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Class Information
Number: 438/693
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.) > Utilizing particulate abradant
Description: Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611552 |
Semiconductor polishing composition |
Nov. 3, 2009 |
| 7601273 |
Polishing slurry composition and method of using the same |
Oct. 13, 2009 |
| 7597729 |
Polishing composition and polishing method using the same |
Oct. 6, 2009 |
| 7592266 |
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device |
Sep. 22, 2009 |
| 7589052 |
Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals |
Sep. 15, 2009 |
| 7585341 |
Polishing material comprising diamond clusters |
Sep. 8, 2009 |
| 7582127 |
Polishing composition for a tungsten-containing substrate |
Sep. 1, 2009 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Sep. 1, 2009 |
| 7579279 |
Method to passivate conductive surfaces during semiconductor processing |
Aug. 25, 2009 |
| 7575615 |
Process for preparing a polishing composition |
Aug. 18, 2009 |
| 7569484 |
Plasma and electron beam etching device and method |
Aug. 4, 2009 |
| 7563716 |
Polishing method |
Jul. 21, 2009 |
| 7563717 |
Method for fabricating a semiconductor device |
Jul. 21, 2009 |
| 7563718 |
Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same |
Jul. 21, 2009 |
| 7560384 |
Chemical mechanical polishing method |
Jul. 14, 2009 |
| 7557041 |
Apparatus and method for supplying chemicals |
Jul. 7, 2009 |
| 7553768 |
Substrate and a method for polishing a substrate |
Jun. 30, 2009 |
| 7550388 |
Polishing composition and polishing method |
Jun. 23, 2009 |
| 7550092 |
Chemical mechanical polishing composition |
Jun. 23, 2009 |
| 7550020 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
Jun. 23, 2009 |
| 7544618 |
Two-step chemical mechanical polishing process |
Jun. 9, 2009 |
| 7538035 |
Lapping of gold pads in a liquid medium for work hardening the surface of the pads |
May. 26, 2009 |
| 7534277 |
Slurry composition for secondary polishing of silicon wafer |
May. 19, 2009 |
| 7524346 |
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates |
Apr. 28, 2009 |
| 7524347 |
CMP composition comprising surfactant |
Apr. 28, 2009 |
| 7524475 |
Cerium oxide powder for one-component CMP slurry, preparation method thereof, one-component CMP slurry composition comprising the same, and method of shallow trench isolation using the slurry |
Apr. 28, 2009 |
| 7514364 |
Hydrophilicity treatment method of a silicon wafer |
Apr. 7, 2009 |
| 7514363 |
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use |
Apr. 7, 2009 |
| 7513920 |
Free radical-forming activator attached to solid and used to enhance CMP formulations |
Apr. 7, 2009 |
| 7504337 |
IC chip uniform delayering methods |
Mar. 17, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7501346 |
Gallium and chromium ions for oxide rate enhancement |
Mar. 10, 2009 |
| 7494929 |
Automatic gain control |
Feb. 24, 2009 |
| 7485162 |
Polishing composition |
Feb. 3, 2009 |
| 7481949 |
Polishing composition and rinsing composition |
Jan. 27, 2009 |
| 7479455 |
Method for manufacturing semiconductor wafer |
Jan. 20, 2009 |
| 7476620 |
Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
Jan. 13, 2009 |
| 7470624 |
Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensation |
Dec. 30, 2008 |
| 7459398 |
Slurry for CMP, polishing method and method of manufacturing semiconductor device |
Dec. 2, 2008 |
| 7455791 |
Abrasives for copper CMP and methods for making |
Nov. 25, 2008 |
| 7456107 |
Compositions and methods for CMP of low-k-dielectric materials |
Nov. 25, 2008 |
| 7452819 |
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
Nov. 18, 2008 |
| 7452816 |
Semiconductor processing method and chemical mechanical polishing methods |
Nov. 18, 2008 |
| 7452815 |
Methods of forming integrated circuit devices having polished tungsten metal layers therein |
Nov. 18, 2008 |
| 7452813 |
Method of manufacturing semiconductor device having planarized interlayer insulating film |
Nov. 18, 2008 |
| 7449413 |
Method for effectively removing polysilicon nodule defects |
Nov. 11, 2008 |
| 7446046 |
Selective polish for fabricating electronic devices |
Nov. 4, 2008 |
| 7442645 |
Method of polishing a silicon-containing dielectric |
Oct. 28, 2008 |
| 7439174 |
Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics |
Oct. 21, 2008 |
| 7432204 |
Wafer and the manufacturing and reclaiming methods thereof |
Oct. 7, 2008 |
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