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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7091164 |
Slurry for chemical mechanical polishing silicon dioxide |
Aug. 15, 2006 |
| 7087187 |
Meta oxide coated carbon black for CMP |
Aug. 8, 2006 |
| 7087188 |
Abrasives for chemical mechanical polishing |
Aug. 8, 2006 |
| 7087527 |
Extended kalman filter incorporating offline metrology |
Aug. 8, 2006 |
| 7087528 |
Chemical-mechanical polishing (CMP) process for shallow trench isolation |
Aug. 8, 2006 |
| 7087529 |
Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces |
Aug. 8, 2006 |
| 7087562 |
Post-CMP washing liquid composition |
Aug. 8, 2006 |
| 7083989 |
Thin-film magnetic head and method of forming the same |
Aug. 1, 2006 |
| 7084097 |
Cleaning solution for substrates of electronic materials |
Aug. 1, 2006 |
| 7081380 |
Method of forming a conductive pattern of a semiconductor device and method of manufacturing a non-volatile semiconductor memory device using the same |
Jul. 25, 2006 |
| 7081410 |
Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization |
Jul. 25, 2006 |
| 7081417 |
Manufacturing method for electronic device and multiple layer circuits thereof |
Jul. 25, 2006 |
| 7077727 |
Process for chemical-mechanical polishing of metal substrates |
Jul. 18, 2006 |
| 7078239 |
Integrated circuit structure formed by damascene process |
Jul. 18, 2006 |
| 7078343 |
Method of manufacturing compound semiconductor wafer |
Jul. 18, 2006 |
| 7078344 |
Stress free etch processing in combination with a dynamic liquid meniscus |
Jul. 18, 2006 |
| 7074664 |
Dual metal gate electrode semiconductor fabrication process and structure thereof |
Jul. 11, 2006 |
| 7074725 |
Method for forming a storage node of a capacitor |
Jul. 11, 2006 |
| 7071054 |
Methods of fabricating MIM capacitors in semiconductor devices |
Jul. 4, 2006 |
| 7071074 |
Structure and method for placement, sizing and shaping of dummy structures |
Jul. 4, 2006 |
| 7071105 |
Method of polishing a silicon-containing dielectric |
Jul. 4, 2006 |
| 7071106 |
Method for CMP removal rate compensation |
Jul. 4, 2006 |
| 7071108 |
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function |
Jul. 4, 2006 |
| 7071109 |
Methods for fabricating spatial light modulators with hidden comb actuators |
Jul. 4, 2006 |
| 7067425 |
Method of manufacturing flash memory device |
Jun. 27, 2006 |
| 7067428 |
Method for cleaning polysilicon |
Jun. 27, 2006 |
| 7067465 |
Cleaning composition useful in semiconductor integrated circuit fabricating |
Jun. 27, 2006 |
| 7067466 |
Cleaning composition useful in semiconductor integrated circuit fabrication |
Jun. 27, 2006 |
| 7064063 |
Photo-thermal induced diffusion |
Jun. 20, 2006 |
| 7064070 |
Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
Jun. 20, 2006 |
| 7060197 |
Micromechanical mass flow sensor and method for the production thereof |
Jun. 13, 2006 |
| 7060606 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
Jun. 13, 2006 |
| 7060618 |
Semiconductor device, method for manufacturing the same, and plating solution |
Jun. 13, 2006 |
| 7060620 |
Method of preparing a surface of a semiconductor wafer to make it epiready |
Jun. 13, 2006 |
| 7060621 |
Slurry for CMP, polishing method and method of manufacturing semiconductor device |
Jun. 13, 2006 |
| 7056811 |
Method for manufacturing semiconductor device |
Jun. 6, 2006 |
| 7056829 |
Polishing composition for semiconductor wafers |
Jun. 6, 2006 |
| 7056872 |
Solution composition for removing a remaining photoresist resin |
Jun. 6, 2006 |
| 7052522 |
Polishing composition and polishing method using the same |
May. 30, 2006 |
| 7052620 |
Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device |
May. 30, 2006 |
| 7052969 |
Method for semiconductor wafer planarization by isolation material growth |
May. 30, 2006 |
| 7052994 |
Method for manufacturing semiconductor device, and processing system and semiconductor device |
May. 30, 2006 |
| 7052995 |
Process of manufacturing semiconductor device including chemical-mechanical polishing |
May. 30, 2006 |
| 7052996 |
Electrochemically polishing conductive films on semiconductor wafers |
May. 30, 2006 |
| 7049237 |
Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases |
May. 23, 2006 |
| 7049238 |
Method for fabricating semiconductor device having recess |
May. 23, 2006 |
| 7049239 |
STI structure and fabricating methods thereof |
May. 23, 2006 |
| 7045450 |
Method of manufacturing semiconductor device |
May. 16, 2006 |
| 7040967 |
Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization |
May. 9, 2006 |
| 7041599 |
High through-put Cu CMP with significantly reduced erosion and dishing |
May. 9, 2006 |
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