 |
|
 |
| |
 |
|
Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6409936 |
Composition and method of formation and use therefor in chemical-mechanical polishing |
Jun. 25, 2002 |
| 6409781 |
Polishing slurries for copper and associated materials |
Jun. 25, 2002 |
| 6410440 |
Method and apparatus for a gaseous environment providing improved control of CMP process |
Jun. 25, 2002 |
| 6407000 |
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
Jun. 18, 2002 |
| 6403385 |
Method of inspecting a semiconductor wafer for defects |
Jun. 11, 2002 |
| 6398827 |
Polishing composition |
Jun. 4, 2002 |
| 6399499 |
Method for fabricating an electrode of a plasma chamber |
Jun. 4, 2002 |
| 6399500 |
Mechano-chemical polishing of crystals and epitaxial layers of GaN and Ga1-x-yA1xInyN |
Jun. 4, 2002 |
| 6399501 |
Method and apparatus for detecting polishing endpoint with optical monitoring |
Jun. 4, 2002 |
| 6399506 |
Method for planarizing an oxide layer |
Jun. 4, 2002 |
| 6395635 |
Reduction of tungsten damascene residue |
May. 28, 2002 |
| 6387812 |
Ultrasonic processing of chemical mechanical polishing slurries |
May. 14, 2002 |
| 6387289 |
Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
May. 14, 2002 |
| 6383060 |
Method of polishing silicon wafer |
May. 7, 2002 |
| 6383240 |
Aqueous dispersion for chemical mechanical polishing |
May. 7, 2002 |
| 6383934 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
May. 7, 2002 |
| 6379406 |
Polishing compositions for semiconductor substrates |
Apr. 30, 2002 |
| 6376345 |
Process for manufacturing semiconductor integrated circuit device |
Apr. 23, 2002 |
| 6375694 |
Polishing slurry compositions capable of providing multi-modal particle packing |
Apr. 23, 2002 |
| 6375693 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy |
Apr. 23, 2002 |
| 6376381 |
Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
Apr. 23, 2002 |
| 6368968 |
Ditch type floating ring for chemical mechanical polishing |
Apr. 9, 2002 |
| 6368981 |
Method of manufacturing semiconductor device and chemical mechanical polishing apparatus |
Apr. 9, 2002 |
| 6368972 |
Method for making an integrated circuit including alignment marks |
Apr. 9, 2002 |
| 6368969 |
Chemical-mechanical polishing methods |
Apr. 9, 2002 |
| 6365523 |
Integrated high density plasma chemical vapor deposition (HDP-CVD) method and chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layers |
Apr. 2, 2002 |
| 6364919 |
Process for preparing metal oxide slurries suitable for the chemical mechanical polishing of semiconductors |
Apr. 2, 2002 |
| 6365520 |
Small particle size chemical mechanical polishing composition |
Apr. 2, 2002 |
| 6362108 |
Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant |
Mar. 26, 2002 |
| 6362107 |
Polishing pad and polishing device |
Mar. 26, 2002 |
| 6362104 |
Method for polishing a substrate using a CMP slurry |
Mar. 26, 2002 |
| 6362103 |
Method and apparatus for rejuvenating a CMP chemical solution |
Mar. 26, 2002 |
| 6362101 |
Chemical mechanical polishing methods using low pH slurry mixtures |
Mar. 26, 2002 |
| 6362100 |
Methods and apparatus for forming a copper interconnect |
Mar. 26, 2002 |
| 6362106 |
Chemical mechanical polishing method useful for copper substrates |
Mar. 26, 2002 |
| 6358847 |
Method for enabling conventional wire bonding to copper-based bond pad features |
Mar. 19, 2002 |
| 6358850 |
Slurry-less chemical-mechanical polishing of oxide materials |
Mar. 19, 2002 |
| 6358360 |
Precision polishing apparatus for polishing a semiconductor substrate |
Mar. 19, 2002 |
| 6355565 |
Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers |
Mar. 12, 2002 |
| 6350678 |
Chemical-mechanical polishing of semiconductors |
Feb. 26, 2002 |
| 6350690 |
Process for achieving full global planarization during CMP of damascene semiconductor structures |
Feb. 26, 2002 |
| 6347978 |
Composition and method for polishing rigid disks |
Feb. 19, 2002 |
| 6348076 |
Slurry for mechanical polishing (CMP) of metals and use thereof |
Feb. 19, 2002 |
| 6348415 |
Planarization method for semiconductor device |
Feb. 19, 2002 |
| 6348421 |
Dielectric gap fill process that effectively reduces capacitance between narrow metal lines using HDP-CVD |
Feb. 19, 2002 |
| 6344414 |
Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
Feb. 5, 2002 |
| 6342166 |
Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
Jan. 29, 2002 |
| 6340434 |
Method and apparatus for chemical-mechanical polishing |
Jan. 22, 2002 |
| 6340374 |
Polishing slurry and polishing method |
Jan. 22, 2002 |
| 6337271 |
Polishing simulation |
Jan. 8, 2002 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
