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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7368066 |
Gold CMP composition and method |
May. 6, 2008 |
| 7368387 |
Polishing composition and polishing method |
May. 6, 2008 |
| 7368388 |
Cerium oxide abrasives for chemical mechanical polishing |
May. 6, 2008 |
| 7365013 |
System for the preferential removal of silicon oxide |
Apr. 29, 2008 |
| 7361603 |
Passivative chemical mechanical polishing composition for copper film planarization |
Apr. 22, 2008 |
| 7351354 |
Tungsten metal removing solution and method for removing tungsten metal by use thereof |
Apr. 1, 2008 |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
Mar. 18, 2008 |
| 7338904 |
Method for manufacturing single-side mirror surface wafer |
Mar. 4, 2008 |
| 7335239 |
Chemical mechanical planarization pad |
Feb. 26, 2008 |
| 7332104 |
Slurry for CMP, polishing method and method of manufacturing semiconductor device |
Feb. 19, 2008 |
| 7323414 |
Method for polishing a substrate surface |
Jan. 29, 2008 |
| 7318870 |
Method of cleaning semiconductor substrate |
Jan. 15, 2008 |
| 7319072 |
Polishing medium for chemical-mechanical polishing, and method of polishing substrate member |
Jan. 15, 2008 |
| 7316976 |
Polishing method to reduce dishing of tungsten on a dielectric |
Jan. 8, 2008 |
| 7316977 |
Chemical-mechanical planarization composition having ketooxime compounds and associated method for use |
Jan. 8, 2008 |
| 7314575 |
Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk |
Jan. 1, 2008 |
| 7312160 |
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device |
Dec. 25, 2007 |
| 7306637 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Dec. 11, 2007 |
| 7307023 |
Polishing method of Cu film and method for manufacturing semiconductor device |
Dec. 11, 2007 |
| 7303691 |
Polishing method for semiconductor wafer |
Dec. 4, 2007 |
| 7303993 |
Chemical mechanical polishing compositions and methods relating thereto |
Dec. 4, 2007 |
| 7300874 |
Chemical mechanical polishing compositions and methods relating thereto |
Nov. 27, 2007 |
| 7300877 |
Method of manufacturing a semiconductor device |
Nov. 27, 2007 |
| 7297669 |
Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
Nov. 20, 2007 |
| 7297633 |
Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection |
Nov. 20, 2007 |
| 7294516 |
Test patterns and methods of controlling CMP process using the same |
Nov. 13, 2007 |
| 7294575 |
Chemical mechanical polishing process for forming shallow trench isolation structure |
Nov. 13, 2007 |
| 7294576 |
Tunable selectivity slurries in CMP applications |
Nov. 13, 2007 |
| 7291280 |
Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7288487 |
Metal/oxide etch after polish to prevent bridging between adjacent features of a semiconductor structure |
Oct. 30, 2007 |
| 7287314 |
One step copper damascene CMP process and slurry |
Oct. 30, 2007 |
| 7288207 |
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same |
Oct. 30, 2007 |
| 7285145 |
Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces |
Oct. 23, 2007 |
| 7285496 |
Hardening of copper to improve copper CMP performance |
Oct. 23, 2007 |
| 7282383 |
Micromachine production method |
Oct. 16, 2007 |
| 7279425 |
Polishing method |
Oct. 9, 2007 |
| 7276446 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
Oct. 2, 2007 |
| 7270762 |
Polishing compositions for noble metals |
Sep. 18, 2007 |
| 7271088 |
Slurry composition with high planarity and CMP process of dielectric film using the same |
Sep. 18, 2007 |
| 7267702 |
Polishing composition |
Sep. 11, 2007 |
| 7265054 |
Chemical mechanical polishing method for manufacturing semiconductor device |
Sep. 4, 2007 |
| 7265055 |
CMP of copper/ruthenium substrates |
Sep. 4, 2007 |
| 7252782 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
Aug. 7, 2007 |
| 7250369 |
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
Jul. 31, 2007 |
| 7247567 |
Method of polishing a tungsten-containing substrate |
Jul. 24, 2007 |
| 7247566 |
CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
Jul. 24, 2007 |
| 7247557 |
Method and composition to minimize dishing |
Jul. 24, 2007 |
| 7247256 |
CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method |
Jul. 24, 2007 |
| 7246424 |
Magnetic devices having magnetic features with CMP stop layers |
Jul. 24, 2007 |
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