feb. 22, 2000 |
| 6022807 |
Method for fabricating an integrated circuit |
Feb. 8, 2000 |
| 6019806 |
High selectivity slurry for shallow trench isolation processing |
Feb. 1, 2000 |
| 6020262 |
Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
Feb. 1, 2000 |
| 6017463 |
Point of use mixing for LI/plug tungsten polishing slurry to improve existing slurry |
Jan. 25, 2000 |
| 6013564 |
Method of manufacturing semiconductor wafer without mirror polishing after formation of blocking film |
Jan. 11, 2000 |
| 6010964 |
Wafer surface treatment methods and systems using electrocapillarity |
Jan. 4, 2000 |
| 6008119 |
Chemical-mechanical polishing of semiconductor wafers |
Dec. 28, 1999 |
| 6004880 |
Method of single step damascene process for deposition and global planarization |
Dec. 21, 1999 |
| 6004653 |
Planarization process by applying a polish-differentiating technique utilizing an ultraviolet-light sensitive organic oxide layer |
Dec. 21, 1999 |
| 6001269 |
Method for polishing a composite comprising an insulator, a metal, and titanium |
Dec. 14, 1999 |
| 6001731 |
Isolation dielectric deposition in multi-polysilicon chemical-mechanical polishing process |
Dec. 14, 1999 |
| 6001730 |
Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers |
Dec. 14, 1999 |
| 5997620 |
Polishing composition |
Dec. 7, 1999 |
| 5993686 |
Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
Nov. 30, 1999 |
| 5990012 |
Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads |
Nov. 23, 1999 |
| 5985769 |
Method of forming an interlayer insulating film |
Nov. 16, 1999 |
| 5985748 |
Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process |
Nov. 16, 1999 |
| 5985045 |
Process for polishing a semiconductor substrate |
Nov. 16, 1999 |
| 5980775 |
Composition and slurry useful for metal CMP |
Nov. 9, 1999 |
| 5981396 |
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
Nov. 9, 1999 |
| 5980979 |
Method for consistently forming low resistance contact structures involving the removal of adhesion layer particles blocking via openings |
Nov. 9, 1999 |
| 5981394 |
Chemical mechanical polishing method, polisher used in chemical mechanical polishing and method of manufacturing semiconductor device |
Nov. 9, 1999 |
| 5968239 |
Polishing slurry |
Oct. 19, 1999 |
| 5968841 |
Device and method for preventing settlement of particles on a chemical-mechanical polishing pad |
Oct. 19, 1999 |
| 5968843 |
Method of planarizing a semiconductor topography using multiple polish pads |
Oct. 19, 1999 |
| 5965459 |
Method for removing crevices induced by chemical-mechanical polishing |
Oct. 12, 1999 |
| 5962343 |
Process for producing crystalline ceric oxide particles and abrasive |
Oct. 5, 1999 |
| 5958795 |
Chemical-mechanical polishing for shallow trench isolation |
Sep. 28, 1999 |
| 5954975 |
Slurries for chemical mechanical polishing tungsten films |
Sep. 21, 1999 |
| 5952243 |
Removal rate behavior of spin-on dielectrics with chemical mechanical polish |
Sep. 14, 1999 |
| 5951724 |
Fine particulate polishing agent, method for producing the same and method for producing semiconductor devices |
Sep. 14, 1999 |
| 5948699 |
Wafer backing insert for free mount semiconductor polishing apparatus and process |
Sep. 7, 1999 |
| 5948698 |
Manufacturing method of semiconductor device using chemical mechanical polishing |
Sep. 7, 1999 |
| 5945346 |
Chemical mechanical planarization system and method therefor |
Aug. 31, 1999 |
| 5941759 |
Lapping method using upper and lower lapping turntables |
Aug. 24, 1999 |
| 5935871 |
Process for forming a semiconductor device |
Aug. 10, 1999 |
| 5935870 |
Top view TEM sample preparation method |
Aug. 10, 1999 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
