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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6362103 |
Method and apparatus for rejuvenating a CMP chemical solution |
Mar. 26, 2002 |
| 6362104 |
Method for polishing a substrate using a CMP slurry |
Mar. 26, 2002 |
| 6362106 |
Chemical mechanical polishing method useful for copper substrates |
Mar. 26, 2002 |
| 6362107 |
Polishing pad and polishing device |
Mar. 26, 2002 |
| 6362108 |
Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant |
Mar. 26, 2002 |
| 6358360 |
Precision polishing apparatus for polishing a semiconductor substrate |
Mar. 19, 2002 |
| 6358847 |
Method for enabling conventional wire bonding to copper-based bond pad features |
Mar. 19, 2002 |
| 6358850 |
Slurry-less chemical-mechanical polishing of oxide materials |
Mar. 19, 2002 |
| 6355565 |
Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers |
Mar. 12, 2002 |
| 6350690 |
Process for achieving full global planarization during CMP of damascene semiconductor structures |
Feb. 26, 2002 |
| 6350678 |
Chemical-mechanical polishing of semiconductors |
Feb. 26, 2002 |
| 6347978 |
Composition and method for polishing rigid disks |
Feb. 19, 2002 |
| 6348076 |
Slurry for mechanical polishing (CMP) of metals and use thereof |
Feb. 19, 2002 |
| 6348421 |
Dielectric gap fill process that effectively reduces capacitance between narrow metal lines using HDP-CVD |
Feb. 19, 2002 |
| 6348415 |
Planarization method for semiconductor device |
Feb. 19, 2002 |
| 6344414 |
Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
Feb. 5, 2002 |
| 6342166 |
Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
Jan. 29, 2002 |
| 6340434 |
Method and apparatus for chemical-mechanical polishing |
Jan. 22, 2002 |
| 6340374 |
Polishing slurry and polishing method |
Jan. 22, 2002 |
| 6337280 |
Polishing cloth and method of manufacturing semiconductor device using the same |
Jan. 8, 2002 |
| 6337271 |
Polishing simulation |
Jan. 8, 2002 |
| 6328774 |
Polishing composition and method for producing a memory hard disk |
Dec. 11, 2001 |
| 6326309 |
Semiconductor device manufacturing method |
Dec. 4, 2001 |
| 6316329 |
Forming a trench mask comprising a DLC and ASH protecting layer |
Nov. 13, 2001 |
| 6315803 |
Polishing composition and polishing process |
Nov. 13, 2001 |
| 6316365 |
Chemical-mechanical polishing method |
Nov. 13, 2001 |
| 6316366 |
Method of polishing using multi-oxidizer slurry |
Nov. 13, 2001 |
| 6313038 |
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
Nov. 6, 2001 |
| 6313039 |
Chemical mechanical polishing composition and process |
Nov. 6, 2001 |
| 6312487 |
Polishing compound and an edge polishing method thereby |
Nov. 6, 2001 |
| 6312486 |
Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
Nov. 6, 2001 |
| 6306768 |
Method for planarizing microelectronic substrates having apertures |
Oct. 23, 2001 |
| 6302768 |
Method for polishing surface of vapor-phase synthesized thin diamond film |
Oct. 16, 2001 |
| 6302765 |
Process for mechanical chemical polishing of a layer in a copper-based material |
Oct. 16, 2001 |
| 6300248 |
On-chip pad conditioning for chemical mechanical polishing |
Oct. 9, 2001 |
| 6300247 |
Preconditioning polishing pads for chemical-mechanical polishing |
Oct. 9, 2001 |
| 6300239 |
Method of manufacturing semiconductor device |
Oct. 9, 2001 |
| 6299659 |
Polishing material composition and polishing method for polishing LSI devices |
Oct. 9, 2001 |
| 6300249 |
Polishing compound and a method for polishing |
Oct. 9, 2001 |
| 6297159 |
Method and apparatus for chemical polishing using field responsive materials |
Oct. 2, 2001 |
| 6296717 |
Regeneration of chemical mechanical polishing pads in-situ |
Oct. 2, 2001 |
| 6293848 |
Composition and method for planarizing surfaces |
Sep. 25, 2001 |
| 6294470 |
Slurry-less chemical-mechanical polishing |
Sep. 25, 2001 |
| 6294472 |
Dual slurry particle sizes for reducing microscratching of wafers |
Sep. 25, 2001 |
| 6291350 |
Method of polishing semiconductor wafer |
Sep. 18, 2001 |
| 6290736 |
Chemically active slurry for the polishing of noble metals and method for same |
Sep. 18, 2001 |
| 6287972 |
System and method for residue entrapment utilizing a polish and sacrificial fill for semiconductor fabrication |
Sep. 11, 2001 |
| 6280924 |
Planarization method using fluid composition including chelating agents |
Aug. 28, 2001 |
| 6280652 |
Edge polishing composition |
Aug. 28, 2001 |
| 6281130 |
Method for developing ultra-thin resist films |
Aug. 28, 2001 |
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