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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.










Patents under this class:

Patent Number Title Of Patent Date Issued
8703004 Method for chemical planarization and chemical planarization apparatus Apr. 22, 2014
8702472 Polishing composition and polishing method using the same Apr. 22, 2014
8691695 CMP compositions and methods for suppressing polysilicon removal rates Apr. 8, 2014
8685857 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device Apr. 1, 2014
8684793 Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization Apr. 1, 2014
8679980 Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process Mar. 25, 2014
8673783 Metal conductor chemical mechanical polish Mar. 18, 2014
8652295 CMP tool implementing cyclic self-limiting CM process Feb. 18, 2014
8647985 Method for polishing a substrate composed of semiconductor material Feb. 11, 2014
8637405 Silicon surface texturing method for reducing surface reflectance Jan. 28, 2014
8637404 Metal cations for initiating polishing Jan. 28, 2014
8633111 Composition for polishing surfaces of silicon dioxide Jan. 21, 2014
8632693 Wetting agent for semiconductors, and polishing composition and polishing method employing it Jan. 21, 2014
8623767 Method for polishing aluminum/copper and titanium in damascene structures Jan. 7, 2014
8623766 Composition and method for polishing aluminum semiconductor substrates Jan. 7, 2014
8617995 Manufacturing method of semiconductor device Dec. 31, 2013
8617418 Conductive film removal agent and conductive film removal method Dec. 31, 2013
8617275 Polishing agent and method for polishing substrate using the polishing agent Dec. 31, 2013
8592317 Polishing solution for CMP and polishing method using the polishing solution Nov. 26, 2013
8592316 Nitride semiconductor substrate, production method therefor and nitride semiconductor device Nov. 26, 2013
8591763 Halide anions for metal removal rate control Nov. 26, 2013
8585463 Process for producing glass substrate for information recording medium Nov. 19, 2013
8580691 Method of forming non-planar membranes using CMP Nov. 12, 2013
8568610 Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate Oct. 29, 2013
8557134 Accurately monitored CMP recycling Oct. 15, 2013
8551887 Method for chemical mechanical planarization of a copper-containing substrate Oct. 8, 2013
8546261 Slurry for polishing and planarization method of insulating layer using the same Oct. 1, 2013
8545715 Chemical mechanical polishing composition and method Oct. 1, 2013
8545712 Semiconductor wafer manufacturing method Oct. 1, 2013
8541310 CMP compositions containing a soluble peroxometalate complex and methods of use thereof Sep. 24, 2013
8541308 Polishing method and method for forming a gate Sep. 24, 2013
8540894 Polishing composition Sep. 24, 2013
8524111 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method Sep. 3, 2013
8518297 Polishing composition and polishing method using the same Aug. 27, 2013
8518135 Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks Aug. 27, 2013
8513128 Poly opening polish process Aug. 20, 2013
8513127 Chemical mechanical planarization processes for fabrication of FinFET devices Aug. 20, 2013
8513126 Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate Aug. 20, 2013
8507383 Fabrication of replacement metal gate devices Aug. 13, 2013
8506835 Cyclic self-limiting CMP removal and associated processing tool Aug. 13, 2013
8501625 Polishing liquid for metal film and polishing method Aug. 6, 2013
8501028 Method for grinding a semiconductor wafer Aug. 6, 2013
8501027 Polishing composition and polishing method Aug. 6, 2013
8497210 Shallow trench isolation chemical mechanical planarization Jul. 30, 2013
8492277 Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride Jul. 23, 2013
8492276 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Jul. 23, 2013
8491806 Chemical-mechanical polishing formulation and methods of use Jul. 23, 2013
8486169 Method of polishing a silicon-containing dielectric Jul. 16, 2013
8481428 Polishing slurry and polishing method Jul. 9, 2013
8480920 Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method Jul. 9, 2013











 
 
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